MZVIP-160IP DECT Phone

IP Phone environment. This base should be installed and operated with a minimum distance of 20 Interference Information This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference; and (2) This device must accept any interference received, including interference that may cause undesired operation. Privacy of communications may not be ensured when using this phone. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communica- tions. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna (that is, the antenna for radio or television that is “receiving” the interference). • Reorient or relocate and increase the separation between the telecommunications equipment and Receiver. • Connect the telecommunications equipment into an outlet on a circuit different from that to which the receiving antenna is connected. If these measures do not eliminate the interference, please consult your dealer or an experienced radio/television technician for additional suggestions. Also, the Federal Communications Commission has prepared a helpful boOKlet, “How To Identify and Resolve Radio/TV Interference Problems. This booklet is available from the U.S. Government Printing Office, Washington, D.C. 20402. Please specify stock number 004-000-00345-4 when ordering copies. Warning: The changes or modifications not expressly approved by the party responsible for compli- ance could void the user’s authority to operate the equipment. The RCA IP160 phone is designed for business environment use. It is a full-featured SIP solution, interoperable with most IP PBX and VoIP providers. Please read through the instruction booklet before you get started to better understand the features of the IP160. FCC RF Radiation Exposure Statement This equipment complies with FCC RF radiation exposure limits set forth for an uncontrolled centimeters between the radiator and your body. This transmitter must not be co-located or oper- ated in conjunction with any other antenna or transmitter.” This is a class B device, in a domestic environment; this product may cause radio interference, in which case the user may be required to take adequate measures. To avoid the potential effects on the environment and human health as a result of the presence of hazardous substances in electri- cal and electronic equipment, end users of electrical and electronic equipment should understand the meaning of the crossed-out wheeled bin symbol. Do not dispose of WEEE as unsorted munici- pal waste and have to collect such WEEE separately. FCC Part 68 and ACTA Customer Information 1. This equipment complies with Part 68 of the FCC rules and the requirements adopted by the ACTA. On the bottom of this equipment is a label that contains, among other information, a product identifier in the format US:3F8IPNANIP160. If requested, this number must be provided to the telephone company. 2. A plug and jack used to connect this equipment to the premises wiring and telephone network must comply with the applicable FCC Part 68 rules and requirements adopted by the ACTA. A compliant telephone cord and modular plug is provided with this product. It is designed to be connected to a compatible modular jack that is also compliant. See installation instructions for details. 3. If this equipment [US: 3F8IPNANIP160] causes harm to the telephone network, the telephone company will notify you in advance that temporary discontinuance of service may be required. But if advance notice isn't practical, the telephone company will notify the customer as soon as possible. Also, you will be advised of your right to file a complaint with the FCC if you believe it is necessary. 4. The telephone company may make changes in its facilities, equipment, operations or procedures that could affect the operation of the equipment. If this happens the telephone company will provide advance notice in order for you to make necessary modifications to maintain uninterrupted service. 5. If trouble is experienced with this equipment [US: 3F8IPNANIP160 ], for repair or warranty information, Service can be facilitated through our office at: U.S. Agent Company name: Telefield NA Inc Address: Tel: Fax: If the equipment is causing harm to the telephone network, the telephone company may request that you disconnect the equipment until the problem is resolved. 6. Please follow instructions for repairing if any (e.g. battery replacement section); otherwise do not alternate or repair any parts of device except specified. 7. Connection to party line service is subject to state tariffs. Contact the state public utility commission, public service commission or corporation commission for information. 8. If your home has specially wired alarm equipment connected to the telephone line, ensure the installation of this [3F8IPNANIP160] does not disable your alarm equipment. If you have questions about what will disable alarm equipment, consult your telephone company or a qualified installer. a) If the telephone company requests information on what equipment is connected to their lines, inform them of: b) The ringer equivalence number [NAN] 4915 SW Griffith Dr. #302 Beaverton, Or 97005 1-800-511-3180 +503-626-6349 c) The USOC jack r…

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RF INTERFACE ETHERNET SC14452 SDRAM KEY LED LED1 RX TX JTAG SCL SDA OSC Y1 10.368MHz XIN XOUT RF_TDO RF_RDIRF_SKRF_SIORF_CLK RF_RSTN RF ANT0 IP160S_BASE_BLOCK DIAGRAM KEY BOARD U5 ETHERNET Switch ANT1 KSZ8041RNL RF_LE FLASH SCL SDA Adaptor DC5V POE POWER LMX4181 UART APU RF_TXD_EN DCDC conversion SPI INTERFACE GPIO INTERFACE D/A INTERFACE OSC Y2 25MHz POWER SUPPLY RJ45 Transformer U7 U8 Y1 U2 U4 U1 D2 1N4001 D1 SS34

FCC Part 15D – APPLICATION FORM & SELF-DECLARATION Applicant Name Telefield Ltd. Address Flat D,2/F.,Valiant Industrial Centre, 2-12 Au Pui Wan Street,Fo Tan,N.T.,Hong Kong. Contact person Ho Wing Cheong Telephone No. 852 26052811 Fax No. 852 30078968 Manufacturer Name Skymotion Technology (Hong Kong) Limited Address Unit 2603, 26/F, Metropole Square, 2 On Yiu Street, Shatin, N.T. Hong Kong PP FP FCC ID MZVIP-160 MZVIP-160 Model Number(s) IP060; IP060X XX-X; IP060X; IP060XX; IP060XXX Note: “X” shall consist of a series of Arabic numerals, capital letters or a combination thereof. IP160; IP160XXX-X; IP160X; IP160XX; IP160 XXX; Note: “X” shall consist of a series of Arabic numerals, capital letters or a combination thereof. HW version Handset_V0.4 MB_V0.4 SW version V364 V1110 Antenna Type Monopole Antenna Monopole Antenna Max, Antenna Gain(dBi) 0dBi 0dBi Mains Power Voltage Adapter Input AC100~240V Adapter Output DC 5V FP Inport DC 5V Battery Voltage DC 2.4V Number of channels 5 Carrier frequency(MHz) 1921.536 1923.2641924.9921926.720 1928.446 Nominal Receive Bandwidth +/-500kHz Frame period(ms) 24time slots within 10 seconds. First 12 slots for PP transmit and next 12 slots for FP transmit Timeslot Plan 24 timeslots per frame. First 12 timeslots used for PP transmissions and other 12 timeslots used for FP transmissions. Operating Temperature Range( 。 C) Min -10 °C Max 40 °C Does a system built with the EUT that implement the provisions of 47CFR 15.323(c) (5) enabling the use of the upper threshold for deferral? Ye s No According to 47CFR 15.323(c) (5).4, does your model not use bandwidth in further cooperation with other devices at any range? Yes No Does a system built using the EUT that operate under the provisions of 47CFR 25.323(c) (6) incorporating provisions for waiting for a channel to clear? Yes No According to 47CFR 15.323(c) (8), does EUT use the same antennas for transmission and reception as for monitoring? Yes No Does a system built with the EUT that operate under the provisions of 47CFR 15.323(c) (10) to test for deferral only in conjunction with a companion device? Yes No Does a system built using the EUT that operate under the provisions of 47CFR 15.323(c) (11) enabling the access criteria check on the receive channel while in the presence of collocated interferers? Yes No According to 47CFR 15.323(c) (12), does EUT not work in a mode with denies fair access to spectrum for other devices. Yes No Does you model have the monitoring made through the radio receiver used for communication? Yes No Does your model transmit control and signaling channels? Yes No According to 47CFR 15.307(b), does the applicant have the affidavit from UTAM Inc.? Yes No According to 47CFR 15.319(b), do all transmissions use only digital modulation techniques? Yes No According to FCC Part 15.319(f) Automatic Discontinuation of Transmissions The device shall automatically discontinue transmission in case of either absence of information to transmit of operational failure , he provisions in this section are not intended to preclude transmission of control and signaling information or use of repetitive codes used by certain digital technologies to complete frame or burst intervals . Ye s No The provisions within the EUT for self-check, by which compliance with 47CFR 15.319(f) is obtained. A – Connection break down, cease of transmit B – Connection break down, EUT transmits its signaling information C – Connection break down, compare device transmits signaling information N – Not possible Situation Reaction of EUT FP PP Switch-off compare device B A Hook-on by compare device B N Switch-off by EUT A A Hook-on at EUT side N A Remove Power from EUT A A Remove Power from compare device B A Date: 2013-1-23 Title: Serior Engineering Manager Signature:

EXHIBIT B - EUT EXTERNAL PHOTOGRAPHS EUT (Base) – Front View EUT (Base) – Rear View EUT (Base) – Top View EUT (Base) – Bottom View EUT (Base) – Left Side View EUT (Base) – Right Sdie View EUT (Base) – Adapter View EUT (Base) – Adapter Label View

EXHIBIT A - FCC ID LABELING AND LOCATION FCC ID Label FCC ID Label Location The label shown shall be permanently affixed at a conspicuous location on the device and be readily visible to the user at the time purchase (Labeling requirements per 2.925)

EXHIBIT C - EUT INTERNAL PHOTOGRAPHS EUT (Base) – Cover off View EUT (Base) – Main Board Top View EUT (Base) – Main Board Top Shielding off View EUT (Base) –Main Board Bottom View Antenna Location EUT (Base) – Switch Board Top View EUT (Base) – Switch Board Bottom View EUT (Base) – Antenna View

IP160S Circuit Description: IP160S VOIP DECT consists of Handset and Base Unit. A single Base can accommodate up to 6 Handsets. Following are the circuit description of Handset and Base Unit. VOIP DECT Base The Core of the VOIP DECT base is the VOIP digital baseband chip (U5 SC14452) from Dialog Semiconductor. It provide interfaces to LAN chips (U2 network PHY chip KS8051RNL through MMI digital interface), DECT RF module (LMX4181), SDRAM chips (U7 MT48LC32M16), Flash Chip (U8 W25Q128BV), DCDC Power Supply U4. Circuit Operation: Unit is powered up through AC-DC adaptor that provides 5V output. The system can be powered from 5V AC-DC adaptor or POE (Power-Over-Ethernet) circuit U1. Priority is POE when the network router has POE power supply. When power supply is steady, VOIP baseband chip will load bootloader from the Flash chip. This bootloader will initialize all Hardware configuration and then further load u-boot from the Flash that is for preparing the environment for uC-Linux. Finally uC-Linux is load and then the file system is initialized and mounted. System is then ready to operate. For the DECT functionality, RF front end is the RF module with RF chip LMX4181. LMX4181 interface to the burst mode controller of U5 SC14452 which provide all DECT protocol for communicating with remote DECT Handsets. The system can support CATiQ and provide SWUOTA (Software Upgrade Over The Air) service to remote handset. VOIP Handset The core of the Handset is a DECT RF and digital baseband chip DCX79EF0CF. It provides DECT RF communication with VOIP DECT Base. Radio Frequency is DECT 6.0 from 1920 MHz to 930 MHz. The handset also consists of a Color LCD (LCD1) display with resolution of 176x220 pixels, 2.0 inches diagonal. There is a DCDC boosting circuit (U4) for Speaker Amplifier (U5) which drives a 36mm paper cone speaker. Wideband audio is provided through HSSPOUTP and HSSPOUTN differential output for receive and MIP and MIN for microphone input. There is a Headset Jack that provides analog audio interface to external headset. There is a key matrix that provide input interface to let the user to interface with the MMI to provide dialing function and other software function like: miss call browsing, phone book browsing.

Bay Area Compliance Laboratories Corp. (Shenzhen) Report No.: R1DG121231001-00FP FCC Part 15D Page 9 of 53 FCC§ 15.319 (i) &2.1091 - RF RADIATION EXPOSURE Limit According to FCC §15.319(i) and §1.1307(b)(1), systems operating under the provisions of this section shall be operated in a manner that ensures that the public is not exposed to radio frequency energy level in excess of the Commission’s guidelines. Limits for Maximum Permissible Exposure (MPE) (§1.1310, §2.1091) Frequency Range (MHz) Electric Field Strength (V/m) Magnetic Field Strength (A/m) Power Density (mW/cm2) Averaging Time (minute) Limits for General Population/Uncontrolled Exposure 0.3-1.34 614 1.63 *(100) 30 1.34-30 842/f 2.19/f *(180/f\2\) 30 30-300 27.5 0.073 0.2 30 300-1500 / / f/1500 30 1500-100,000 / / 1.0 30 f = frequency in MHz * = Plane-wave equivalent power density MPE Calculation Predication of MPE limit at a given distance S = PG/4R 2 Where: S = power density (in appropriate units, e.g. mW/cm 2 ); P = power input to the antenna (in appropriate units, e.g., mW); G = power gain of the antenna in the direction of interest relative to an isotropic radiator R = distance to the center of radiation of the antenna (appropriate units, e.g., cm); Antenna Gain Conducted Power Frequency (MHz) (dBi) (numeric) (dBm) (mW) Evaluation Distance (cm) Power Density (mW/cm2) MPE Limit (mW/cm 2 ) 1921.536 0 1.0 17.76 59.70 20 0.011877 1 1924.992 0 1.0 17.42 55.21 20 0.010984 1 1928.448 0 1.0 17.22 52.72 20 0.010488 1 Result: The device meets MPE limit at 20 cm distance.

JTAG IP160S Base Main board Power amber LED Ring indicator blue LED To FXO CIRCUIT top bottem Y1 10,368MHz J2 NC/HDR1x3 C25 100nF C9 100nF C26 100nF C27 100nF C28 100nF C29 100nF C10 100nF C34 100nF C31 100nF C11 100nF C32 100nF C16 100nF C21 22pF C19 220nF C35 1uF C18 1uF R2 100R R110 1K R44 100K R45 NC R43 NC C22 100nF C23 100nF C24 100nF LP1 FB 220 OHM 2A C17 10uF C20 15pF RP5-C 33R RP5-A 33R RP9-A 33R RP11-B 33R RP11-C 33R RP16-C 33R RP16-B 33R RP16-A 33R RP9-B 33R RP9-C 33R RP9-D 33R RP10-A 33R RP10-B 33R RP10-C 33R RP10-D 33R RP11-A 33R R173 1K 1 LDO2_CTRL 2 AVD2 3 LSRN 4 AGND_LSRP 5 VREFM 6 MICHN 7 MICN 8 MICP 9 VREFP 10 RING_MICHP 11 VSSRF 12 CAP 13 XTAL 14 AVS 15 AVD_XTAL 16 VDDRF 17 RFCLK 18 VDDIO_RFCLK 19 ADC0_P204 20 ADC1_P205 24 VDD_0 22 TDO 25 RDI 26 SIO_P215 27 SK_P214 28 LE_P213 21 VDDIO_RFDIG 23 RSSI_P206 29 JTAG 30 EMAC_COL_P000 31 EMAC_CRS_P001 32 EMAC_RXER_P002 33 PAOUTP_P200 34 VDDPA 35 PAOUTN_P201 36 EMAC_RXD2_P009 37 EMAC_RXD3_P010 38 EMAC_TXD3_P008 39 EMAC_TXD2_P007 40 VDDIO_0 42 EMAC_TXD1_P308 43 EMAC_TXD0_P307 44 EMAC_TXEN_P303 45 EMAC_REF_CLK_P302 46 EMAC_CRS_DV_P304 47 EMAC_RXD1_P306 48 EMAC_RXD0_P305 49 EMAC_MDIO_P301 50 EMAC_MDC_P300 41 VDD_1 51 VDDIO_1 52 EMAC_TX_CLK_P004 53 EMAC_RX_CLK_P005 54 QSPI_SCK_P006 55 QSPI_IO0_P012 56 QSPI_IO3_P014 57 QSPI_IO1_P013 58 QSPI_IO2_P011 59 QSPI_CS_P003 60 P015 61 DAB0 62 DAB8 63 DAB1 69 DAB11 96 P208_AD14 95 P207_AD13 94 AD12 93 VDDIO_4 91 AD10 92 AD11 90 AD9 89 AD8 88 AD7 87 AD6 86 AD5 85 AD4 84 AD3 83 AD2 82 AD1 81 VDDIO_3 80 VDD_3 79 DAB15 78 DAB7 77 DAB14 76 DAB6 75 DAB13 74 DAB5 73 DAB12 72 RDN 71 WRN 70 DAB4 68 DAB3 67 VDDIO_2 66 DAB10 65 DAB2 64 DAB9 128 RSTN 127 SUPPLY 126 DC_CTRL 125 DC_I 124 DC_SENSE 123 LDO1_CTRL 122 VDDIO_7 121 EMAC_TXER_P203 120 P202 119 P212 118 P211 117 VDDIO_6 116 READY_P115 115 BE1N_P114 114 BE0N_P113 113 SDCLK_P112 112 SFADV_SDCKE_P111 111 SDCASN_P110 110 SDRASN_P109 109 SDUDQM_P108 108 SDLDQM_P107 107 VDDIO_5 106 VDD_4 105 AD23_SDBA1_P106 104 AD22_SDBA0_P105 103 AD21_SDWEN_P104 102 AD20_SDA10_P103 101 AD19_P102 100 P101_AD18 99 P100_AD17 98 P210_AD16 97 P209_AD15 129 BOTTOM_PAD U5 SC14452 C110 100nF C111 1uF RP5-B 33R RP5-D 33R R3 10K R4 NC/0R J3 NC/HDR1x3 C186 10pF C187 10pF C93 10pF C94 10pF R60 10K R5 47K Q3 MMBT3904 R6 82R 1 TP6 LED1 R8 56R Q1 MMBT3904 R9 10K R10 47K 1 TP9 1 TP10 1 TP12 1 TP13 R22 33R 1 TP15 1 TP16 L1 100nH R1 33R R7 33R R11 33R C130 100nF C131 10pF R52 33R J4 C112 56pF L4 150nH C104 56pF C107 56pF C14 270pF Z3 NC/4V7 Z2 4V7 R61 33R C53 220pF C109 10pF L8 150nH L11 150nH L14 150nH Q4 MMBT3904 R51 33R VDD_CR VDD_IO_3V3 VDD_IO_3V3 SD_A10 SD_WEN SD_BA0 SD_BA1SD_DQML SD_DQMHSD_RASN SD_CASN SD_CKE SD_CLK SD_CSN QSPI_IO0 QSPI_IO1 QSPI_CSN QSPI_SCK ETH_REFCLK ETH_TXD0 ETH_TXD1 ETH_RXD0 ETH_RXD1 ETH_CRSDV ETH_TX_EN SDA SCL VCORE VDD_PA DAB12DAB13 DAB14DAB15 DAB3 DAB2 DAB1 DAB0 DAB4 DAB5DAB6 DAB7DAB8 DAB9 DAB10 DAB11 ADDR0ADDR1 ADDR2 ADDR3 ADDR4 ADDR5 ADDR6 ADDR7 ADDR8ADDR9 ADDR11ADDR12 SD_CSN VDD_CR P306 CAP CLK P303P013P308P307P302P304P012P014 LDO2_CTRL P000P001 VDD_IO_3V3 URX UTX QSPI_IO2 QSPI_IO3 VDD_IO_3V3 VDD_IO_3V3 [1,6] RF_TDO VDD_IO_3V3 ADDR2 ADDR1 ADDR0 URXUTX [6] RF_CLK [6] RF_LE [6] RF_SK [6] RF_SIO [6] RF_RDI GND GND GND GND GND VDD_IO_3V3 [6] RF_TXD_EN [6] RF_RSTN [1,6] RF_TDO GND ETH_RSTN INT0 [1] PAGE [5] VDD3.3V GND GND GND GND GND [1] PAGE GND GND GND GND GND GND [1] CRYPTO GND VDD_IO_3V3 [1] CRYPTO IP160S Base Main Board DATAQ12DATAQ13DATAQ14DATAQ15DATAQ3DATAQ2DATAQ1DATAQ0DATAQ4DATAQ5DATAQ6DATAQ7DATAQ8DATAQ9DATAQ10DATAQ11 C2 10uF C6 100nF C3 100nF C4 100nF C5 100nF C7 100nF C8 100nF 1 VDD 2 DQ0 3 VDDQ 4 DQ1 5 DQ2 6 VSSQ 7 DQ3 8 DQ4 9 VDDQ 10 DQ5 11 DQ6 12 VSSQ 13 DQ7 14 VDD 15 DQML 16 WE 17 CAS 18 RAS 19 CS 20 BA0 21 BA1 22 A10 23 A0 24 A1 25 A2 26 A3 27 VDD 28 GND 29 A4 30 A5 31 A6 32 A7 33 A8 34 A9 35 A11 37 CKE 38 CLK 39 DQMH 41 GND 42 DQ8 43 VDDQ 44 DQ9 45 DQ10 46 VSSQ 47 DQ11 48 DQ12 49 VDDQ 50 DQ13 51 DQ14 52 VSSQ 53 DQ15 54 GND 36 A12 40 NC U7MT48LC8M16A2P-7E C12 100nF C95 10pF R20 22R R21 22R R24 22R R25 22R R26 22R R27 22R R28 22R R29 22R R30 22R R31 22R R32 22R R33 22R R34 22R R35 22R R36 22R R37 22R GND [1] SD_CSN [1] SD_WEN [1] SD_RASN [1] SD_DQML [1] SD_DQMH [1] SD_CKE [1] SD_CASN [1] SD_CLK [1] SD_BA1 [1] SD_BA0 [1] ADDR12 [1] ADDR11 [1] SD_A10 [1] ADDR9 [1] ADDR8 [1] ADDR7 [1] ADDR6 [1] ADDR5 [1] ADDR4 [1] ADDR3 [1] ADDR2 [1] ADDR1 [1] ADDR0 [1] DAB0 [1] DAB1 [1] DAB2 [1] DAB3 [1] DAB4 [1] DAB5 [1] DAB6 [1] DAB7 [1] DAB8 [1] DAB9 [1] DAB10 [1] DAB11 [1] DAB12 [1] DAB13 [1] DAB14 [1] DAB15 VDD_MEM_3V3 SPI Dataflash------------- 8MB MX25L6445EM21-10G or Similar IP160S Base Main Board 64M bit = 8M byte 1 CS 2 DO 3 WP 4 GND 5 DI 6 CLK 7 HOLD 8 VCC U10NC/W25Q64BVSSIG R115 NC/10K R114 NC/10K R116 NC/10K R113NC/1K C30100nF C96 10pF C54 10uF 1 /HOLD 2 VCC 3 NC 4 NC 5 NC 6 NC 7 /CS 8 DO 9 /WP 10 GND 11 NC 12 NC 13 NC 14 NC 15 DI 16 CLK U8 IC-W25Q128BV [1,3] QSPI_IO0 [1,3] QSPI_SCK [1,3] QSPI_IO3 [1,3] QSPI_IO2 [1,3] QSPI_IO1 [1,3] QSPI_CSN VDD_MEM_3V3 [1,3] QSPI_IO3 [1,3] QSPI_SCK [1,3] QSPI_IO0 [1,3] QSPI_IO2 [1,3] QSPI_CSN [1,3] QSPI_IO1 GND IP160S Base Main Board (Close to KSZ8051) RXDV_0(output) RXD0_0(output) RXD1_0(output) Ref_CLK_0(output) close to pin3 close to pin2 *** All TX+/TX- and RX+/RX- to be differentially ro uted (Close to KSZ8051) **Place near ethernet switch Y3 25MHz +/-50ppm C59 100nF C84 100nF C106 100nF C36 10uF C108 10uF R130 6.49K ∮1% R122 4K7 R126NC/1K R125 1K R123 NC/1K R127NC/10K R124 NC/4K7 R128NC/1K C83 10uF C105 NC/22pF R62 4K7 C47 22pF C48 22pF C38 NC/47pF R12 NC/4K7 R13 NC/1K C39 10uF R131 10K C1 10uF C40 10uF D3 IN4148 D5 IN4148 1 GND 2 VDDPLL_1.8 3 VDDA_3.3 4 RX- 5 RX+ 6 TX- 7 TX+ 8 XO 9 XI/REFCLK 10 REXT 11 MDIO 12 MDC 13 RXD3 14 RXD2 15 RXD1 16 RXD0 17 VDDIO_3.3 18 RXDV 19 RXC 20 RXER 21 INTRP 22 TXC 23 TXEN 24 TXD0 25 TXD1 26 TXD2 27 TXD3 28 COL 29 CRS 30 LED0 31 LED1 32 RST# U2 KSZ8051RNL/8041RNL 1 TP1 LP9 BLM18EG471SN1D R15 NC/4K7 R16 NC/1K R17 33R R18 4K7 R19 NC/4K7 R1475R R3875R R3975R R4075R RX TX 123678 9…

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Note: This test report is prepared for the customer shown above and for the device described herein. It may not be duplicated or used in part without prior written consent from Bay Area Compliance Laboratories Corp. (Shenzhen).This report must not be used by the customer to claim product certification, approval, or endorsement by NVLAP*, or any agency of the Federal Government. * This report may contain data that are not covered by the NVLAP accreditation and shall be marked with an asterisk “★” FCC PART 15D MEASUREMENT AND TEST REPORT For Telefield Ltd. Flat D, 2/F.,Valiant Industrial Centre, 2-12 Au Pui Wan Street, Fo Tan, N.T., Hong Kong FCC ID: MZVIP-160 Report Type: Original Report Product Type: IP DECT Phone (Base Unit) Test Engineer: Gardon Zhang Report Number: R1DG121231001-00FP Report Date: 2013-01-21 Reviewed By: Alvin Huang RF Leader Test Laboratory: Bay Area Compliance Laboratories Corp. (Shenzhen) 6/F, the 3rd Phase of WanLi Industrial Building ShiHua Road, FuTian Free Trade Zone Shenzhen, Guangdong, China Tel: +86-755-33320018 Fax: +86-755-33320008 www.baclcorp.com.cn Bay Area Compliance Laboratories Corp. (Shenzhen) Report No.: R1DG121231001-00FP FCC Part 15D Page 2 of 53 TABLE OF CONTENTS GENERAL INFORMATION.......................................................................................................................................4 PRODUCT DESCRIPTION FOR EQUIPMENT UNDER TEST (EUT) .....................................................................................4 OBJECTIVE...................................................................................................................................................................4 RELATED SUBMITTAL(S)/GRANT(S).............................................................................................................................4 TEST METHODOLOGY..................................................................................................................................................4 TEST FACILITY.............................................................................................................................................................5 SYSTEM TEST CONFIGURATION ..........................................................................................................................6 DESCRIPTION OF TEST CONFIGURATION......................................................................................................................6 EQUIPMENT MODIFICATIONS.......................................................................................................................................6 LOCAL SUPPORT EQUIPMENT LIST AND DETAILS........................................................................................................6 EXTERNAL I/O CABLE..................................................................................................................................................6 BLOCK DIAGRAM OF TEST SETUP................................................................................................................................7 SUMMARY OF TEST RESULTS ...............................................................................................................................8 FCC§ 15.319 (I) &2.1091 - RF RADIATION EXPOSURE .......................................................................................9 LIMIT...........................................................................................................................................................................9 MPE CALCULATION.....................................................................................................................................................9 FCC§15.317&§15.203 - ANTENNA REQUIREMENT ...........................................................................................10 APPLICABLE STANDARD............................................................................................................................................10 ANTENNA CONNECTOR CONSTRUCTION....................................................................................................................10 FCC§15.315 & §15.207 - CONDUCTED EMISSIONS............................................................................................11 APPLICABLE STANDARD............................................................................................................................................11 MEASUREMENT UNCERTAINTY..................................................................................................................................11 EUT SETUP................................................................................................................................................................11 EMI TEST RECEIVER SETUP.......................................................................................................................................12 TEST EQUIPMENT LIST AND DETAILS.........................................................................................................................12 TEST PROCEDURE......................................................................................................................................................12 TEST RESULTS SUMMARY..........................................................................................................................................12 TEST DATA................................................................................................................................................................13 FCC§15.323 (A) - EMISSION BANDWIDTH ..........................................................................................................17 APPLICABLE STANDARD............................................................................................................................................17 TEST EQUIPMENT LIST AND DETAILS.......................…

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EXHIBIT D - TEST SETUP PHOTOGRAPHS Conducted Emissions - Front View (Adapter Power Supply) Conducted Emissions - Side View (Adapter Power Supply) Conducted Emissions - Front View (PoE Power Supply) Conducted Emissions - Side View (PoE Power Supply) Radiated Emissions View (Below 1 GHz) Radiated Emissions View (Above 1 GHz) Frequency Stability View