2ADXK-S11Pulse Oximeter

制作说明： 黑白印刷，双面印刷,采用80g书写纸。 纸张大小：（宽）25.5cm*（高）39cm 折叠后的尺寸为（宽）8.5cm *（高）6.5cm。 要求字迹清晰 此页不印刷 PulseOximeter Model:S11 UserManual DowloadApp Appname:ViHealth iOS:AppStore Android:GooglePlay Notice:IfyouhaveinstalledtheApp before,pleaseupdateittothelatest version. 1.Introduction 1.1Intendeduse Thisproductisintendedtobeusedformeasuring, displayingandstoringofoxygenlevel(SpO 2 ),pulserateof adults. Thisproductisintendedforgeneralwellnessuse. Itshouldnotbeusedtodirectlydiagnoseortreatany medicalcondition. 1.2WarningsandCautions DONOTsqueezethesensorpartorapplyexcessive forceonit. DonotusethisdeviceduringMRIexamination. Donotusethisdevicewithadefibrillator. Donotstorethedeviceinthefollowinglocations: locationsinwhichthedeviceisexposedtodirect sunlight,hightemperaturesorlevelsofmoisture,or heavycontamination;locationsneartosourcesof waterorfire;orlocationsthataresubjecttostrong electromagneticinfluences. Donotusethedeviceinacombustible environment. Neversubmergethedeviceinwaterorotherliquids. Donotcleanthedevicewithacetoneorother volatilesolutions. Donotdropthisdeviceorsubjectittostrong impact. Thedeviceandaccessoriesareprovidednon-sterile. Donotplacethisdeviceinpressurevesselsorgas sterilizationdevice. Donotdismantlethedevice,asthiscouldcause damageormalfunctionsorimpedetheoperationof thedevice. Consultyourdoctorimmediatelyifyouexperience symptomsthatcouldindicateacutedisease. Donotself-diagnoseorself-medicateonthebasis ofthisdevicewithoutconsultingyourdoctor.In particular,donotstarttakinganynewmedication orchangethetypeand/ordosageofanyexisting medicationwithoutpriorapproval. Useonlycables,sensorsandotheraccessories specifiedinthismanual. Prolongedcontinuousmonitoringmayincreasethe riskofundesirablechangesinskincharacteristics, suchasirritation,reddening,blisteringorburns. Donotopenthedevicecoverwithoutauthorization. Thecovershouldonlybeopenedbyaqualified servicepersonnel. 1.3GuidetoSymbols SymbolDescription Manufacturer Dateofmanufacture Serialnumber Uniquedeviceidentifier Indicatesthattheproductshouldnotbe discardedasunsortedwastebutmustbe senttoseparatecollectionfacilitiesfor recoveryandrecycling Refertoinstructionmanual TypeBFAppliedPart Noalarmsystem MRunsafe IP22 Indicatesthattheproductisprotected againstsolidforeignobjectsof12,5mm Ø andgreater;andprotectedagainst verticallyfallingwaterdropswhen enclosuretiltedupto15 ° Indicatesthattheproductcomplieswith theapplicableFCCrequirements Non-ionizingradiation Indicatesthatthemarkeditemorits materialispartofarecoveryorrecycling process. Temperaturelimit Humiditylimitation Atmosphericpressurelimitation 1.4Unpacking Device(mainunit) RingSensor UserManual Data/ChargingCable 1.5Overview Wearthedeviceduringsleep.Itcontinuouslymonitors youroxygenlevel,heartrateandmotion.Thesmart vibrationprotectsyoufromoxygenshortage. Nextmorning,takeoffthedevice,openapptosyncdata whichwillhelpyougetsleepinsight. YoucancustomizeSmartVibrationinApptohelpyou sleepbetter. 2Usingthedevice 2.1Charging Chargethebatterybeforeusing. ConnectthedevicetoUSBofcomputerorUSBcharging adapterwiththesuppliedcable. Afterfullycharged,thedevicewillpoweroff automatically. 2.2POWERON/OFF POWERON: WeartheSensor,thedevicewillturnonautomatically. POWEROFF: Thedeviceturnsoffautomaticallyinamomentafteryou takeoffthesensor. 2.3Typicalsteps 1)START.Chargethebattery.Wearthesensorto poweron.Gotosleep. 2)STOP.Nextmorning,takeoffthesensor,the recordingwillbeoverafterthecountdown. 3)DATASYNC.Afterthecountdown,runApptosync data.ORnexttimeafteryouturnonthedevice,run Apptosync. 2.4Startworking 1)Wearthesensoronthumbfinger,indexfingeras optionincaseoftootightforthumb.Trytomove thesensoralongtheforefingertofindoutabest fit.Avoidbeingloose.Loosewearingcauses inaccuratemeasure. 2)Devicewillturnonautomatically.Afterafew seconds,thedevicewillbegintomonitor. Notice: Keepsnugenough,loosewearingmaycause inaccuratereadings. DONOTusemiddlefinger;iftootightforthumbor forefinger,trylittlefinger. Iftheworkingtimeislessthan2minute,thedata willnotbesaved. Pleaseavoidexcessivemotion. Pleaseavoidstrongambientlightcondition. 2.5Stopworking&syncdata Takeoffthesensor,thecountdownwill begin. (Iftheworkingtimeislessthan2minute,therewillbeno countdown) Duringthecountdown,ifyouwearthedeviceagain,the recordwillberesumed. Afterthecountdown,thedatawillhavebeensavedin deviceandreadytosync. Syncdata: Afterthecountdown,runApptosyncdata; ORnexttimeafteryouturnonthedevice,runApp tosync. Notice:Thebuilt-inmemorycanstore4sessions.The oldestwillbeoverwrittenbythe5th.Pleasesyncdatato yourphoneintime. 2.6Display 2.7Screenwakeup During measurement,thescreenwillgooffautomaticallyfor savingpower;youcanturnyourwristtowakeupthe screen. 2.8UnavailableSymbol Whenthissymboldisplaysondevicescreen,itindicates thereadingsisunavailablerightnow. Itmaycausedby: Excessivemovement; Poorsignal,fingeristoocold; Usually,thereadingswillrecoverinafewsecondswhen atrest. 2.9BluetoothConnection ThedeviceBluetoothwillbeenabledautomaticallyafter it’sturnedon. ToestablishaBluetoothconnection, 1)keepthedeviceBluetoothenabled. 2)MakesurethephoneBluetoothisenabled. 3)RuntheApp. Notice: DONOTPAIRinthesettingsofyoursmartphone. 2.10Addanewdevice Fortheinitialuse,youneedtoaddanewdevice. 1)Turnondevice,runApp,select<SleepU>; 2)Theninputthelast4digitsonthebackofyour device. 2.11Howtocheckbattery Afteryouturnondevice,itwilldisplaybatteryfora fewseconds. Youcanalsocheckbatteryandreal-timeSpO 2 , HeartRateinApp->Dashboard. 2.12SmartVibration ThevibratorinthesensorwillbeactivatedwhentheSpO 2 fallbelowthepre-setvalue(Threshold).Thevibrationwill stopwhentheSpO 2 recoverorbyturningyourwrist. Youcancustomizethevibrationtohelpyousleepbetter. MakesureyourdeviceisconnectedtoAppfirst.Then youcanconfigureitinApp->Profile->Mydevice. Youcanswitchonoroffthevibration. YoucanadjusttheIntensityofvibration. YoucanadjusttheThreshold.Ifthevibration disturbsyouduringsleeptoomuch,youcanlower theThreshold.Ifyouwouldliketogetmore protectionfromoxygenshortage,youcanturnu…

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ShenzhenViatomTechnologyCo.,Ltd. Address：901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,XiliStreet, NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Date:2026-01-16 FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 Ref:AttestationStatementsPart2.911(d)(7)Filing SUBJECT:FCCApplicationforFCCID:2ADXK-S11 FRN:0024194888 (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthat,asofthedateofthefilingofthe application,GOLDENVICTORYINTERNATIONALTRADINGCOLTDisourdesignatedU.S. agentforserviceofprocessfortheabovereferencedFCCID.(“ShenzhenViatomTechnology Co.,Ltd.”)acceptstomaintainanagentfornolessthanoneyearafterthegranteehas terminatedallmarketingandimportationortheconclusionofanyCommission-related proceedinginvolvingtheequipment. GOLDENVICTORYINTERNATIONALTRADINGCOLTDaccepts,asofthedateofthefiling oftheapplication,theobligationofthedesignatedU.S.agentforserviceofprocessforthe abovereferencedFCCID. DesignatedU.S.AgentInformation: Name:GOLDENVICTORYINTERNATIONALTRADINGCOLTD Address:11016THSTREETSUITE1400DENVER,CO80202UnitedStates FRN：0036377570 ContactPerson:LeonHowar Tel.:(337)255-0461 Email:[email protected] Sincerely, Signedonbehalfof（ShenzhenViatom TechnologyCo.,Ltd.） SignedonbehalfofGOLDENVICTORY INTERNATIONALTRADINGCOLTD Name:BingWangName:LeonHowar Title:ManagerTitle:Manager Date:2026-01-16Date:2026-01-16

Rev1/26/2023 (ShenzhenViatomTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:1-16-2026 Ref:AttestationStatementsPart2.911(d)(5)(i)Filing FCCID:2ADXK-S11 (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthattheequipmentforwhichauthorizationissought isnot“covered”equipmentprohibitedfromreceivinganequipmentauthorizationpursuanttosection 2.903oftheFCCrules. (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthattheequipmentforwhichauthorizationissought doesnotincludecybersecurityoranti-virussoftwareproducedorprovidedbyKasperskyLab,Inc.orany ofitssuccessorsandassignees,includingequipmentwithintegratedKasperskyLab,Inc.(oranyofits successorsandassignees)cybersecurityoranti-virussoftwarepursuanttoDA-24-886andKDB986446 D01CoveredEquipmentGuidancesectionB(2a). Deviceisinherentlycompliantbasedonhardwarelimitationsorsoftwarecontrols. or ASoftwareBillofMaterials(SBOM)isprovidedtotheTCBforreview,and Theend-userorthirdpartiescannotinstalladditionalsoftwareonthisdevice. Sincerely, (Applicantsignature): (Applicantprintedname):BingWang Rev1/26/2023 (ShenzhenViatomTechnologyCo.,Ltd.) FederalCommunicationsCommission AuthorizationandEvaluationDivision 7435OaklandMillsRoad Columbia,MD21046 USA Date:1-16-2026 Ref:AttestationStatementsPart2.911(d)(5)(ii)Filing FCCID:2ADXK-S11 (“ShenzhenViatomTechnologyCo.,Ltd.”)certifiesthat,asofthedateofthefilingoftheapplication, ShenzhenViatomTechnologyCo.,Ltd.isnotidentifiedontheCoveredList(asaspecificallynamedentity oranyofitssubsidiariesoraffiliates)asanentityproducing“covered”equipment. Sincerely, (Applicantsignature): (Applicantprintedname):BingWang

ShenzhenViatomTechnologyCo.,Ltd. Date:January16,2026 ProductModelNumber:S11 FCCID:2ADXK-S11 Towhomitmayconcern, Re:ProductCertificationRepresentativeAuthorizationLetter WeauthorizeQAILaboratoriesLtd.3980NorthFraserWay,BurnabyB.C. CanadaV5J5K5toactonourbehalfonallmattersconcerningtheabove namedequipment. Thisshallincludethefollowing: Testing Approvalapplicationsandprocedures WedeclarethatQAILaboratoriesLtd.isallowedtoforwardallinformation relatedtotheapprovalprojecttotheappliedcertificationbodyandtothe notificationentitiesandtodiscussanyissuesconcerningtheapproval application.AnyandallactscarriedoutbyQAILaboratoriesLtd.onour behalfshallhavethesameeffectasactsofourown. By: ContactListedonFCCWesbite Title:Manager Email:[email protected] Telephone:+8675586638929 Onbehalfof:ShenzhenViatomTechnologyCo.,Ltd.

ShenzhenViatomTechnologyCo.,Ltd. OfficeofEngineeringTechnology FederalCommunicationsCommission 7435OaklandMillsRoad Columbia,MD21046 USA Date:January16,2026 Subject;RequestforConfidentiality FCCID:2ADXK-S11 ToWhomItMayConcern, PursuanttotheprovisionsoftheCommission’srulesTitle47Sections§0.457and§0.459,we arerequestingtheCommissiontowithholdthefollowingattachment(s)asconfidential documentsfrompublicdisclosureindefinitely. Thesedocumentscontaindetailedsystemandequipmentdescriptionsandareconsideredas proprietaryinformationinoperationoftheequipment.Thepublicdisclosureofthese documentsmightbeharmfultoourcompanyandwouldgivecompetitorsanunfairadvantage inthemarket. SchematicDiagram BlockDiagram PartsList OperationalDescription Tune-upProcedure SoftwareSecurityRequirementsforUNIIdevices Inadditionaltoabovementioneddocuments,inordertocomplywiththemarketingregulations inTitle47CFR§2.803andtheimportationrulesinTitle47CFR§2.1204,whileensuringthat businesssensitiveinformationremainsconfidentialuntiltheactualmarketingofnewly authorizeddevices,werequestShortTermConfidentialityofthefollowingattachment(s); ExternalPhotos TestSetupPhotos InternalPhotos UserManual For45days,pursuanttoPublicNoticeDA04-1705. OR For180dayspursuanttoKDB726920D01. Itisourunderstandingthatallmeasurementtestreports,FCCIDlabelformatand correspondenceduringthecertificationreviewprocesscannotbegrantedasconfidential documentsandthisinformationwillbeavailableforpublicreviewoncethegrantofequipment authorizationisissued. Sincerely, Signature: Name:BingWang Title:Manager

1/11 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN8010F245H05 規格 DESCRIPTION ： Chip Antenna 8010 M-Ant 2.4~2.5G Type H05 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.01 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 W L T P/N: WAN8010F245H05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 8010 F 245 H 05 A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN8010F245H05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.53 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感±0.1~0.3nH、電容±0.1pF 5/11 ONEWAVE TECHNOLOGY CO., LTD. ◆ Layout Dimensions in Clearance area( Size=10.0*5.0mm ) 50 ohm transmission Line Matching Circuit ◆ Layout Dimensions in Clearance area( Size=10.0*3.0mm ) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.25 % 3.41 dBi 5.42 dBi 2450MHz 75.82 % 3.53 dBi 5.38 dBi 2500MHz 68.55 % 3.26 dBi 5.17 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10 ± 0.5 sec. 60 sec . . T E M P ( °C ) 150 °C 2 6 0 °C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradual cooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width(mm) A(mm) B(mm) C(mm) D(mm) Chip/Reel(pcs) 16 16±1.0 60±2 13.5±0.5 178±2 3000 11/11 ONEWAVE TECHNOLOGY CO., LTD. 7.Stor…

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FCCID:2ADXK-S11 EUTPHOTOSExternalPhotos FCCID:2ADXK-S11 FCCID:2ADXK-S11 FCCID:2ADXK-S11 ※※※※※ENDOFREPORT※※※※※

Pulse Oximeter Model: S11 Internal Power: 3.7V/130mAh Li-ion rechargeable Shenzhen Viatom Technology Co., Ltd. Made in ChinaFCC ID: 2ADXK-S11 R: 0.43MM *17MM *19.2MM (01)06934440102823 (11)251101 (21)25B2B00001 25B2B00001 SN 2025-11-01

FCCID:2ADXK-S11 EUTPHOTOSInternalPhotos FCCID:2ADXK-S11 ANT FCCID:2ADXK-S11 ※※※※※ENDOFREPORT※※※※※

FCCID:2ADXK-S11 RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06andpart2.1093，Unless specificallyrequiredbythepublishedRFexposureKDBprocedures,standalone1-gheador bodyand10-gextremitySARevaluationforgeneralpopulationexposureconditions,by measurementornumericalsimulation,isnotrequiredwhenthecorrespondingSARTest ExclusionThresholdcondition(s),listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Here, ForBluetooth Mode Max Power (dBm) Tune-up power (dBm) Max Power (mW) Frequency(MHz) Min. Distance (mm) Calc. thresholds limit BLE-5.23 -5±1 124805 0.310 3.0 SoaSARtestisnotrequired

ProjectNo.:ZHT-251231106W01 Page 1 of 45 Intheconfigurationtested,theEUTcompliedwiththestandardsspecifiedabove. PreparedbyReviewedby:Approvedby: LeonLi/EngineerBaretWu/DirectorLeviLee/Manager Note:ThisdevicedescribedabovehasbeentestedbyZHT,andthetestresultsshowthattheequipment undertest(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport.Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZHT, thisdocumentmaybealteredorrevisedbyZHT,personalonly,andshallbenotedintherevisionofthe document. FCCTESTREPORT FCCID:2ADXK-S11 ReportNo........................:ZHT-251231106W01 Product............................:PulseOximeter Trademark.......................:/ Model(s)...........................:S11 ModelDifference..............:/ Applicant..........................:ShenzhenViatomTechnologyCo.,Ltd. Address............................:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Manufacturer....................:ShenzhenViatomTechnologyCo.,Ltd. Address............................:901,BuildingWest,LepuTower,No.66XingkeRoad,XiliCommunity,Xili Street,NanshanDistrict,Shenzhen,518055,Guangdong,P.R.China Preparedby.....................:GuangdongZhonghanTestingTechnologyCo.,Ltd. Address............................:Room104/201,Building1,YibaolaiIndustrialPark,Qiaotou,Fuhai Subdistrict,Bao'anDistrict,Shenzhen,Guangdong,China DateofReceipt................:Dec.31,2025 DateofTest(s)................: Dec.31,2025toJan.9,2026 DateofIssue....................: Jan.9,2026 Standard .......................................... ::FCCCFRTitle47Part15SubpartCSection15.247 Testprocedure ................................ ::KDB558074D0115.247MeasGuidancev05r02 ANSIC63.10:2020 ProjectNo.:ZHT-251231106W01 Page 2 of 45 TableofContents Page 1.SUMMARYOFTESTRESULTS.............................................................................................................4 2.GENERALINFORMATION.....................................................................................................................5 2.1GENERALDESCRIPTIONOFEUT...............................................................................................5 2.2DESCRIPTIONOFTESTMODES..................................................................................................6 2.3TESTSETUPCONFIGURATION....................................................................................................7 2.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)......................................................7 3.TESTFACILITYANDTESTINSTRUMENTUSED................................................................................8 3.1TESTFACILITY...............................................................................................................................8 3.2INSTRUMENTLISTFORALLTESTITEMS..................................................................................8 3.3TESTINGSOFTWARE..................................................................................................................10 4.CHANNELBANDWIDTH......................................................................................................................11 4.1CONDUCTEDEMISSIONMEASUREMENT................................................................................11 4.1.1POWERLINECONDUCTEDEMISSIONLimits.................................................................11 4.1.2TESTPROCEDURE.............................................................................................................11 4.1.3DEVIATIONFROMTESTSTANDARD................................................................................11 5.1.4TESTSETUP........................................................................................................................12 4.1.5EUTOPERATINGCONDITIONS.........................................................................................12 4.1.6TESTRESULTS...................................................................................................................13 4.2RADIATEDEMISSIONMEASUREMENT.....................................................................................15 5.2.1RADIATEDEMISSIONLIMITS............................................................................................15 5.2.2TESTPROCEDURE.............................................................................................................16 5.2.3DEVIATIONFROMTESTSTANDARD................................................................................16 5.2.4TESTSETUP........................................................................................................................16 5.2.5EUTOPERATINGCONDITIONS.........................................................................................17 5.RADIATEDBANDEMISSIONMEASUREMENT..................................................................................21 6.1TESTREQUIREMENT:...........................................................................................................21 5.2TESTPROCEDURE................................................................................................................21 6.3DEVIATIONFROMTESTSTANDARD...................................................................................21 5.4TESTSETUP...........................................................................................................................22 5.5EUTOPERATINGCONDITIONS............................................................................................22 6.6TESTRESULT.........................................................................................................................23 6.POWERSPECTRALDENSITYTEST...................................................................................................24 6.1APPLIEDPROCEDURES/LIMIT...........................................................................................24 6.2TESTP…

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FCCID:2ADXK-S11 EUTTESTPHOTOS FCCID:2ADXK-S11 ※※※※※ENDOFREPORT※※※※※