QPU2100Class 1 Bluetooth compliant device

SN2100 Bluetooth Class 1 Module User Manual And Datasheet Version: 0.62 April 10, 2012 Note: SyChip, L.L.C. reserves the right to make changes in specifications at any time and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license is generated under any rights of SyChip or its supporters unless specifically agreed. SyChip/Murata Confidential Page 2 of 27 SN2100 Datasheet V0.62 Revision History Revision Date Author Change Description 0.1 Jul-07-2011 Release the first datasheet. 0.5 Nov-15-2011 N. Nagayama Update the block diagram / BT IC product number Update the SyChip Part Number 0.6 Jan-05-2012 Viet H. Update the spec table 0.61 Jan-31-2012 Yong Fang Added disclaimer 0.62 Apr-10-2012 JAG Added packaging, labeling and regulatory information SyChip/Murata Confidential Page 3 of 27 SN2100 Datasheet V0.62 Table of Contents 1 SYSTEM DESCRIPTIONS ......................................................................................................................... 5 1.1 APPLICATIONS .......................................................................................................................................... 5 1.2 MODULE SUMMARY .................................................................................................................................. 5 1.3 BLOCK DIAGRAM ...................................................................................................................................... 6 2 MECHANICAL SPECIFICATIONS ............................................................................................................ 7 2.1 MODULE DIMENSION ................................................................................................................................. 7 2.2 MODULE TOP AND SIDE VIEW ..................................................................................................................... 7 2.3 MODULE BOTTOM VIEW ............................................................................................................................. 8 2.4 DETAILED MECHANICAL DATA (TOP VIEW) ................................................................................................... 9 2.5 MODULE PIN-OUT ................................................................................................................................... 10 3 DC ELECTRICAL SPECIFICATIONS ..................................................................................................... 12 3.1 TYPICAL POWER CONSUMPTION .............................................................................................................. 12 3.2 DIGITAL IO SPECIFICATION ...................................................................................................................... 12 4 RF SPECIFICATIONS .............................................................................................................................. 13 4.1 BLUETOOTH SPECIFICATION .................................................................................................................... 13 4.2 RF CHARACTERISTICS (TX) .................................................................................................................... 13 4.3 RF CHARACTERISTICS (RX) .................................................................................................................... 15 5 ENVIRONMENTAL SPECIFICATIONS ................................................................................................... 16 5.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................. 16 5.2 OPERATION CONDITIONS ......................................................................................................................... 16 6 APPLICATION INFORMATION ............................................................................................................... 17 6.1 HOST PCB LAYOUT RECOMMENDATIONS ................................................................................................. 17 6.2 MODULE LOCATION ................................................................................................................................ 18 6.2.1 Location in x-y plane .................................................................................................................... 18 6.2.2 Location in z-plane ...................................................................................................................... 19 7 ASSEMBLY INFORMATION ................................................................................................................... 20 7.1 LEAD-FREE SOLDERING REFLOW PROFILE ................................................................................................ 20 8 PACKAGE INFORMATION ..................................................................................................................... 21 8.1 TAPE AND REEL SPECIFICATION ............................................................... ERROR! BOOKMARK NOT DEFINED. 8.2 MODULE MARKING .................................................................................. ERROR! BOOKMARK NOT DEFINED. 9 ORDERING INFORMATION .................................................................................................................... 22 10 ROHS DECLARATION ............................................................................................................................ 22 11 TECHNICAL SUPPORT CONTACT ........................................................................................................ 22 12 DISCLAIMER .................................................................................ERROR! BOOKMARK NOT DEFINED. SyChip/Murata Confidential Page 4 of 27 SN210…

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Prediction of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 where:S = power density P = power input to the antenna G = power gain of the antenna in the direction of interest relative to an isotropic radiator R = distance to the center of radiation of the antenna Maximum peak output power at antenna input terminal:18.90(dBm)* Maximum peak output power at antenna input terminal:77.62(mW) Antenna gain(maximum):-1.7(dBi)* Maximum antenna gain:0.68(numeric) Time Averaging:100(%)* Prediction distance:20(cm)* Prediction frequency:2440(MHz)* MPE limit for uncontrolled exposure at prediction frequency:1.000(mW/cm^2) Power density at prediction frequency:0.0104 (mW/cm^2) This equates to:0.104 W/m^2 2 4R PG S  

Nemko Test Report: 10219979RUS1 Applicant: SyChip LLC 2805 N. Dallas Parkway, Ste 400 Plano, TX 75093 USA Equipment Under Test: SN2100 (E.U.T.) FCC ID.: QPU2100 IC: 4523A-SN2100 In Accordance With: FCC Part 15, Subpart C, 15.247 and Industry Canada RSS-210, Issue 8 Frequency Hopping Transmitters Tested By: Nemko USA Inc. 802 N. Kealy Lewisville, Texas 75057-3136 TESTED BY: DATE: 20 February 2012 David Light, Senior Wireless Engineer APPROVED BY: DATE: 27-February 2012 Michael Cantwell Total Number of Pages: 42 Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 2 of 42 Table of Contents SECTION 1. SUMMARY OF TEST RESULTS 3 SECTION 2. EQUIPMENT UNDER TEST (E.U.T.) 5 SECTION 3. CHANNEL SEPARATION 6 SECTION 4. TIME OF OCCUPANCY 11 SECTION 6. PEAK POWER OUTPUT 15 SECTION 6. SPURIOUS EMISSIONS (ANTENNA CONDUCTED) 17 SECTION 7. SPURIOUS EMISSIONS (RADIATED) 22 SECTION 8. POWERLINE CONDUCTED EMISSIONS 27 SECTION 9. TEST EQUIPMENT LIST 30 ANNEX A - TEST DETAILS 31 ANNEX B - TEST DIAGRAMS 40 Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 3 of 42 Section 1. Summary of Test Results Manufacturer: Sychip LLC Model No.: SN2100 Serial No.: None General: All measurements are traceable to national standards. These tests were conducted on a sample of the equipment for the purpose of demonstrating compliance with Part 15, Subpart C, Paragraph 15.247 and Industry Canada RSS-210, Issue 8 for Frequency Hopping Spread Spectrum devices. Radiated tests were conducted is accordance with ANSI C63.4-2003. Radiated emissions are made on an open area test site. A description of the test facility is on file with the FCC and Industry Canada. New Submission Production Unit Class II Permissive Change Pre-Production Unit THIS TEST REPORT RELATES ONLY TO THE ITEM(S) TESTED. THE FOLLOWING DEVIATIONS FROM, ADDITIONS TO, OR EXCLUSIONS FROM THE TEST SPECIFICATIONS HAVE BEEN MADE. See “ Summary of Test Data”. Nemko USA, Inc. authorizes the above named company to reproduce this report provided it is reproduced in its entirety, for use by the company’s employees only. This report must not be used to claim product certification, approval, or endorsement by NVLAP, NIST, or any agency of the Federal Government. Nemko USA, Inc. is a NVLAP accredited laboratory. Any use which a third party makes of this report, or any reliance on or decisions to be made based on it, are the responsibility of such third parties. Nemko USA, Inc. accepts no responsibility for damages, if any, suffered by any third party as a result of decisions made or actions based on this report. This report applies only to the items tested. Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 4 of 42 Summary Of Test Data NAME OF TEST PARA. NO. RESULT Powerline Conducted Emissions 15.207(a) / RSS-Gen 7.2.4 Complies Channel Separation 15.247(a)(1) / RSS-210 A8.1(b) Complies Time of Occupancy 15.247(a)(1) / RSS-210 A8.1(d) Complies 20 dB Occupied Bandwidth 15.247(a)(1) / RSS-210 A8.1(a) Complies Peak Power Output 15.247(b) / RSS-210 A8.4(2) Complies Spurious Emissions (Antenna Conducted) 15.247(d) / RSS-210 A8.5 Complies Spurious Emissions (Radiated) 15.247(d) / RSS-Gen 7.2.2 Complies Footnotes: Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 5 of 42 Section 2. Equipment Under Test (E.U.T.) General Equipment Information Frequency Band: 902 – 928 MHz 2400 – 2483.5 MHz 5725 – 5850 MHz Operating Frequency Range: 2402 to 2480 MHz Number of Channels: 79 Channel Spacing: 1 MHz User Frequency Adjustment: Software controlled Description of EUT SN2100 is a complete industrial grade high power (class 1) Bluetooth® module with on- board antenna for M2M application. It integrates Bluetooth® IC, PA, RF front end, TCXO and chip antenna into a small LGA form factor and can be simply dropped into the OEM’s design. Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 6 of 42 Section 3. Channel Separation NAME OF TEST: Channel Separation PARA. NO.: FCC 15.247(a)(1) RSS-210 A8.1(b) TESTED BY: David Light DATE: 20 February 2012 Test Results: Complies. Measurement Data: See 20 dB BW plot Measured 20 dB bandwidth: 942 kHz Channel Separation: 1 MHz Equipment Used: 1082-1472-1036 Measurement Uncertainty: 1X10 -7 ppm Temperature: 23 C Relative Humidity: 49 % Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 7 of 42 Test Data – Channel Separation Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 8 of 42 Test Data – 20 dB Bandwidth Low Channel Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 9 of 42 Test Data – 20 dB Bandwidth Mid Channel Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 10 of 42 Test Data – 20 dB Bandwidth High Channel Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 11 of 42 Section 4. Time of Occupancy NAME OF TEST: Time of Occupancy PARA. NO.: FCC 15.247(a)(1) RSS-210 A8.1(d) TESTED BY: David Light DATE: 20 February 2012 Test Results: Complies. Measurement Data: Maximum Dwell Time On Any Channel: 0.300 seconds in 31.6 seconds Equipment Used: 1082-1472-1036 Measurement Uncertainty: 1X10 -7 ppm Temperature: 23 C Relative Humidity: 49 % Nemko USA, Inc. FCC PART 15, Subpart C and RSS-210 Frequency Hopping Transmitters EQUIPMENT: SN2100 PROJECT NO.:10219979RUS1 Page 12 of 42 Test Data – Time of O…

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