2ADXK-S9Pulse Oximer

O2Ring TM WearableOxygenMonitor UserManual 1.Introduction 1.1.Intendeduse Thisproductisintendedtobeusedfor measuring,displayingandstoringofpulse oxygensaturation(SpO 2 ),pulserateofadults inhomeorhealthcarefacilitiesenvironment forsleepordailyuse. Notice:Thisproductisintendedforsportsor aviationuseonly.Itshouldnotbeusedto directlydiagnoseortreatanymedical condition. 1.2.WarningsandCautions DONOTsqueezethesensorpartorapply excessiveforceonit. DonotusethisdeviceduringMRI examination. Donotusethisdevicewithadefibrillator. Donotstorethedeviceinthefollowing locations:locationsinwhichthedeviceis exposedtodirectsunlight,high temperaturesorlevelsofmoisture,orheavy contamination;locationsneartosourcesof waterorfire;orlocationsthataresubjectto strongelectromagneticinfluences. Donotusethedeviceinacombustible environment. Neversubmergethedeviceinwaterorother liquids. Donotcleanthedevicewithacetoneor othervolatilesolutions. Donotdropthisdeviceorsubjectitto strongimpact. Thedeviceandaccessoriesareprovided non-sterile. Donotplacethisdeviceinpressurevessels orgassterilizationdevice. Donotdismantlethedevice,asthiscould causedamageormalfunctionsorimpedethe operationofthedevice. Consultyourdoctorimmediatelyifyou experiencesymptomsthatcouldindicate acutedisease. Donotself-diagnoseorself-medicateonthe basisofthisdevicewithoutconsultingyour doctor.Inparticular,donotstarttakingany newmedicationorchangethetypeand/or dosageofanyexistingmedicationwithout priorapproval. Useonlycables,sensorsandother accessoriesspecifiedinthismanual. Prolongedcontinuousmonitoringmay increasetheriskofundesirablechangesin skincharacteristics,suchasirritation, reddening,blisteringorburns. Donotopenthedevicecoverwithout authorization.Thecovershouldonlybe openedbyaqualifiedservicepersonnel. 1.3.GuidetoSymbols SymbolDescription Manufacturer Dateofmanufacture SN Serialnumber Indicatesamedicaldevicethatisnot tobedisposedofasunsorted municipalwaste. FollowInstructionsforUse. TypeBFAppliedPart Noalarmsystem MRIunsafe.Presentshazardsinall MRenvironmentsasdevicecontains stronglyferromagneticmaterials. IP22Resistanttoliquidingress Thisproductcomplieswiththerules andregulationsoftheFederal CommunicationCommission. Non-ionizingradiation Thisproductcomplieswith verpackG. Temperaturelimitation Humiditylimitation Atmosphericpressurelimitation 1.4.Unpacking Device UserManual Data/ChargingCable 2.Overview 3.UsingtheDevice 3.1.Charging Chargethebatterybeforeusing. ConnectthedevicetocomputerUSBorUSB chargingadapterwithUSBcable. Afterfullycharged,thedevicewillpoweroff automatically. 3.2.POWERON/OFF POWERON: Wearthedevice,itwillturnonautomatically. POWEROFF: Thedeviceturnsoffautomaticallyinamoment afteryoutakeitoff. 3.3.Typicalsteps 1.START.Chargethebattery.Wearthedevice topoweron. 2.STOP.Takeoffthedevice,therecordingwill beoverafterthecountdown. 3.DATASYNC.Afterthecountdown,runAppto syncdata.ORnexttimeafteryouturnonthe device,runApptosync. 3.4.Startworking 1)Wearthedeviceonthumbfinger,index fingerasoptionincaseoftootightforthumb. Trytomovethedevicealongtheforefingerto findoutabestfit.Avoidbeingloose.Loose wearingcausesinaccuratemeasure. 2)Devicewillturnonautomatically.Aftera fewseconds,thedevicewillbegintomonitor. Notice: Keepsnugenough,loosewearingmaycause inaccuratereadings. DONOTusemiddlefinger;iftootightfor thumborforefinger,trylittlefinger. Iftheworkingtimeislessthan2minute, thedatawillnotbesaved. Pleaseavoidexcessivemotion. Pleaseavoidstrongambientlightcondition. 3.5.Stopworking&syncdata Takeoffthedevice,the countdownwillbegin. (Iftheworkingtimeislessthan2 minute,therewillbeno countdown) Duringthecountdown,ifyouwearthedevice again,therecordwillberesumed. Afterthecountdown,thedatawillhavebeen savedindeviceandreadytosync. Syncdata: Afterthecountdown,runApptosyncdata; ORnexttimeafteryouturnonthedevice, runApptosync. Notice:Thebuilt-inmemorycanstore4 sessions.Theoldestwillbeoverwrittenbythe 5th.Pleasesyncdatatoyourphoneintime. 3.6.ScreenWakeup Thescreenwillgooffautomaticallyforsaving powerinStandardMode;youcantouchthe keyontoptowakeupthescreen. 3.7.HowtoCheckBattery Touchthekeyontop,youcanswitchdisplay betweenreadingsandbattery. 3.8.UnavailableSymbol Whenthissymboldisplaysondevicescreen,it indicatesthereadingsisunavailablerightnow. Itmaycausedby: Excessivemovement; Poorsignal,fingeristoocold; Usually,thereadingswillrecover inafewsecondswhenatrest. 3.9.DownloadApp Appname:ViHealth iOS:AppStore Android:GooglePlay Compatibility ThedeviceiscompatiblewithiOSversions9.0+ andAndroidversions5.0+. PleaseRefertheViHealthappmanualformore details. 3.10.BluetoothConnection ThedeviceBluetoothwillbeenabled automaticallyafterit’sturnedon. ToestablishaBluetooth connection, 1)Keepthedevice Bluetoothenabled. 2)Makesurethephone Bluetoothisenabled. 3)RuntheApp. Notice:DONOTPAIRinthesettingsofyour smartdevice. 4.PCsoftware PCSoftware:O2InsightPro Downloadfrom: https://getwellue.com/pages/pc-software InstallthesoftwareonWindows(win7/8/10) orMacOS(10.15orabove). InstallthesoftwareonPC: 1)Turnondevice,connectthedevicetoPC USBportwiththesuppliedDataCable(it’s differentfromuniversalUSBcable). 2)RunthePCsoftware,clicktheDownload buttontodownloaddatafromthedevice. WiththePCsoftware,youcanviewandprint sleepreport,whichcanalsobeexportedas PDForCSVfiles. Note:whilethedeviceisbeingconnectedto app,itcan’tconnecttoPCsoftware. 5.Maintenance 5.1.Time&Date AfterconnectionwithApp,devicetimewill syncfromyourphonetimeautomatically. 5.2.Cleaning Useasoftclothmoistenedwithwateror alcoholtocleanthedevicesurface. 6.Troubleshooting ProblemPossibleCausePossibleSolution Device doesnot turnonor no response Batterymaybe low. Chargebattery andtryagain. Devicemight bedamaged. Pleasecontact yourlocal distributor. Software exception Keepdevicein charging,touch thekeyfor8 seconds. Theapp cannot findthe device TheBluetooth ofyourphone isoff. Turnonthe Bluetoothinthe phone. Thedevice Bluetoothis off. Turnondevice ForAndroid, Bluetooth cannotwork without location permission Allowlo…

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ShenzhenViatomTechnologyCo.,Ltd. ···· CoveredEquipmentCertificationAttestationLetter 6/12/2024 NemkoNorthAmerica,Inc. 303RiverRoad Ottawa K1V1H2 Canada ATTN.:ReviewingEngineer FCCID:2ADXK-S9 ShenzhenViatomTechnologyCo.,Ltd.(“theapplicant”)certifiesthattheequipmentfor whichauthorizationissoughtisnot“covered”equipmentprohibitedfromreceivingan equipmentauthorizationpursuanttosection2.903oftheFCCrules. Note:Iftheequipmentforwhichtheapplicantseeksauthorizationisproducedby anyoftheentitiesidentifiedonthecurrentCoveredList,theapplicantshould includeanexplanationonwhytheequipmentisnot“covered”equipment. ShenzhenViatomTechnologyCo.,Ltd.(“theapplicant”)certifiesthat,asofthedateof thefilingoftheapplication,theapplicantisnotidentifiedontheCoveredListasanentity producing“covered”equipment. Signed: Printedname::BingWang Title:Manager CompanyName:ShenzhenViatomTechnologyCo.,Ltd. Date:6/12/2024

ShenzhenViatomTechnologyCo.,Ltd. * theapplicantmustdesignateacontactlocatedintheUnitedStatesforpurposesofactingasthe applicant’sagentforserviceofprocess,regardlessofwhethertheapplicantisadomesticorforeign entity.AnapplicantlocatedintheUnitedStatesmaydesignateitselfastheagentforserviceofprocess. U.S.AgentDesignationforServiceofProcess- CertificationAttestationLetter 6/12/2024 NemkoNorthAmerica,Inc. 303RiverRoad Ottawa K1V1H2 Canada ATTN.:ReviewingEngineer FCCID:2ADXK-S9 Persection2.911(d)(7)oftheFCCrules,ShenzhenViatomTechnologyCo.,Ltd.(“the applicant”)certifiesthattheequipmentforwhichauthorizationissoughtisdesignatedtothe followingU.S.Designatedagent*forserviceofprocess: CompanyName:GSSSERVICEINC PhysicalU.S.CompanyAddress: 6547NAcademyBlvd#2266ColoradoSpringsCOLORADO 80918UnitedStates Agentname: MichouxLogan AgentEmailAddress:[email protected] FRN:0033402082 Theabovecontactpersonacceptstheobligationforserviceofprocess. Theapplicantacceptstomaintainanagentfornolessthanoneyearafterthegranteehas terminatedallmarketingandimportationortheconclusionofanyCommission-related proceedinginvolvingtheequipment. ApplicantSigned:DesignatedAgentSigned: (Required,ifdifferenttoApplicant): Signed: Signed: Printedname:BingWangPrintedname:MichouxLogan Title:ManagerTitle:Manager Company Name: ShenzhenViatomTechnology Co.,Ltd. Company Name: GSSSERVICEINC Date:June12,2024Date:June12,2024 FRNCode:0024194888FRNCode:0033402082

ShenzhenViatomTechnologyCo.,Ltd.. June12,2024 NemkoNorthAmerica,Inc. 303RiverRoad Ottawa,Ontario,Canada K1V1H2 REQUESTFORCONFIDENTIALITY-FCC FCCID:2ADXK-S9 PursuanttoSections0.457(d)and0.459oftheCommission’sRulesandFCCGuidancedocument 726920,weherebyrequestpermanentconfidentialtreatmentofexhibitsidentifiedassuchinthe tablebelowandrequesttheyarepermanentlywithheldfrompublicreviewbasedonthedocuments containingtradesecretsandproprietaryinformationnotcustomarilyreleasedtothepublic.The publicdisclosureofthisinformationmightbeharmfultotheapplicantandprovideunjustifiedbenefits toitscompetitors. Wealsorequestshort-termconfidentialityoncertainexhibitsuntiltheintendeddateofmarketingas outlinedbelow.Werequesttheexhibitsbewithheldfrompublicviewforaperiodof180daysdays. Weattestmarketingoftheproductwillonlycommenceaftertheperiodofshort-termconfidentiality expires,orifmarketingistocommencebeforetherequestednumberofdayslistedabove,the granteewillinformNemkotoreleasetheShort-TermConfidentialityinformationwithheldontheFCC equipmentauthorizationwebsite. ExhibitTypeofConfidentialityRequested BlockDiagrams☒Permanent☐ShortTerm ExternalPhotos------------------☐ShortTerm InternalPhotos ☐ Permanent* ☐ShortTerm OperationDescription☒Permanent☐ShortTerm PartsList&Placement/BOM ☐Permanent ☐ShortTerm Tune-UpProcedure ☐Permanent ☐ShortTerm SchematicDiagrams☒Permanent☐ShortTerm TestSetupPhotos------------------☐ShortTerm User’sManual ☐ Permanent* ☐ShortTerm Theasteriskeditems(*)requirefurtherinformationtobeprovidedinthisjustificationletterbeforepermanentconfidentiality willbeextendedtotheseexhibits.PleaserefertoFCCKDB726920D01foundat: https://apps.fcc.gov/oetcf/kdb/forms/FTSSearchResultPage.cfm?switch=P&id=41731andreviewsectionII,3)regarding specificinformationthatmustaccompanytheserequests. Note:anydocumentsheldundertheShort-Termconfidentialitywillautomaticallybecomepublic aftertherequestedtimeifanappropriateextensionrequesthasnotbeenreceived.Anyexhibits (i.e.,schematicdiagrams)thatmayhavealreadybeenrequestedtohave“Permanent” confidentialityasshownaboveneednotberepeatedunderShort-Termconfidentialityrequest. Sincerely, Signed: Printedname:BingWang Title:Manager CompanyName:ShenzhenViatomTechnologyCo.,Ltd..

FCCID:2ADXK-S9 EUTPHOTOS(ExternalPhotos) FCCID:2ADXK-S9 FCCID:2ADXK-S9 ※※※※※ENDOFREPORT※※※※※

DWG-215-02781-00 Pulse Oximeter血氧仪液态指套-打标 ART-215-07503-00 Pulse Oximeter Model: S9 Internal Power: 3.7V/110mAh Li-ion rechargeable Shenzhen Viatom Technology Co., Ltd. 初版 A 20240321王兵叶思芳 Charging: 5V DC, Max. 40mA 2023-05 技术要求 1.工艺：内容清晰，无断字、焦痕、文字扭曲变形、内容缺失等不良痕迹。 2.SN号: 2305 2C 0001(示意SN号，与正式SN号略有不同) 前4位为年月后4位为产品的流水号 2023-05 3.生产日期保持与SN号日期一致。 S N: 23052C 0001 型号规格：S9/PO2/液态硅胶/打标 Made in ChinaFCC ID: 2ADXK-S9

FCCID:2ADXK-S9 EUTPHOTOS(InternalPhotos) FCCID:2ADXK-S9 FCCID:2ADXK-S9 ANT FCCID:2ADXK-S9 ※※※※※ENDOFREPORT※※※※※

1/11 承 認 書 SPECIFICATION FOR APPROVAL 客戶名稱 CUSTOMER ： 客戶料號 CUSTOMER’S P/N ： 料號 PART NUMBER ： WAN8010F245H05 規格 DESCRIPTION ： Chip Antenna 8010 M-Ant 2.4~2.5G Type H05 版本 VERSION ： V1.1 日期 ISSUE DATE ： 2021/03/03 客 戶 承 認 CUSTOMER APPROVED 工 程 部 R&D CENTER 承 認 APPROVAL 確 認 CHECKED 製 作 DRAWN Ray Tennyson Snow 萬誠科技股份有限公司 OneWave Electronic Co., Ltd. 112台北市北投區立功街151號1樓 1F, No. 151, Li Gong Street, Beitou District, Taipei City 112, Taiwan 電話: (02) 2898-2220 TEL: +886 2 2898-2220 傳真: (02) 2898-5055 FAX: +886 2 2898-5055 2/11 ONEWAVE TECHNOLOGY CO., LTD. 8010 Chip antenna For Bluetooth / WLAN Applications Dimension (mm) L 8.01 ± 0.20 W 1.03 ± 0.20 T 1.25 ± 0.20 W L T P/N: WAN8010F245H05 3/11 ONEWAVE TECHNOLOGY CO., LTD. Part Number Information WAN 8010 F 245 H 05 A B C D E F A Product Series Antenna B Dimension L x W 8.0X1.0mm (+-0.2mm) C Material High K material D Working Frequency 2.4 ~ 2.5GHz E Feeding mode Monopole & Single Feeding F Antenna type Type = 05 1. Electrical Specification Remark : Bandwidth & Peak Gain was measured under evaluation board of next page Specification Part Number WAN8010F245H05 Central Frequency 2450 MHz Bandwidth 100 (Min.) MHz Return Loss -10 (Max) dB Peak Gain 3.53 dBi Impedance 50 Ohm Operating Temperature -40～+110 °C Maximum Power 4 W Resistance to Soldering Heats 10 ( @ 260°C) sec. Polarization Linear Azimuth Beamwidth Omni-directional Termination Cu / Sn (Leadless) 4/11 ONEWAVE TECHNOLOGY CO., LTD. 2. Recommended PCB Pattern Evaluation Board Dimension Unit : mm Suggested Matching Circuit 重要資訊 : 匹配元件建議使用精準度高的電感 ±0.1~0.3nH 、電容 ±0.1pF Important information: It is recommended to use high precision inductors ±0.1~0.3nH and capacitors ± 0.1pF for matching components 5/11 ONEWAVE TECHNOLOGY CO., LTD. ◆ Layout Dimensions in Clearance area( Size=10.0*5.0mm ) 50 ohm transmission Line Matching Circuit ◆ Layout Dimensions in Clearance area( Size=10.0*3.0mm ) 50 ohm transmission Line Matching Circuit FootPrint (Unit : mm) 6/11 ONEWAVE TECHNOLOGY CO., LTD. 3. Measurement Results Return Loss 7/11 ONEWAVE TECHNOLOGY CO., LTD. Radiation Pattern Efficiency Peak Gain Directivity 2400MHz 69.25 % 3.41 dBi 5.42 dBi 2450MHz 75.82 % 3.53 dBi 5.38 dBi 2500MHz 68.55 % 3.26 dBi 5.17 dBi Chamber Coordinate System Y Z X 8/11 ONEWAVE TECHNOLOGY CO., LTD. 4.Reliability and Test Condictions ITEM REQUIREMENTS TEST CONDITION Solderability 1. Wetting shall exceed 90% coverage 2. No visible mechanical damage Pre-heating temperature:150°C/60sec. Solder temperature:230±5°C Duration:4±1sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Solder heat Resistance 1. No visible mechanical damage 2. Central Freq. change :within ± 6% 10±0.5 sec. 60sec .. TEMP (°C) 150°C 260°C Pre-heating temperature:150°C/60sec. Solder temperature:260±5°C Duration:10±0.5sec. Solder:Sn-Ag3.0-Cu0.5 Flux for lead free: rosin Component Adhesion (Push test) 1. No visible mechanical damage The device should be reflow soldered(230±5°C for 10sec.) to a tinned copper substrate A dynometer force gauge should be applied the side of the component. The device must with-ST-F 0.5 Kg without failure of the termination attached to component. Component Adhesion (Pull test) 1. No visible mechanical damage Insert 10cm wire into the remaining open eye bend ,the ends of even wire lengths upward and wind together. Terminal shall not be remarkably damaged. Thermal shock 1. No visible mechanical damage 2. Central Freq. change :within ±6% Phase Temperature(°C) Time(min) 1 +110±5°C 30±3 2 Room Temperature Within 3sec 3 -40±2°C 30±3 4 Room Temperature Within 3sec +110°C=>30±3min -40°C=>30±3min Test cycle:10 cycles The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to High Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: +110±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Resistance to Low Temperature 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature:-40±5°C Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. Humidity 1. No visible mechanical damage 2. Central Freq. change :within ±6% 3. No disconnection or short circuit. Temperature: 40±2°C Humidity: 90% to 95% RH Duration: 1000±12hrs The chip shall be stabilized at normal condition for 2~3 hours before measuring. 4±1 sec. 60sec TEMP (°C) 150°C 230°C 9/11 ONEWAVE TECHNOLOGY CO., LTD. 5.Soldering and Mounting Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150°C ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧280°C tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 3 sec. SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) 60~120 s 10s max. 30~60s 250~260 230 180 150 TIME(sec.) Reflow Soldering SOLDERING COOLING NATURAL PRE-HEATING TEMPERATURE(°C) within 3s Gradualcooling 150 TIME(sec.) Iron Soldering Over 60s 350 300 10/11 ONEWAVE TECHNOLOGY CO., LTD. 6.Packaging Information ◆ Tape Specification: W Ao Bo Ko P F E D D1 Po P2 t 16.0 ±0.30 1.30 ±0.10 8.30 ±0.10 1.40 ±0.10 4.00 ±0.10 7.50 ±0.10 1.75 ±0.10 1.50 ±0.10 0.00 ±0.10 4.00 ±0.10 2.00 ±0.10 0.30 ±0.05 ◆ Reel Specification: (7’’, Φ180 mm) Tape Width…

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FCCID:2ADXK-S9 RFExposureEvaluation AccordingtoKDB447498D01GeneralRFExposureGuidancev06andpart2.1093，Unless specificallyrequiredbythepublishedRFexposureKDBprocedures,standalone1-gheador bodyand10-gextremitySARevaluationforgeneralpopulationexposureconditions,by measurementornumericalsimulation,isnotrequiredwhenthecorrespondingSARTest ExclusionThresholdcondition(s),listedbelow,is(are)satisfied. For100MHzto6GHzandtestseparationdistances≤50mm,the1-gand10-gSARtest exclusionthresholdsaredeterminedbythefollowing: [(max.powerofchannel,includingtune-uptolerance,mW)/(min.testseparationdistance, mm)]·[√f (GHz) ]≤3.0for1-gSAR,and≤7.5for10-gextremitySAR,where f (GHz) istheRFchanneltransmitfrequencyinGHz PoweranddistanceareroundedtothenearestmWandmmbeforecalculation Theresultisroundedtoonedecimalplaceforcomparison Here, ForBluetooth Mode Max Power (dBm) Tune-up power (dBm) Max Power (mW) Frequency(MHz) Min. Distance (mm) Calc. thresholds limit BR/EDR-9.11 -9±10.16 24805 0.0504 3.0 SoaSARtestisnotrequired

ProjectNo.:ZHT-240508024E Page 1 of 53 FCCTESTREPORT FCCID:2ADXK-S9 ReportNumber...................................:ZHT-240508024E DateofTest.......................................................:May08,2024toMay15,2024 Dateofissue.........................................:May15,2024 TestResult .......................................... : PASS TestingLaboratory. ........................... : GuangdongZhonghanTestingTechnologyCo.,Ltd. Address ............................................... : Room104,Building1,YibaolaiIndustrialPark,QiaotouCommunity, FuhaiStreet,Bao'anDistrict,Shenzhen,Guangdong,China Applicant'sname.............................: ShenzhenViatomTechnologyCo.,Ltd. Address...............................................:4E,Building3,TingweiIndustrialPark,No.6LiufangRoad,Block67, Xin’anStreet,BaoanDistrict,518101Shenzhen,Guangdong P.R.China Manufacturer'sname ...................... : ShenzhenViatomTechnologyCo.,Ltd. Address...............................................: 4E,Building3,TingweiIndustrialPark,No.6LiufangRoad,Block67, Xin ’ anStreet,BaoanDistrict,518101Shenzhen,Guangdong P.R.China Testspecification: Standard ................................................ : FCCCFRTitle47Part15SubpartCSection15.247 Testprocedure.....................................: KDB558074D0115.247MeasGuidancev05r02 ANSIC63.10:2013 Non-standardtestmethod................: N/A ThisdevicedescribedabovehasbeentestedbyZHT,andthetestresultsshowthattheequipmentunder test(EUT)isincompliancewiththeFCCrequirements.Anditisapplicableonlytothetestedsample identifiedinthereport. Thisreportshallnotbereproducedexceptinfull,withoutthewrittenapprovalofZHT,thisdocumentmay bealteredorrevisedbyZHT,personalonly,andshallbenotedintherevisionofthedocument. Productname ..................................... :PulseOximeter Trademark...........................................:/ Model/Typereference.........................:S9 ModelDifference.............................:/ Ratings .................................................. :Input:5V1A ProjectNo.:ZHT-240508024E Page 2 of 53 Testingprocedureandtestinglocation: TestingLaboratory.......................................:GuangdongZhonghanTestingTechnologyCo.,Ltd. Address............................................................:Room104,Building1,YibaolaiIndustrialPark,Qiaotou Community,FuhaiStreet,Bao'anDistrict,Shenzhen, Guangdong,China KevinYang Testedby(name+signature).......................: BaretWu Reviewer(name+signature).......................: LeviLee Approved(name+signature) ....................... : ProjectNo.:ZHT-240508024E Page 3 of 53 TableofContentsPage 1.VERSION...................................................................................................................5 2.SUMMARYOFTESTRESULTS...............................................................................6 2.1TESTFACILITY.................................................................................................................7 2.2MEASUREMENTUNCERTAINTY....................................................................................7 3.GENERALINFORMATION........................................................................................8 3.1GENERALDESCRIPTIONOFEUT.................................................................................8 3.2DESCRIPTIONOFTESTMODES....................................................................................9 3.3TESTSETUPCONFIGURATION......................................................................................9 3.4DESCRIPTIONOFSUPPORTUNITS(CONDUCTEDMODE)......................................10 3.5EQUIPMENTSLISTFORALLTESTITEMS.................................................................11 4.1CONDUCTEDEMISSIONMEASUREMENT..................................................................13 4.1.1POWERLINECONDUCTEDEMISSIONLimits...................................................13 4.1.2TESTPROCEDURE...............................................................................................13 4.1.3DEVIATIONFROMTESTSTANDARD..................................................................13 4.1.4TESTSETUP...........................................................................................................14 4.1.5EUTOPERATINGCONDITIONS...........................................................................14 4.2RADIATEDEMISSIONMEASUREMENT......................................................................17 4.2.1RADIATEDEMISSIONLIMITS...............................................................................17 4.2.2TESTPROCEDURE...............................................................................................18 4.2.3DEVIATIONFROMTESTSTANDARD..................................................................18 4.2.4TESTSETUP...........................................................................................................18 4.2.5EUTOPERATINGCONDITIONS...........................................................................19 5.1TESTREQUIREMENT:..............................................................................................23 5.2TESTPROCEDURE..................................................................................................23 5.3DEVIATIONFROMTESTSTANDARD.....................................................................23 5.4TESTSETUP..............................................................................................................24 5.5EUTOPERATINGCONDITIONS..............................................................................24 5.6TESTRESULT...........................................................................................................25 6.POWERSPECTRALDENSITYTEST......................................................................26 6.1APPLIEDPROCEDURES/LIMIT.............................................................................26 6.2TESTPROCEDURE.............................................................................…

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FCCID:2ADXK-S9 FCCID:2ADXK-S9 EUTTESTPHOTOS FCCID:2ADXK-S9 ※※※※※ENDOFREPORT※※※※※