2ADXK-S8-AWPulse Oximeter

O2RingS UserManual DownloadApp DownloadtheViHealthAppfrom iOSAppStoreorGooglePlayStore, orscantheQRcode. Notice:Ifyouhaveinstalledthe Appbefore,pleaseupdateittothe latestversion. 1. Introduction 1.1.Intendeduse ThisPulseOximeterisintendedtobeusedfor measuring,displayingandstoringofoxygenlevel (SpO2),pulserateofadultsinhomeorhealthcare facilitiesenvironment. It'snotamedicaldevice.ThisdeviceisforSports andAviationuseonlyandnotintendedformedical use. 1.2.WarningsandCautions TheOximeterisnotintendedformedicaluse. TheOximeterisnotanapneamonitorandshould notbeusedforarrhythmiaanalysis. Donotself-diagnoseorself-medicateonthebasis ofthemeasurements.Alwaysconsultyourdoctor. TheOximeterisintendedforspot-checkuseonly. DONOTsqueezethesensorpartorapply excessiveforceonit. DonotusethisdeviceduringMRIexamination. Donotusethisdevicewithadefibrillator. Donotstorethedeviceinthefollowinglocations: locationsinwhichthedeviceisexposedtodirect sunlight,hightemperaturesorlevelsofmoisture, orheavycontamination;locationsneartosources ofwaterorfire;orlocationsthataresubjectto strongelectromagneticinfluences. Donotusethedeviceinacombustible environment. Neversubmergethedeviceinwaterorother liquids. Donotcleanthedevicewithacetoneorother volatilesolutions. Donotdropthisdeviceorsubjectittostrong impact. Thedeviceandaccessoriesareprovided non-sterile. Donotplacethisdeviceinpressurevesselsorgas sterilizationdevice. Donotdismantlethedevice,asthiscouldcause damageormalfunctionsorimpedetheoperation ofthedevice. Consultyourdoctorimmediatelyifyouexperience symptomsthatcouldindicateacutedisease. Donotself-diagnoseorself-medicateonthebasis ofthisdevicewithoutconsultingyourdoctor.In particular,donotstarttakinganynewmedication orchangethetypeand/ordosageofanyexisting medicationwithoutpriorapproval. Useonlycables,sensorsandotheraccessories specifiedinthismanual. Prolongedusingmayincreasetheriskof undesirablechangesinskincharacteristics,suchas irritation,reddening,blisteringorburns. Donotopenthedevicecoverwithout authorization.Thecovershouldonlybeopenedby aqualifiedservicepersonnel. 1.3.GuidetoSymbols Symbol Description Manufacturer Dateofmanufacture SN Serialnumber Indicatesamedicaldevicethatisnot tobedisposedofasunsorted municipalwaste. FollowInstructionsforUse. TypeBFAppliedPart Noalarmsystem MRIunsafe.Presentshazardsinall MRenvironmentsasdevicecontains stronglyferromagneticmaterials. IP22Resistanttoliquidingress Thisproductcomplieswiththerules andregulationsoftheFederal CommunicationCommission. Non-ionizingradiation Thisproductcomplieswith verpackG. 1.4.Unpacking Device UserManual Data/ChargingCable 2.Overview 3.UsingtheDevice 3.1.Charging Chargethebatterybeforeusing. ConnectthedevicetocomputerUSBorUSBcharging adapterwithUSBcable. Afterfullycharged,thedevicewillpoweroff automatically. 3.2.POWERON/OFF POWERON: Wearthedevice,itwillturnonautomatically. POWEROFF: Thedeviceturnsoffautomaticallyinamomentafter youtakeitoff. 3.3.Typicalsteps 1.START.Chargethebattery.Wearthedeviceto poweron. 2.STOP.Takeoffthedevice,therecordingwillbe overafterthecountdown. 3.DATASYNC.Afterthecountdown,runApptosync data.ORnexttimeafteryouturnonthedevice,run Apptosync. 3.4.Startworking 1)Wearthedeviceonthumbfinger,indexfinger asoptionincaseoftootightforthumb.Trytomove thedevicealongtheforefingertofindoutabestfit. Avoidbeingloose.Loosewearingcausesinaccurate measure. 2)Devicewillturnonautomatically.Afterafew seconds,thedevicewillbegintomonitor. Notice: Keepsnugenough,loosewearingmaycause inaccuratereadings. DONOTusemiddlefinger;iftootightfor thumborforefinger,trylittlefinger. Iftheworkingtimeislessthan2minutes, thedatawillnotbesaved. Pleaseavoidexcessivemotion. Pleaseavoidstrongambientlightcondition. 3.5.Stopworking&syncdata Takeoffthedevice,thecountdownwillbegin. (Iftheworkingtimeislessthan2minutes,therewill benocountdown) Duringthecountdown,ifyouwear thedeviceagain,therecordwillbe resumed. Afterthecountdown,thedatawill havebeensavedindeviceandreadytosync. Syncdata: Afterthecountdown,runApptosyncdata; ORnexttimeafteryouturnonthedevice,run Apptosync. Notice:Thebuilt-inmemorycanstore4sessions.The oldestwillbeoverwrittenbythe5th.Pleasesync datatoyourphoneintime. 3.6.ScreenWakeup Thescreenwillgooffautomaticallyforsavingpower inStandardMode;youcantouchthekeyontopto wakeupthescreen. 3.7.HowtoCheckBattery Touchthekeyontop,youcanswitchdisplaybetween readingsandbattery. 3.8.UnavailableSymbol Whenthissymboldisplaysondevicescreen,it indicatesthereadingsisunavailablerightnow. Itmaycausedby: Excessivemovement; Poorsignal,fingeristoocold; Usually,thereadingswillrecoverin afewsecondswhenatrest. 3.9.BluetoothConnection ThedeviceBluetoothwillbeenabledautomatically afterit’sturnedon. ToestablishaBluetoothconnection, 1)Keepthedeviceon. 2)MakesurethephoneBluetooth isenabled. 3)RuntheAppandfollowthe on-screeninstructions. Notice:DONOTPAIRinthesettings ofyoursmartdevice. 4.PCsoftware PCSoftware:O2InsightPro Downloadfrom: https://getwellue.com/pages/pc-software InstallthesoftwareonWindows(win7/8/10)or MacOS(10.15orabove). InstallthesoftwareonPC: 1)Turnondevice,connectthedevicetoPCUSB portwiththesuppliedDataCable(it’sdifferent fromuniversalUSBcable) 2)RunthePCsoftware,clicktheDownload buttontodownloaddatafromthedevice. WiththePCsoftware,youcanviewandprintsleep report,whichcanalsobeexportedasPDForCSV files. Note:Whilethedeviceisbeingconnectedtoapp,it can’tconnecttoPCsoftware. 5. Maintenance 5.1.Time&Date AfterconnectionwithApp,devicetimewillsyncfrom yourphonetimeautomatically. 5.2.Cleaning Useasoftclothmoistenedwithwateroralcoholto cleanthedevicesurface. 6.Troubleshooting ProblemPossibleCausePossibleSolution Device doesnot turnonor no response Batterymaybe low. Chargebatteryand tryagain. Devicemightbe damaged. Pleasecontactyour localdistributor. Software exception Keepdevicein charging,touchthe keyfor8seconds. Theapp cannot findthe device TheBluetooth ofyourphoneis off. Turnonthe Bluetoothinthe phone. Thedevice Bluetoothisoff. Turnondevice ForAndr…

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ShenzhenViatomTechnologyCo.,Ltd. ···· CoveredEquipmentCertificationAttestationLetter 6/12/2024 NemkoNorthAmerica,Inc. 303RiverRoad Ottawa K1V1H2 Canada ATTN.:ReviewingEngineer FCCID:2ADXK-S8-AW ShenzhenViatomTechnologyCo.,Ltd.(“theapplicant”)certifiesthattheequipmentfor whichauthorizationissoughtisnot“covered”equipmentprohibitedfromreceivingan equipmentauthorizationpursuanttosection2.903oftheFCCrules. Note:Iftheequipmentforwhichtheapplicantseeksauthorizationisproducedby anyoftheentitiesidentifiedonthecurrentCoveredList,theapplicantshould includeanexplanationonwhytheequipmentisnot“covered”equipment. ShenzhenViatomTechnologyCo.,Ltd.(“theapplicant”)certifiesthat,asofthedateof thefilingoftheapplication,theapplicantisnotidentifiedontheCoveredListasanentity producing“covered”equipment. Signed: Printedname::BingWang Title:Manager CompanyName:ShenzhenViatomTechnologyCo.,Ltd. Date:6/12/2024

ShenzhenViatomTechnologyCo.,Ltd. * theapplicantmustdesignateacontactlocatedintheUnitedStatesforpurposesofactingasthe applicant’sagentforserviceofprocess,regardlessofwhethertheapplicantisadomesticorforeign entity.AnapplicantlocatedintheUnitedStatesmaydesignateitselfastheagentforserviceofprocess. U.S.AgentDesignationforServiceofProcess- CertificationAttestationLetter 6/12/2024 NemkoNorthAmerica,Inc. 303RiverRoad Ottawa K1V1H2 Canada ATTN.:ReviewingEngineer FCCID:2ADXK-S8-AW Persection2.911(d)(7)oftheFCCrules,ShenzhenViatomTechnologyCo.,Ltd.(“the applicant”)certifiesthattheequipmentforwhichauthorizationissoughtisdesignatedtothe followingU.S.Designatedagent*forserviceofprocess: CompanyName:GSSSERVICEINC PhysicalU.S.CompanyAddress: 6547NAcademyBlvd#2266ColoradoSpringsCOLORADO 80918UnitedStates Agentname: MichouxLogan AgentEmailAddress:[email protected] FRN:0033402082 Theabovecontactpersonacceptstheobligationforserviceofprocess. Theapplicantacceptstomaintainanagentfornolessthanoneyearafterthegranteehas terminatedallmarketingandimportationortheconclusionofanyCommission-related proceedinginvolvingtheequipment. ApplicantSigned:DesignatedAgentSigned: (Required,ifdifferenttoApplicant): Signed: Signed: Printedname:BingWangPrintedname:MichouxLogan Title:ManagerTitle:Manager Company Name: ShenzhenViatomTechnology Co.,Ltd. Company Name: GSSSERVICEINC Date:June12,2024Date:June12,2024 FRNCode:0024194888FRNCode:0033402082

ShenzhenViatomTechnologyCo.,Ltd.. June12,2024 NemkoNorthAmerica,Inc. 303RiverRoad Ottawa,Ontario,Canada K1V1H2 REQUESTFORCONFIDENTIALITY-FCC FCCID:2ADXK-S8-AW PursuanttoSections0.457(d)and0.459oftheCommission’sRulesandFCCGuidancedocument 726920,weherebyrequestpermanentconfidentialtreatmentofexhibitsidentifiedassuchinthe tablebelowandrequesttheyarepermanentlywithheldfrompublicreviewbasedonthedocuments containingtradesecretsandproprietaryinformationnotcustomarilyreleasedtothepublic.The publicdisclosureofthisinformationmightbeharmfultotheapplicantandprovideunjustifiedbenefits toitscompetitors. Wealsorequestshort-termconfidentialityoncertainexhibitsuntiltheintendeddateofmarketingas outlinedbelow.Werequesttheexhibitsbewithheldfrompublicviewforaperiodof180daysdays. Weattestmarketingoftheproductwillonlycommenceaftertheperiodofshort-termconfidentiality expires,orifmarketingistocommencebeforetherequestednumberofdayslistedabove,the granteewillinformNemkotoreleasetheShort-TermConfidentialityinformationwithheldontheFCC equipmentauthorizationwebsite. ExhibitTypeofConfidentialityRequested BlockDiagrams☒Permanent☐ShortTerm ExternalPhotos------------------☐ShortTerm InternalPhotos ☐ Permanent* ☐ShortTerm OperationDescription☒Permanent☐ShortTerm PartsList&Placement/BOM ☐Permanent ☐ShortTerm Tune-UpProcedure ☐Permanent ☐ShortTerm SchematicDiagrams☒Permanent☐ShortTerm TestSetupPhotos------------------☐ShortTerm User’sManual ☐ Permanent* ☐ShortTerm Theasteriskeditems(*)requirefurtherinformationtobeprovidedinthisjustificationletterbeforepermanentconfidentiality willbeextendedtotheseexhibits.PleaserefertoFCCKDB726920D01foundat: https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731andreviewsectionII,3)regarding specificinformationthatmustaccompanytheserequests. Note:anydocumentsheldundertheShort-Termconfidentialitywillautomaticallybecomepublic aftertherequestedtimeifanappropriateextensionrequesthasnotbeenreceived.Anyexhibits (i.e.,schematicdiagrams)thatmayhavealreadybeenrequestedtohave“Permanent” confidentialityasshownaboveneednotberepeatedunderShort-Termconfidentialityrequest. Sincerely, Signed: Printedname:BingWang Title:Manager CompanyName:ShenzhenViatomTechnologyCo.,Ltd..

FCCID:2ADXK-S8-AW EUTPHOTOS(ExternalPhotos) FCCID:2ADXK-S8-AW FCCID:2ADXK-S8-AW ※※※※※ENDOFREPORT※※※※※

DWG-215-06873-00 O2Ring_Type-C硅胶指套-已打标 ART-215-06873-01 A初版叶思芳2023.10王兵 BSN改为条形码，挪到侧面叶思芳2024.01王兵 REV.B SN号定义规则 示例：SN：23052C0001 1.23：表示年份末两位数字，23年； 2.05：表示月份两位数，05月份； 3.2C：固定为2C； 4.0001：当前时间流水码，从0001~9999； 注意：生产日期，每批次做货前跟采购确认再打印。 技术要求 1、工艺：丝印内容清晰，无断字、焦痕、文字扭曲变形、内容缺失等不良痕迹。 Pulse Oximeter Internal Power: 3.7V/110mAh Li-ion rechargeable Shenzhen Viatom Technology Co., Ltd. Charging: 5V DC, Max. 40mA 2023-05 Model: S8-AW Made in ChinaFCC ID: 2ADXK-S8-AW S N: 23052C 0001

FCCID:2ADXK-S8-AW EUTPHOTOS(InternalPhotos) FCCID:2ADXK-S8-AW FCCID:2ADXK-S8-AW FCCID:2ADXK-S8-AW ※※※※※ENDOFREPORT※※※※※ ANT

1/11 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN8010F245H05 規格 DESCRIPTION ： Chip Antenna 8010 M-Ant 2.4~2.5G Type H05 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.01 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 W L T P/N: WAN8010F245H05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 8010 F 245 H 05 A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN8010F245H05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.53 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感 ±0.1~0.3nH 、電容 ±0.1pF Important information: It is recommended to use high precision inductors ±0.1~0.3nH and capacitors ± 0.1pF for matching components 5/11 ONEWAVE TECHNOLOGY CO., LTD. ◆ Layout Dimensions in Clearance area( Size=10.0*5.0mm ) 50 ohm transmission Line Matching Circuit ◆ Layout Dimensions in Clearance area( Size=10.0*3.0mm ) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.25 % 3.41 dBi 5.42 dBi 2450MHz 75.82 % 3.53 dBi 5.38 dBi 2500MHz 68.55 % 3.26 dBi 5.17 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width…

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FCCID:2ADXK-S8-AW RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06andpart2.1093，Unless specificallyrequiredbythepublishedRFexposureKDBprocedures,standalone1-gheador bodyand10-gextremitySARevaluationforgeneralpopulationexposureconditions,by measurementornumericalsimulation,isnotrequiredwhenthecorrespondingSARTest ExclusionThresholdcondition(s),listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Here, ForBluetooth Mode Max Power (dBm) Tune-up power (dBm) Max Power (mW) Frequency(MHz) Min. Distance (mm) Calc. thresholds limit BR/EDR-5.96 -5±10.32 24025 0.0992 3.0 SoaSARtestisnotrequired

ProjectNo.:ZHT-240508022E Page 1 of 53 FCCTESTREPORT FCCID:2ADXK-S8-AW ReportNumber...................................:ZHT-240508022E DateofTest.......................................................:May08,2024toMay15,2024 Dateofissue.........................................:May15,2024 TestResult .......................................... : PASS TestingLaboratory. ........................... : GuangdongZhonghanTestingTechnologyCo.,Ltd. Address ............................................... : Room104,Building1,YibaolaiIndustrialPark,QiaotouCommunity, FuhaiStreet,Bao'anDistrict,Shenzhen,Guangdong,China Applicant'sname.............................: ShenzhenViatomTechnologyCo.,Ltd. Address...............................................:4E,Building3,TingweiIndustrialPark,No.6LiufangRoad,Block67, Xin’anStreet,BaoanDistrict,518101Shenzhen,Guangdong P.R.China Manufacturer'sname ...................... : ShenzhenViatomTechnologyCo.,Ltd. Address...............................................: 4E,Building3,TingweiIndustrialPark,No.6LiufangRoad,Block67, Xin ’ anStreet,BaoanDistrict,518101Shenzhen,Guangdong P.R.China Testspecification: Standard ................................................ : FCCCFRTitle47Part15SubpartCSection15.247 Testprocedure.....................................: KDB558074D0115.247MeasGuidancev05r02 ANSIC63.10:2013 Non-standardtestmethod................: N/A ThisdevicedescribedabovehasbeentestedbyZHT,andthetestresultsshowthattheequipmentunder test(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport. Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZHT,thisdocumentmay bealteredorrevisedbyZHT,personalonly,andshallbenotedintherevisionofthedocument. Productname ..................................... :PulseOximeter Trademark...........................................:/ Model/Typereference.........................:S8-AW ModelDifference.............................:/ Ratings .................................................. :Input:5V1A ProjectNo.:ZHT-240508022E Page 2 of 53 Testingprocedureandtestinglocation: TestingLaboratory.......................................:GuangdongZhonghanTestingTechnologyCo.,Ltd. Address............................................................:Room104,Building1,YibaolaiIndustrialPark,Qiaotou Community,FuhaiStreet,Bao'anDistrict,Shenzhen, Guangdong,China KevinYang Testedby(name+signature).......................: BaretWu Reviewer(name+signature).......................: LeviLee Approved(name+signature) ....................... : ProjectNo.:ZHT-240508022E Page 3 of 53 TableofContentsPage 1.VERSION...................................................................................................................5 2.SUMMARYOFTESTRESULTS...............................................................................6 2.1TESTFACILITY.................................................................................................................7 2.2MEASUREMENTUNCERTAINTY....................................................................................7 3.GENERALINFORMATION........................................................................................8 3.1GENERALDESCRIPTIONOFEUT.................................................................................8 3.2DESCRIPTIONOFTESTMODES....................................................................................9 3.3TESTSETUPCONFIGURATION......................................................................................9 3.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)......................................10 3.5EQUIPMENTSLISTFORALLTESTITEMS.................................................................11 4.1CONDUCTEDEMISSIONMEASUREMENT..................................................................13 4.1.1POWERLINECONDUCTEDEMISSIONLimits...................................................13 4.1.2TESTPROCEDURE...............................................................................................13 4.1.3DEVIATIONFROMTESTSTANDARD..................................................................13 4.1.4TESTSETUP...........................................................................................................14 4.1.5EUTOPERATINGCONDITIONS...........................................................................14 4.2RADIATEDEMISSIONMEASUREMENT......................................................................17 4.2.1RADIATEDEMISSIONLIMITS...............................................................................17 4.2.2TESTPROCEDURE...............................................................................................18 4.2.3DEVIATIONFROMTESTSTANDARD..................................................................18 4.2.4TESTSETUP...........................................................................................................18 4.2.5EUTOPERATINGCONDITIONS...........................................................................19 5.1TESTREQUIREMENT:..............................................................................................23 5.2TESTPROCEDURE..................................................................................................23 5.3DEVIATIONFROMTESTSTANDARD.....................................................................23 5.4TESTSETUP..............................................................................................................24 5.5EUTOPERATINGCONDITIONS..............................................................................24 5.6TESTRESULT...........................................................................................................25 6.POWERSPECTRALDENSITYTEST......................................................................26 6.1APPLIEDPROCEDURES/LIMIT.............................................................................26 6.2TESTPROCEDURE.......................................................................…

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FCCID:2ADXK-S8-AW EUTTESTPHOTOS FCCID:2ADXK-S8-AW ※※※※※ENDOFREPORT※※※※※