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YAISB52Wireless SOM Module

InnoComm Mobile Technology Corporation
Wireless SOM Module - FCC ID YAISB52 - InnoComm Mobile Technology Corporation
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Application Details

Equipment Class
DTS - Digital Transmission System
Date of Grant
May 31, 2020
Application Purpose
Original Equipment
Date of Application
May 28, 2020
Equipment Note
Wireless SOM Module
Frequency Range
2412.00000000 - 2462.00000000
Company
InnoComm Mobile Technology Corporation
Country
Taiwan

Documents & Files

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Users Manual

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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RF Exposure Info

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

SB52 SOM Datasheet Copyright and third-party information as required www.innocomm.comii Revisions History Date Version Number Document Changes 2020/04/24 0.0 Initial Draft Disclaimer SB52 SOM is supplied “as is” and without warranties of any kind, express implied, or statutory including, but not limited to, any implied warranty for a particular purpose. No license is granted by implication or otherwise under any patents or other intellectual property by application or use of evaluation boards. Information furnished by InnoComm is believed to be accurate and reliable. InnoComm reserves the right to change specifications or product descriptions in this document at any time without notice. Should Buyer purchase or use InnoComm’s products for any such unintended or unauthorized application, Buyer shall indemnify and hold InnoComm harmless against all claims and damages. InnoComm is the trademark of InnoComm Mobile Technology Corp. Other trademarks and registered trademarks mentioned herein are the property of their respective owners. Table of Contents www.innocomm.comiii 1 Overview .......................................................................................................................................................... 4 1.1 ... General Information .............................................................................................................................. 4 1.2 ... Architecture and Block Diagram ........................................................................................................... 5 1.3 ... Feature Summary ................................................................................................................................... 5 1.4 ... Dimension ............................................................................................................................................... 6 1.5 ... Electrical Specifications ......................................................................................................................... 6 1.6 ... General Application Notes..................................................................................................................... 7 2 Main Hardware Components ......................................................................................................................... 8 2.1 ... CPU .......................................................................................................................................................... 9 2.2 ... Memory .................................................................................................................................................. 9 2.3 ... Power Management IC .......................................................................................................................... 9 2.4 ... eMMC Storage ..................................................................................................................................... 10 2.5 ... Wi-Fi/Bluetooth Module ...................................................................................................................... 10 3 SB52 SOM Interfaces and Connectors ......................................................................................................... 11 3.1 ... J401 Connector ..................................................................................................................................... 11 3.2 ... J402 Connector ..................................................................................................................................... 13 3.3 ... Power Signals ....................................................................................................................................... 15 3.4 ... I2Cs Parameter Specification ............................................................................................................. 16 3.5 ... UARTs .................................................................................................................................................... 16 3.6 ... DSI Interface ......................................................................................................................................... 17 3.7 ... CSI Interface ......................................................................................................................................... 18 3.8 ... Audio ..................................................................................................................................................... 19 3.9 ... USB ........................................................................................................................................................ 20 3.10 . GPIO ...................................................................................................................................................... 20 4 Reference Documents .................................................................................................................................. 20 5 How to Process SB52 .................................................................................................................................... 21 www.innocomm.com4 1 Overview 1.1 General Information SB52 SOM is a high-performance System on Module(SOM) designed based on the i500 processor from MediaTek. The i500 device, with integrated Bluetooth, FM, WLAN, and GPS modules, is a highly integrated baseband platform incorporating application processing subsystems. The chip integrates ARM® Cortex-A73/A53 MPCore operating up to 2GHz and powerful multi-standard video codec. The application processor, a multi-core ARM® Cortex-A73, ARM® Cortex-A53 MPCore equipped with the NEON engine offers processing power necessary to support the latest OpenOS along with its demanding applications such as web browsing, email, GPS navigation, and games. All are viewed on a high-resolution touch screen display with graphics enhanced by…

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Users Manual

www.innocomm.com6 1.4 Dimension The dimension of SB52 is 55 mm x 45 mm x 3.5 mm. Detail dimension please see Fig1-2. Figure 1-2 SB52 SOM Dimension 1.5 Electrical Specifications Symbol Parameter Minimum Maximum Unit VSYS Input Voltage 3.4 4.35 V VSYS Input Current 1.5 A Table 1-1: Input Power Absolute Maximum Ratings Symbol Parameter Minimum Maximum Unit VIO28_PMU VDDIO_2V8 2.66 2.94 V VIO18_PMU VDDIO_1V8 1.71 1.89 V Table 1-2: Output Power www.innocomm.com7 Symbol Parameter Minimum Maximum Unit T Operating Temp. 0 60* °C Table 1-3 Operating Temperature Note * : Test with heat sink 1.6 General Application Notes Consider the following recommendations when designing application boards: • Use a GND plane underneath the SB52. • Do not use vias in high-speed interface lines such as USB and Ethernet. • Rout high-speed interface lines differentially and leave several mm gap to other signal lines when possible. • Do not place any components which dissipate heat close to or underneath the module. • A heat sink is suggested to allow prolonged operation under full CPU speed. Connect heat sink to CPU and WiFi via thermal pad, ensure that heat sink is not tilted or applying high force onto the module. www.innocomm.com8 2 Main Hardware Components SB52 SOM has two 75-pin M.2 E-key golden fingers to connect with another carrier board. It integrates MTK the i500, LPDDR4 Memory, eMMC, Power Manage IC (PMIC), and Wi- Fi/Bluetooth on the module. Figure 2-1 – Top side of SB52 SOM Figure 2-2 – Bottom side of SB52 SOM www.innocomm.com9 2.1 CPU MTK i500 processor integrates a multi-core ARM® Cortex-A73, ARM® Cortex-A53 MPCore equipped with the NEON engine offers processing power necessary to support the latest OpenOs along with its demanding applications such as web browsing, email, GPS navigation, and games. The features of i500 processors include the following: • Quad-core ARM Cortex-A73 MPCore operating at 2GHz • Quad-core ARM Cortex-A53 MPCore operating at 2GHz • NEON multimedia processing engine • ARM TrustZone security 2.2 Memory SB52 SOM is embedded 2GB of LPDDR4X memory with the following feature, • Dual channels with a 16-bit data bus width • Up to 3200MHz memory clock • Supports self-refresh/ partial self-refresh mode • Supports dual-rank memory device • Advanced bandwidth arbitration control 2.3 Power Management IC www.innocomm.com10 MTK MT6358 power management IC is used for SB52 SOM. MT6358 is a programmable power management IC that integrates 9 buck converters and 33 LDOs to provide all power rails required by SoC and peripherals. MT6358 adopts the SPI interface and two SRCLKEN control pins to control buck converters, LDOs, and various drivers; it provides enhanced safety control and protocol for handshaking with i500. For system management, it provides the following features, • Support software shutdown or hardware power off • 32K RTC oscillator for system timing • Watchdog reset • Over-current and thermal overload protection • OVP, UVLO function • Precision voltage, temperature, and current measurement fuel gauge 2.4 eMMC Storage The onboard eMMC device is connected to the MSDC0 interface of the i500 processor in an 8-bit width configuration. 2.5 Wi-Fi/Bluetooth Module MTK MT7668 WIFI/BT IC is used for SB52. It supports Wi-Fi 802.11 a/b/g/n/ac MIMO and BT5.0. www.innocomm.com11 3 SB52 SOM Interfaces and Connectors SB52 use two M.2 E-key golden finger to connect with the carrier board. The tables below detail the pin assignment and functionality of these connectors. 3.1 J401 Connector Table 3-1 J401 Connector J401 Pin # Signal Name I500 Pin # MT6358 Pin # I/O Voltage (V) 1 SYSRSTB K23 D4 I 1.8 2 VBAT PI 3.4 ~ 4.35 3 PWRKEY_SW D2 I 0 ~ 5 4 VBAT PI 3.4 ~ 4.35 5 VCAMA2_PMU N10 PO 1.8/2.5/2.7/2.8/2.9/3 6 VBAT PI 3.4 ~ 4.35 7 GND 8 VBAT PI 3.4 ~ 4.35 9 GND 10 GND 11 AUXIN4 AG18 AI 0 ~ 1.8 12 VBUS K12 PI 5 13 GPIO9 W4 I/O 1.8 14 VRTC28 M8 PO 2.8 15 GPIO17 AB26 I/O 1.8 16 GPIO10 Y4 I/O 1.8 17 UCTS1 N26 I/O 1.8 18 GPIO22 Y26 I/O 1.8 19 SDA2 AB1 OD 1.8 20 GPIO23 AA26 I/O 1.8 21 SCL2 AB2 OD 1.8 22 GPIO24 AA23 I/O 1.8 23 AU_MICBIAS0 K5 PO 1.7~2.6 www.innocomm.com12 J401 Pin# Signal Name I500 Pin # MT6358 Pin # I/O Voltage 32 SPI_CSB AG3 I/O 1.8 33 AU_VIN2_N K3 I MICBIAS 34 SPI_CLK AF3 I/O 1.8 35 AU_VIN0_P K1 I MICBIAS 36 SPI_MI AJ2 I/O 1.8 37 AU_VIN0_N L1 I MICBIAS 38 SPI_MO AH2 I/O 1.8 39 AU_REFN H5 AGND 40 URTS1 P26 I/O 1.8 41 AU_HPR G4 AO -1.98 ~ 1.98 42 GPIO19 W24 I/O 1.8 43 AU_HPL H4 AO -1.98 ~ 1.98 44 GPIO150 R25 I/O 1.8 45 GND GND 46 I2S1_LRCK AD21 I/O 1.8 47 AU_MICBIAS1 L5 O 1.7~2.6 48 I2S1_BCK AG23 I/O 1.8 49 AU_VIN1_P L4 I MICBIAS 50 I2S1_DO AG21 I/O 1.8 51 AU_VIN1_N L3 I MICBIAS 52 KPROW0 AA5 I/O 1.8 53 ACCDET K6 I 0 ~ 2.94V 54 URXD1 AG25 I/O 1.8 55 HP_EINT J4 I 0 ~ 2.94V 56 UTXD1 AG24 I/O 1.8 57 GND GND 58 KPCOL0 AC4 I/O 1.8 59 USB_DM G26 USB 60 KPROW1 AH1 I/O 1.8 61 USB_DP F26 USB 62 KPCOL1 AE3 I/O 1.8 63 GND GND 64 SDA1 AF4 I/O 1.8 65 SDA3 AG22 I/O 1.8 66 SCL1 AE4 I/O 1.8 www.innocomm.com13 J401 Pin# Signal Name I500 Pin # MT6358 Pin # I/O Voltage 67 SCL3 AF22 I/O 1.8 68 GPIO0 AB5 I/O 1.8 69 GND GND 70 GPIO20 Y24 I/O 1.8 71 SDA0 AC5 I/O 1.8 72 GPIO42 AF26 I/O 1.8 73 SCL0 AB6 I/O 1.8 74 GPIO8 AD4 I/O 1.8 75 VIO18_PMU F3 PO 1.8 3.2 J402 Connector Table 3-2 J402 Connector J402 Pin# Signal Name I500 Pin # MT6358 Pin # I/O Voltage 1 AVSS28_AUD J5 AGND 2 VLDO28_PMU P8 PO 2.8/3 3 GND GND 4 GPIO45 AH27 I/O 1.8 5 UART_RXD0 AD2 I/O 1.8 6 DISP_PWM AH23 I/O 1.8 7 UART_TXD0 AD1 I/O 1.8 8 DISP_TE AG26 I/O 1.8 9 HOMEKEY G13 I 1.8 10 GPIO21 AB24 I/O 1.8 11 IDDIG AF23 I/O 1.8 12 GPIO2 AG2 I/O 1.8 13 GPIO98 Y5 I/O 1.8 14 GPIO1 AB4 I/O 1.8 15 GPIO102 AA2 I/O 1.8 16 GPIO7 AE1 I/O 1.8 17 DSI0_D2N V24 DSI 18 GPIO151 L25 I/O 1.8 www.innocomm.com14 J402 Pin# Signal Name I500 Pin # MT6358 Pin # I/O Voltage 19 DSI0_D2P V25 DSI 20 DSI0_D3N T24 DSI 21 DSI0_D1N T26 DSI 22 DSI0_D3P T25 DSI 23 DSI0_D1P U26 DSI 32 DSI0_CKP U25 DSI 33 DSI0_D0N R27 DSI 34 DSI0_CKN U24 DSI 35 DSI0_D0P T27 DSI 36 CAM_CLK0 AA4 I/O 1.8 37 RDN3 T1 C…

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Cover Letter(s)

Date: 2020/5/4 Federal Communications Commission 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Product Certification Representative Authorization Letter FCC ID: YAISB52 Product name: Wireless SOM Module To whom it may concern: We the undersigned, hereby authorize following person to act as our agent in the preparation of an application for equipment authorization of model SB52 to the FCC Rules and Regulations. International Certification Corp. Address : No.3-1, Lane 6, Wen San 3rd St. Kwei Shan Dist., TaoYuan City 333, Taiwan (R.O.C.) Name : Gary Chang Job Title : Manager e-mail : [email protected] Webs We further certifies that neither the applicant nor any party to this application, as defined in 47 CFR Ch. 1.2002(b), is subject to a denial to Federal benefits, that include FCC benefits, pursuant to section 5301 of the Anti-Drug Abuse Act of 1998, 21 U.S.C. 862. This appointment also includes the authority to complete FCC Form 731 on our behalf and sign the application as an authorized agent. Applicant : InnoComm Mobile Technology Corp Address : 3F,No. 6, Hsin Ann Rd., Hsinchu Science Park, Hsinchu City 30078, Taiwan Signature : Name and Job Title. : Keller Lin / DQA manager E-mail : [email protected] Tel. : +886-3-5781868

Cover Letter(s)

Date: May 4, 2020 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Rd Columbia MD 21046-1609 Subject: Request for confidentiality FCC ID: YAISB52 To whom it may concern: Short-term confidentiality Pursuant to DA 04-1705 of the Commission’s pubic notice, in order to comply with the marketing regulations in 47CFR §2.803 and the importation rules in 47 CFR §2.1204, while ensuring that business sensitive information remains confidential until the actual marketing of newly authorized devices. We are requesting the commission to grant short-term confidentiality request on the following attachments for 180 days. ☒ Internal Photographs ☒ External Photographs ☒ User's manual ☒ Test Set up photo Permanent confidentiality Pursuant to Sections 0.457 and 0.459 of the Commission’s Rules, the Applicant Hereby requests confidential treatment of information accompanying this Application As outlined below: ☒ Block Diagram ☒ Schematics ☒ Operational Description The above materials contain trade secrets and proprietary information not customarily released to the public. The public disclosure of these materials may be harmful to the applicant and provide unjustified benefits to its competitors. The applicant understands that pursuant to Section 0.457 of the Rules, disclosure of this application and all accompanying documentation will not be made before the date of the Grant for this application. Should you require any further information, please contact the undersigned. Thank you for your consideration in this matter. Applicant : InnoComm Mobile Technology Corp Address : 3F,No. 6, Hsin Ann Rd., Hsinchu Science Park, Hsinchu City 30078, Taiwan Signature : Name and Job Title. : Keller Lin / DQA manager E-mail : [email protected] Tel. : +886-3-5781868

Cover Letter(s)

Date: May 4, 2020 Subject: Ad Hoc Mode Function Declaration FCC ID: YAISB52 To Whom it may concern, We, InnoComm Mobile Technology Corp declare that the device does not support any non-US channels, country code selection and Channel 12 and 13 in 2.4 GHz band in all the operational mode(s). Also, the client software and associated drivers will not initiate any transmission on DFS frequencies without initiation by a master and the device without support DFS detection capability. This includes restriction on transmissions for beacons and support for ad-hoc peer-to-peer modes. Regards, Applicant : InnoComm Mobile Technology Corp Address : 3F,No. 6, Hsin Ann Rd., Hsinchu Science Park, Hsinchu City 30078, Taiwan Signature : Name and Job Title. : Keller Lin / DQA mamager E-mail [email protected] Tel. +886-3-5781868

Cover Letter(s)

RF_734_02 04 April 16 Modular Approval Request FCC (KDB 996369 D01 & Part 15.212) FCC ID: YAISB52 Items to be covered by Single modular transmitters. Answer from applicant 1. The modular transmitter must have its own RF shielding. The modular has a shielding Case. Please refer to EUT Photo. 2. The modular transmitter must have buffered modulation/data inputs (if such inputs are provided) to ensure that the module will comply with Part 15 requirements under conditions of excessive data rates or over-modulation. The component number is MT7668 3. The modular transmitter must have its own power supply regulation. The component number is MT6358 4. The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204(b)(c). The antenna must either be permanently attached or employ a “unique” antenna coupler (at all connections between the module and the antenna, including the cable). Antenna Connectors are UFL. And no external amplifier will be used with this modular. 5. The modular transmitter must be tested in a stand-alone configuration, i.e., the module must not be inside another device during testing. This is intended to demonstrate that the module is capable of complying with Part 15 emission limits regardless of the device into which it is eventually installed. This modular is tested under stand-alone configuration. Please refer to Test setup photo. 6. The modular transmitter must be equipped with either a permanently affixed label or must be capable of electronically displaying its FCC identification number in accordance with 15.212 (a)(1)(vi)(A) / (B). The modular transmitter is labeled with its own FCC ID number. Please refer to label sample and label location. 7. The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements. A copy of these instructions must be included in the application for equipment authorization. For example, there are very strict operational and timing requirements that must be met before a transmitter is authorized for operation under Section 15.231. For instance, data transmission is prohibited, except for operation under Section 15.231(e), in which case there are separate field strength level and timing requirements. Compliance with these requirements must be assured. The modular complies with this requirement. Please refer to user manual. 8. The modular transmitter must comply with any applicable RF exposure requirements. For example, FCC Rules in Sections 1.1310, 2.1091, 2.1093, and specific Sections of Part 15, including 15.319(i), 15.407(f), 15.253(f) and 15.255(g), require that Unlicensed PCS, UNII and millimeter wave devices perform routine environmental evaluation for RF Exposure to demonstrate compliance. In addition, spread spectrum transmitters operating under Section 15.247 are required to address RF Exposure compliance. Modular transmitters approved under other Sections of Part 15, when necessary, may also need to address certain RF Exposure concerns, typically by providing specific installation and operating instructions for users, installers and other interested parties to ensure compliance. The device complies with this requirement. Please refer to RF exposure report. RF_734_02 04 April 16 Items to be covered by Split modular transmitters. Answer from applicant 1. The modular transmitter must comply with all requirements of a single modular transmitter except for items (1) & (5) of the above single modular approval requirements. 2. Only the radio front end must be shielded. The physical crystal and tuning capacitors may be located external to the shielded radio elements. The interface between the split sections of the modular system must be digital with a minimum signalling amplitude of 150 mV peak-to-peak. 3. Control information and other data may be exchanged between the transmitter control elements and radio front end. 4. The sections of a split modular transmitter must be tested installed in a host device(s) similar to that which is representative of the platform(s) intended for use. 5. Manufacturers must ensure that only transmitter control elements and radio front end components that have been approved together are capable of operating together. The transmitter module must not operate unless it has verified that the installed transmitter control elements and radio front end have been authorized together. Manufacturers may use means including, but not limited to, coding in hardware and electronic signatures in software to meet these requirements, and must describe the methods in their application for equipment authorization. Note: A limited modular approval (LMA) may be granted for single or split modular transmitters that comply partially with the requirements above. Name and surname of applicant (or authorized representative): __________________ Date: ___28 May 2020____ Signature: ___________________________

External Photos

Project No.: 031702 Page No. : 1 of 5 Photographs of EUT Project No.: 031702 Page No. : 2 of 5 Project No.: 031702 Page No. : 3 of 5

ID Label/Location Info

FCC ID: YAISB52

Internal Photos

Project No.: 031702 Page No. : 4 of 5 Project No.: 031702 Page No. : 5 of 5

RF Exposure Info

Report No.: FA031702 Page : 1 of 6 Report Version: Rev. 01 FCC RF Exposure Report FCC ID : YAISB52 Equipment : Wireless SOM Module Model No. : SB52 Brand Name : InnoComm Applicant : InnoComm Mobile Technology Corp Address : 3F,No. 6, Hsin Ann Rd., Hsinchu Science Park, Hsinchu 30078, Taiwan Standard : 47 CFR FCC Part 2.1091 Received Date : Mar. 17, 2020 Tested Date : Apr. 30 ~ May 20, 2020 We, International Certification Corp., would like to declare that the tested sample has been evaluated and in compliance with the requirement of the above standards. The test results contained in this report refer exclusively to the product. It may be duplicated completely for legal use with the approval of the applicant. It shall not be reproduced except in full without the written approval of our laboratory. Reviewed by: Approved by: Along Chen / Assistant Manager Gary Chang / Manager Report No.: FA031702 Page : 2 of 6 Report Version: Rev. 01 Table of Contents 1 MPE EVALUATION OF MOBILE DEVICES ......................................................................................... 4 1.1 LIMITS FOR GENERAL POPULATION/UNCONTROLLED EXPOSURE............................................. 4 1.2 MPE EVALUATION FORMULA ............................................................................................................. 4 1.3 DEVIATION FROM TEST STANDARD AND MEASUREMENT PROCEDURE ................................... 4 1.4 MEASUREMENT UNCERTAINTY ......................................................................................................... 4 1.5 MPE EVALUATION RESULTS .............................................................................................................. 5 1.6 MPE EVALUATION OF SIMULTANEOUS TRANSMISSION ................................................................ 5 2 TEST LABORATORY INFORMATION ................................................................................................. 6 Report No.: FA031702 Page : 3 of 6 Report Version: Rev. 01 Release Record Report No. Version Description Issued Date FA031702 Rev. 01 Initial issue May 27, 2020 Report No.: FA031702 Page : 4 of 6 Report Version: Rev. 01 1 MPE EVALUATION OF MOBILE DEVICES 1.1 LIMITS FOR GENERAL POPULATION/UNCONTROLLED EXPOSURE Frequency Range (MHz) Power Density (mW /cm 2 ) Averaging Time (minutes) 300~1500 F/1500 30 1500~100000 1.0 30 1.2 MPE EVALUATION FORMULA Pd = 2 **4RPi Pt Where Pd= Power density in mW/cm 2 Pt= EIRP in mW Pi= 3.1416 R= Measurement distance 1.3 DEVIATION FROM TEST STANDARD AND MEASUREMENT PROCEDURE None 1.4 MEASUREMENT UNCERTAINTY The measurement uncertainties given below are based on a 95% confidence level (based on a coverage factor (k=2) Parameters Uncertainty Conducted power ±0.808 dB Declaration of Conformity: The test results with all measurement uncertainty excluded are presented in accordance with the regulation limits or requirements declared by manufacturers. Comments and Explanations: The declared of product specification for EUT presented in the report are provided by the manufacturer, and the manufacturer takes all the responsibilities for the accuracy of product specification. Report No.: FA031702 Page : 5 of 6 Report Version: Rev. 01 1.5 MPE EVALUATION RESULTS Frequency Range (MHz) Maximum Conducted Power (dBm) Rated Power (dBm) Antenna Gain (dBi) Distance (cm) Power Density (mW/cm 2 ) Limit (mW/cm 2 ) Ratio* Pass / Fail 2412~2462 (Wi-Fi) 22.27 22.5 1.87 20 0.054 1 0.0544 Pass 5150~5250 (Wi-Fi) 23.09 23.5 1.22 20 0.059 1 0.0590 Pass 5250~5350 (Wi-Fi) 22.43 22.5 2.19 20 0.059 1 0.0586 Pass 5470~5725 (Wi-Fi) 21.01 21.5 2.39 20 0.049 1 0.0487 Pass 5725~5850 (Wi-Fi) 20.72 21 3.14 20 0.052 1 0.0516 Pass 2402-2480 (BT EDR) 1.69 2 1.87 20 0.000 1 0.0005 Pass 2402-2480 (BT LE) 1.39 1.5 1.87 20 0.000 1 0.0004 Pass *Ratio = Power density / Limit. 1.6 MPE EVALUATION OF SIMULTANEOUS TRANSMISSION Mode Max Ratio of Each Mode Wi-Fi 2.4 GHz 0.0544 Wi-Fi 5 GHz 0.0590 BT EDR 0.0005 Sum (Wi-Fi 2.4 GHz+ BT EDR) 0.0549 Sum (Wi-Fi 5 GHz+ BT EDR) 0.0595 Limit 1 Pass / Fail Pass Report No.: FA031702 Page : 6 of 6 Report Version: Rev. 01 2 Test laboratory information Established in 2012, ICC provides foremost EMC & RF Testing and advisory consultation services by our skilled engineers and technicians. Our services employ a wide variety of advanced edge test equipment and one of the widest certification extents in the business. International Certification Corp (EMC and Wireless Communication Laboratory), it is our definitive objective is to institute long term, trust-based associations with our clients. The expectation we set up with our clients is based on outstanding service, practical expertise and devotion to a certified value structure. Our passion is to grant our clients with best EMC / RF services by oriented knowledgeable and accommodating staff. Our Test sites are located at Linkou District and Kwei Shan District. Location map can be found on our website http://www.icertifi.com.tw. Linkou Kwei Shan Kwei Shan Site II Tel: 886-2-2601-1640 Tel: 886-3-271-8666 Tel: 886-3-271-8640 No. 30-2, Ding Fwu Tsuen, Lin Kou District, New Taipei City, Taiwan, R.O.C. No. 3-1, Lane 6, Wen San 3rd St., Kwei Shan District, Tao Yuan City 333, Taiwan, R.O.C. No. 14-1, Lane 19, Wen San 3rd St., Kwei Shan District, Tao Yuan City 333, Taiwan, R.O.C.. If you have any suggestion, please feel free to contact us as below information Tel: 886-3-271-8666 Fax: 886-3-318-0155 Email: [email protected] ══END══

Test Report

Report No.: FR031702AC Page : 1 of 53 Report Version: Rev. 01 FCC Test Report FCC ID : YAISB52 Equipment : Wireless SOM Module Model No. : SB52 Brand Name : InnoComm Applicant : InnoComm Mobile Technology Corp Address : 3F,No. 6, Hsin Ann Rd., Hsinchu Science Park, Hsinchu 30078, Taiwan Standard : 47 CFR FCC Part 15.247 Received Date : Mar. 17, 2020 Tested Date : Apr. 30 ~ May 20, 2020 We, International Certification Corp., would like to declare that the tested sample has been evaluated and in compliance with the requirement of the above standards. The test results contained in this report refer exclusively to the product. It may be duplicated completely for legal use with the approval of the applicant. It shall not be reproduced except in full without the written approval of our laboratory. Reviewed by: Approved by: Along Chen / Assistant Manager Gary Chang / Manager Report No.: FR031702AC Page : 2 of 53 Report Version: Rev. 01 Table of Contents 1 GENERAL DESCRIPTION .................................................................................................................... 5 1.1 Information .............................................................................................................................................. 5 1.2 Local Support Equipment List ................................................................................................................ 7 1.3 Test Setup Chart .................................................................................................................................... 7 1.4 The Equipment List ................................................................................................................................ 8 1.5 Test Standards ....................................................................................................................................... 9 1.6 Deviation from Test Standard and Measurement Procedure ................................................................. 9 1.7 Measurement Uncertainty ...................................................................................................................... 9 2 TEST CONFIGURATION ..................................................................................................................... 10 2.1 Testing Condition ................................................................................................................................. 10 2.2 The Worst Test Modes and Channel Details ....................................................................................... 10 3 TRANSMITTER TEST RESULTS ........................................................................................................ 11 3.1 Conducted Emissions ........................................................................................................................... 11 3.2 6dB and Occupied Bandwidth .............................................................................................................. 14 3.3 RF Output Power .................................................................................................................................. 19 3.4 Power Spectral Density ........................................................................................................................ 22 3.5 Unwanted Emissio…

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Contact Information

Applicant

Bruno Tsai(Product manager)
[email protected]886-3-5781868Fax: 886-3-5781187

Technical Contact

International Certification Corp.Gary Chang
[email protected]886-3-271-8628

No.3-1, Lane 6, Wen San 3rd St. Kwei · Taiwan

Non-Technical Contact

International Certification Corp.Wendy Liao
[email protected]886-3-271-8629

Test Firm

International Certification Corp.Fu-Cheng Chuang
[email protected]886-3-271-8666Fax: 886-3-318-0155

Technical Specifications

#Rule PartsFrequency RangePower Output
215C2.41 GHz - 2.46 GHz530.00 mW
Modular Type
Single Modular Approval
Confidentiality
Long Term
Grant Notes
Modular Approval. Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. The antenna's as listed in this application must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC multi-transmitter procedures. End-users may not be provided with the module installation instructions. OEM integrators and end-users must be provided with transmitter operating conditions for satisfying RF exposure compliance.

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