
Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.
SyChip SN8200 Wi-Fi Network Controller Module User Manual And Datasheet Version: 0.61 February 7, 2012 Note: SyChip, LLC. reserves the right to make changes in specifications at any time and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by SyChip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license is generated under any rights of SyChip or its supporters unless specifically agreed. Page 2 of 28 SN8200 User Manual and Datasheet v0.61 Table of Contents 1 SYSTEM DESCRIPTIONS ..................................................................................................................................... 5 1.1 APPLICATIONS ........................................................................................................................................................ 5 1.2 MODULE SUMMARY ............................................................................................................................................... 5 1.3 BLOCK DIAGRAM ................................................................................................................................................... 6 1.4 ACRONYMS............................................................................................................................................................. 6 2 MECHANICAL SPECIFICATIONS ..................................................................................................................... 7 2.1 MODULE DIMENSION .............................................................................................................................................. 7 2.2 MODULE TOP AND SIDE VIEW ................................................................................................................................. 7 2.3 MODULE FOOTPRINT (TOP VIEW) ............................................................................................................................ 8 2.4 MODULE PIN-OUT ................................................................................................................................................... 9 3 DC ELECTRICAL SPECIFICATIONS .............................................................................................................. 11 3.1 TYPICAL POWER CONSUMPTION ........................................................................................................................... 11 4 RF SPECIFICATIONS .......................................................................................................................................... 12 4.1 DC/RF CHARACTERISTICS FOR IEEE 802.11B ..................................................................................................... 12 4.2 DC/RF CHARACTERISTICS FOR IEEE 802.11G ..................................................................................................... 13 4.3 DC/RF CHARACTERISTICS FOR IEEE 802.11N ..................................................................................................... 14 5 ENVIRONMENTAL SPECIFICATIONS ........................................................................................................... 15 5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................ 15 5.2 RECOMMENDED OPERATING CONDITIONS ............................................................................................................ 15 6 APPLICATION INFORMATION........................................................................................................................ 16 6.1 EXTERNAL DIGITAL INTERFACES .......................................................................................................................... 16 6.1.1 Reference connection for UART host interface .......................................................................................... 16 6.1.2 Reference connection for the SPI host interface ........................................................................................ 17 6.2 RECOMMENDED HOST (CUSTOMER) CIRCUIT BOARD PCB PATTERN ..................................................................... 18 6.3 HOST PCB LAYOUT RECOMMENDATIONS ............................................................................................................. 18 6.4 MODULE LOCATION ............................................................................................................................................. 19 6.4.1 Location in x-y plane .................................................................................................................................. 20 6.4.2 Location in z-plane ..................................................................................................................................... 20 7 ASSEMBLY INFORMATION ............................................................................................................................. 21 7.1 LEAD-FREE SOLDERING REFLOW PROFILE ............................................................................................................. 21 8 PACKAGING AND MARKING INFORMATION ............................................................................................ 22 8.1 CARRIER TAPE DIMENSIONS ................................................................................................................................. 22 8.2 MODULE MARKING INFORMATION ....................................................................................................................... 22 9 ORDERING INFORMATION ............................................................................................................................. 23 10 ROHS DECLARATION ........................................................................................................โฆ
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Prediction of MPE limit at a given distance Equation from page 18 of OET Bulletin 65, Edition 97-01 where:S = power density P = power input to the antenna G = power gain of the antenna in the direction of interest relative to an isotropic radiator R = distance to the center of radiation of the antenna Maximum peak output power at antenna input terminal:22.38(dBm)* Maximum peak output power at antenna input terminal:173(mW) Antenna gain(maximum):-2(dBi)* Maximum antenna gain:0.631(numeric) Time Averaging:100(%)* Prediction distance:20(cm)* Prediction frequency:2450(MHz)* MPE limit for uncontrolled exposure at prediction frequency:1.000(mW/cm^2) Power density at prediction frequency:0.0217 (mW/cm^2) This equates to:0.2171 W/m^2 2 4R PG S ๏ฐ ๏ฝ
2805 N. Dallas Parkway, Suite 400 ยท Plano ยท United States
| # | Rule Parts | Frequency Range | Power Output |
|---|---|---|---|
| 1 | 15C | 2.41 GHz - 2.46 GHz | 173.00 mW |

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