QPU3020SYCHIP SN3020 IEEE802.15.4/ZIGBEE SMART ENERGY MODULE

SyChip SN3020 IEEE802.15.4/ZigBee Smart Energy Module User Manual and Datasheet Version: 1.0 February 3, 2011 Confidential Information Note: SyChip, Inc. reserves the right to make changes in specifications at anytime and without notice. The information furnished in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Sychip for its use, nor any infringements of patents or other rights of third parties resulting from its use. No license is generated under any rights of SyChip or its supporters unless specifically agreed. SyChip/Murata Confidential Page 2 of 26 SN3020 User Manual 1.0 Table of Contents 1 SYSTEM DESCRIPTIONS..................................................................................................................................... 4 1.1 APPLICATIONS................................................................................................................................................... 4 1.2 MODULE SUMMARY.......................................................................................................................................... 4 1.3 BLOCK DIAGRAM.............................................................................................................................................. 5 1.4 ACRONYMS........................................................................................................................................................ 5 2 MECHANICAL SPECIFICATIONS ..................................................................................................................... 6 2.1 MODULE DIMENSION......................................................................................................................................... 6 2.2 MODULE TOP AND SIDE VIEW............................................................................................................................. 6 2.3 MODULE BOTTOM VIEW..................................................................................................................................... 7 2.4 DETAILED MECHANICAL DATA (TOP VIEW) ........................................................................................................ 8 2.5 MODULE PIN-OUT.............................................................................................................................................. 9 3 DC ELECTRICAL SPECIFICATIONS .............................................................................................................. 12 3.1 TYPICAL POWER CONSUMPTION...................................................................................................................... 12 3.2 DIGITAL IO SPECIFICATION............................................................................................................................. 12 4 RF SPECIFICATIONS .......................................................................................................................................... 13 5 ENVIRONMENTAL SPECIFICATIONS ........................................................................................................... 14 5.1 ABSOLUTE MAXIMUM RATINGS....................................................................................................................... 14 5.2 OPERATION CONDITIONS.................................................................................................................................. 14 6 APPLICATION INFORMATION........................................................................................................................ 15 6.1 REFERENCE CONNECTION FOR UART HOST INTERFACE.................................................................................. 15 6.2 REFERENCE CONNECTION FOR THE SPI HOST INTERFACE................................................................................ 16 6.3 RECOMMENDED HOST (CUSTOMER) CIRCUIT BOARD PCB PATTERN................................................................ 17 6.4 HOST PCB LAYOUT RECOMMENDATIONS........................................................................................................ 17 6.5 MODULE LOCATION......................................................................................................................................... 18 6.5.1 Location in x-y plane.................................................................................................................................. 19 6.5.2 Location in z-plane..................................................................................................................................... 19 7 ASSEMBLY INFORMATION ............................................................................................................................. 20 7.1 LEAD-FREE SOLDERING REFLOW PROFILE........................................................................................................ 20 8 PACKAGE INFORMATION ............................................................................................................................... 21 8.1 TAPE AND REEL SPECIFICATION....................................................................................................................... 21 8.2 MODULE MARKING.......................................................................................................................................... 22 9 ORDERING INFORMATION ............................................................................................................................. 23 10 ROHS DECLARATION ........................................................................................................................................ 23 11 REGULATORY INFORMATION ....................................................................................................................... 23 11.1 FCC NOTICE (USA) .........................................................................................................................…

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Nemko Test Report: Q1023275RUS1 Applicant: SyChip, Inc. 2805 North Dallas Parkway Plano, TX 75093 USA Equipment Under Test: SN3020 (E.U.T.) In Accordance With: FCC Part 15, Subpart C, 15.247 and Industry Canada, RSS-210, Issue 8 Digital Transmission Systems Tested By: Nemko USA, Inc. 802 N. Kealy Lewisville, Texas 75057-3136 TESTED BY: DATE: 07 January 2011 David Light, Senior Wireless Engineer APPROVED BY: DATE: 11 January 2011 Tom Tidwell, Telecom Direct Number of Pages: 36 Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 2 of 36 Table of Contents SECTION 1. SUMMARY OF TEST RESULTS 3 SECTION 2. EQUIPMENT UNDER TEST (E.U.T.) 5 SECTION 3. OCCUPIED BANDWIDTH 6 SECTION 4. MAXIMUM PEAK OUTPUT POWER 9 SECTION 5 OUT OF BAND EMISSIONS 13 SECTION 6. RADIATED EMISSIONS 16 SECTION 7. PEAK POWER SPECTRAL DENSITY 18 SECTION 8. POWERLINE CONDUCTED EMISSIONS 21 SECTION 9. RECEIVER EMISSIONS 23 SECTION 10. TEST EQUIPMENT LIST 25 ANNEX A - TEST DETAILS 26 ANNEX B - TEST DIAGRAMS 34 Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 3 of 36 Section 1. Summary of Test Results Manufacturer: SyChip, Inc/ Model No.: SN3020 Serial No.: None General: All measurements are traceable to national standards. These tests were conducted on a sample of the equipment for the purpose of demonstrating compliance with CFR 47, Part 15, Subpart C, Paragraph 15.247 and Industry Canada RSS-210, Issue 8 for Digital Transmission Systems. Radiated tests were conducted is accordance with ANSI C63.4-2003. Radiated emissions are made on an open area test site. A description of the test facility is on file with the FCC. New Submission Production Unit Class II Permissive Change Pre-Production Unit THIS TEST REPORT RELATES ONLY TO THE ITEM(S) TESTED. THE FOLLOWING DEVIATIONS FROM, ADDITIONS TO, OR EXCLUSIONS FROM THE TEST SPECIFICATIONS HAVE BEEN MADE. See “ Summary of Test Data”. Nemko USA, Inc. authorizes the above named company to reproduce this report provided it is reproduced in its entirety, for use by the company’s employees only. This report must not be used to claim product certification, approval, or endorsement by NVLAP, NIST, or any agency of the Federal Government. Nemko USA, Inc. is a NVLAP accredited laboratory. Any use which a third party makes of this report, or any reliance on or decisions to be made based on it, are the responsibility of such third parties. Nemko USA, Inc. accepts no responsibility for damages, if any, suffered by any third party as a result of decisions made or actions based on this report. This report applies only to the items tested. Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 4 of 36 Summary Of Test Data NAME OF TEST PARA. NO. RESULT Powerline Conducted Emissions 15.207(a)/RSS-Gen 7.2.4 Complies Minimum 6 dB Bandwidth 15.247(a)(2) RSS-210 A8.2(a) Complies Maximum Peak Power Output 15.247(b)(3)/RSS-210/RSS-210 A8.4(4) Complies Spurious Emissions (Antenna Conducted) 15.247(d)?RSS-210 A8.5 Complies Spurious Emissions (Restricted Bands) 15.247(d)/15.209(a)/RSS-Gen 7.2.2 Complies Peak Power Spectral Density 15.247(e)/RSS-210 A8.2(a) Complies Receiver Spurious Emissions RSS-Gen 6.2 Complies Footnotes: Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 5 of 36 Section 2. Equipment Under Test (E.U.T.) General Equipment Information Frequency Band (MHz): 902-928 2400-2483.5 5725-5850 Operating Frequency of Test Sample: 2405 to 2480 MHz* Channel Spacing: 5 MHz User Frequency Adjustment: Software controlled *Note – To achieve compliance in the restricted band at the upper band edge, power was lowered. Software/firmware will be installed during manufacturing to maintain these levels for end use. Power level setting = 20 for channels 11 through 24, setting 14 for channel 25 and 4 for channel 26 using manufacturers test tool. Testing was performed at channels 11, 18 and 24 (full power). Upper band edge measurements were also made at channels 25 and 26 (reduced power) to show compliance with restricted band limits. Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 6 of 36 Section 3. Occupied Bandwidth NAME OF TEST: Occupied Bandwidth PARA. NO.: FCC 15.247(a)(2) RSS-210 A8.2(a) TESTED BY: David Light DATE: 06 January 2011 Test Results: Complies. Measurement Data: See 6 dB BW plot Measured 6 dB bandwidth: 1.65 MHz Max Test Conditions: 45 %RH 22 °C Measurement Uncertainty: +/-1x10 -7 ppm Test Equipment Used: 1464-1082-1472 Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 7 of 36 Test Data – Occupied Bandwidth Low Channel Mid Channel Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 8 of 36 Test Data – Occupied Bandwidth High Channel Nemko USA, Inc. FCC PART 15, SUBPART C and RSS 210, Issue 8 Digital Transmission Systems EQUIPMENT: SN3020 Test Report No.:Q1023275RUS1 Page 9 of 36 Section 4. Maximum Peak Output Power NAME OF TEST: Maximum Peak Output power PARA. NO.: FCC 15.247(b)(3) RSS-210 A8.4(4) TESTED BY: David Light DATE: 06 January 2011 Test Results: Complies. Measurement Data: Refer to attached data Test Conditions: 45 %RH 22 °C Measurement Uncertainty: +/-1.7 dB Test Equipment Used: 1464-1082-1472 Manufacturers stated antenna gain = -1.0 dBi This device was tested at +/- 15% input power per 15.31(e), with no variation in output power. For battery powered equipment, the device was tested with a fresh battery per 15.31(e). The device was tested on three channels per 15.31(l). T…

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