YCP-MB203202X-NUCLEO-WB05KN1

Introduction The X-NUCLEO-WB05KN1 expansion board provides Bluetooth ® Low Energy connectivity for developer applications and can be plugged into an STM32 Nucleo development board (for example NUCLEO-U575ZI-Q) through its ARDUINO ® Uno V3 connectors. The expansion board features Bluetooth ® v5.4 compliant and FCC‑certified STM32WB05KN. This SoC manages the complete Bluetooth ® Low Energy stack and protocols on its Arm ® Cortex ® ‑M0+ core and programmable flash memory. STM32WB05KN supports central and peripheral modes and increased transfer rates with data length extension (DLE). X-NUCLEO-WB05KN1 interfaces with the STM32 Nucleo microcontroller via UART (default) with and without hardware flow control. Full duplex SPI with an interrupt line is also available. The firmware loaded on the module defines the host interface and, to modify it, simply change the firmware without modifying the hardware. Figure 1. X-NUCLEO-WB05KN1 global view Picture is not contractual. Bluetooth ® Low Energy expansion board based on the STM32WB05KN for STM32 Nucleo boards UM3355 User manual UM3355 - Rev 1 - July 2024 For further information contact your local STMicroelectronics sales of fice. www.st.com 1 Typical application The X-NUCLEO-WB05KN1 expansion board can be used for the evaluation of the STM32WB05KN device in many applications, such as: •Point‑to‑point communication •Sensor application •Home automation and lighting •Direct test mode (DTM) UM3355 Typical application UM3355 - Rev 1 page 2/24 2 Features •Based on STM32WB05KN with preloaded network coprocessor firmware with UART interface – Bluetooth ® v5.4 compliant –Bluetooth ® Low Energy data packet length extension •Embedded MLPF-NRG-01D3 integrated impedance matching network with harmonics filter •On-board PCB antenna •SPI interface optional through dedicated firmware •Compatible with STM32 Nucleo boards • Equipped with ARDUINO ® Uno V3 expansion connector •Scalable solution, capable of cascading multiple boards for larger systems •Free comprehensive development firmware library and examples, compatible with the X-CUBE-WB05N expansion software package for STM32Cube Note: For information on Bluetooth ® , refer to the www.bluetooth.com website Note:Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. UM3355 Features UM3355 - Rev 1 page 3/24 3 Ordering information To order the X-NUCLEO-WB05KN1 expansion board, refer to Table 1. Additional information is available from the datasheet and reference manual of the target STM32. Table 1. Ordering information Order codeBoard referencesTarget STM32 X-NUCLEO-WB05KN1 •MB2160 (1) •MB2032 (2) STM32WB05KNV6 1. ARDUINO ® interface board 2.MCU RF board 3.1 Codification The meaning of the codification is explained in Table 2. Table 2. Codification explanation X-NUCLEO- XXYYZTN DescriptionExample: X-NUCLEO-WB05KN1 X-NUCLEOSTM32 Nucleo expansion boardsSTM32 Nucleo expansion boards XX MCU series in STM32 32-bit Arm Cortex MCUs STM32WB0 series YYMCU product line in the seriesSTM32WB05 product line Z STM32 package pin count: •K for 32 pins 32 pins TTarget applicationNetwork coprocessor NSequential number First generation of Bluetooth ® Low Energy expansion board based on the STM32WB05KN for STM32 Nucleo boards UM3355 Ordering information UM3355 - Rev 1 page 4/24 4 Development environment 4.1 System requirements • Multi‑OS support: Windows ® 10, Linux ® 64-bit, or macOS ® •USB Type-A or USB Type-C ® to USB Type-C ® cable Note: macOS ® is a trademark of Apple Inc., registered in the U.S. and other countries and regions. Linux ® is a registered trademark of Linus Torvalds. Windows is a trademark of the Microsoft group of companies. 4.2 Development toolchains • IAR Systems ® - IAR Embedded Workbench ®(1) • Keil ® - MDK-ARM (1) •STMicroelectronics - STM32CubeIDE 1. On Windows ® only. UM3355 Development environment UM3355 - Rev 1 page 5/24 5 Conventions Table 3 provides the conventions used for the ON and OFF settings in the present document. Table 3. ON/OFF convention ConventionDefinition Jumper JPx ONJumper fitted Jumper JPx OFFJumper not fitted Jumper JPx [1-2]Jumper fitted between Pin 1 and Pin 2 Solder bridge SBx ONSBx connections closed by 0 Ω resistor Solder bridge SBx OFFSBx connections left open Resistor Rx ONResistor soldered Resistor Rx OFFResistor not soldered Capacitor Cx ONCapacitor soldered Capacitor Cx OFFCapacitor not soldered UM3355 Conventions UM3355 - Rev 1 page 6/24 6 Safety recommendations 6.1 Targeted audience This product targets users with at least basic electronics or embedded software development knowledge like engineers, technicians, or students. This board is not a toy and is not suited for use by children. 6.2 Handling the board This product contains a bare printed circuit board. Like all products of this type, the user must pay attention to the following points: •The connection pins on the board might be sharp. Be careful when handling the board to avoid hurting yourself •This board contains static‑sensitive devices. To avoid damaging it, handle the board in an ESD‑proof environment. •While powered, do not touch the electric connections on the board with your fingers or anything conductive. The board operates at voltage levels that are not dangerous, but components might be damaged when shorted. •Do not put any liquid on the board and avoid operating the board close to water or at a high humidity level. •Do not operate the board if dirty or dusty. UM3355 Safety recommendations UM3355 - Rev 1 page 7/24 7 Hardware requirements The X-NUCLEO-WB05KN1 expansion board is designed for use with any STM32 Nucleo development board equipped with an ARDUINO ® Uno V3 connector. The expansion board must be plugged into the matching pins of the development board connector. Figure 2. X-NUCLEO-WB05KN1plugged into NUCLEO-U575ZI-Q To complete the system setup, the user needs: •A PC/laptop with Microsoft Windows 7 ® or above to install the software package (X-CUBE-WB0…

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ST Confidential CERTIFICATIONS CONCERNING “COVERED” EQUIPMENT Date: June 20, 2024 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID: YCP-MB203202 To Whom It May Concern: As required by section 2.911(d)(5)(i), STMICROELECTRONICS (ROUSSET) SAS, FRN 0019756717 (“the applicant”) certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. As required by section 2.911(d)(5)(ii), STMICROELECTRONICS (ROUSSET) SAS, FRN 0019756717 (“the applicant”) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing “covered” equipment. Thank you for your attention to this matter. Sincerely yours, Signature: Printed Name: Pascal Scafidi Company: STMICROELECTRONICS (ROUSSET) SAS Job Title: MDRF Group VP Quality & Reliability Email: [email protected] Telephone: +33 4 76 58 50 00

ST Confidential Administrative Contact/Manufacturer Company Name STMICROELECTRONICS (ROUSSET) SAS FRN 0019756717 Address: 190 Avenue Celestin Coq Postcode/Zip Code 13106 City Rousset Country France E-mail Address: [email protected] Date: June 20, 2024 Letter of Authorization To Whom It May Concern. The undersigned STMICROELECTRONICS (ROUSSET) SAS (the “Company”), hereby authorizes: SMEE (Mr. Laurent Chapus, 385 Rue René Rambaud, ZA Le Parvis 2, F-38500 Voiron, France) to represent the Company in the carrying-out all matters and processes needed to the FCC Certifications approval equipment authorization for the following products: Trademark ST Manufacturer STMICROELECTRONICS (ROUSSET) SAS Model X-NUCLEO-WB05KN1 FCC ID YCP-MB203202 The authorization granted hereunder shall remain effective until (i) it is either expressly revoked on behalf of the Company or (ii) the beneficiary of this authorization significantly changes his business collaboration or other capacity in relation to the Company as existing on the date of this document, including the cessation of business. The express provisions of this letter set forth the entire authorization granted to the beneficiaries appointed above, and this document revokes and supersedes any prior authorizations by the undersigned within the scope of the authorization granted hereunder. We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse ACT of 1988, U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002(b), to the application, is subject to denial of federal benefits, that includes FCC benefits. This authorization was executed on June 20th, 2024. On behalf of STMICROELECTRONICS (ROUSSET) SAS Signature: Full Name: Pascal Scafidi Title: MDRF Group VP Quality & Reliability Email: [email protected] Phone: +33 4 76 58 50 00

ST Confidential REQUEST FOR CONFIDENTIALITY Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Date: June 20, 2024 FCC ID: YCP-MB203202 To Whom it may concern: We hereby request the exhibits listed below to be held confidential:  Schematics  Block Diagram  Operational Description These exhibits contain trade secrets and proprietary information not customarily released to the public. The public disclosure of the material in these exhibits might provide unjustified benefits to our competitors and be harmful to our operations. Product name: X-NUCLEO-WB05KN1 Model name: X-NUCLEO-WB05KN1 Brand name: ST Sincerely yours, On behalf of: STMICROELECTRONICS (ROUSSET) SAS 190 Avenue Celestin Coq 13106 ROUSSET – France Signature : Full Name: Pascal Scafidi Title: MDRF Group VP Quality & Reliability Email: [email protected] Phone: +33 4 76 58 50 00

Page 1/1 EXTERNAL PHOTOS OF TESTED EUT Applicant: STMicroelectronics (ROUSSET) SAS Device PMN: X-NUCLEO-WB05KN1 Model: X-NUCLEO-WB05KN1

Page 1/1 PRODUCT LABELING Applicant: STMicroelectronics (Rousset) SAS Device PMN: X-NUCLEO-WB05KN1 Model: X-NUCLEO-WB05KN1 Label is 19x14mm Label location

Page 1/1 INTERNAL PHOTOS OF TESTED EUT Applicant: STMicroelectronics (ROUSSET) SAS Device model: X-NUCLEO-WB05KN1 Model: X-NUCLEO-WB05KN1 Cover removed (RF part) Rear side of MB2032B Top side of MB2160 Rear side of MB2160 BLE antenna

COORDONNEES SMEE TEL : 04 76 65 76 50 385, Rue Renè Rambaud, ZA le Parvis 2 FAX : 04 76 66 18 30 38500 VOIRON - France SAS au capital de 50 000 € / RC Grenoble B534 796 453 / SIRET 534 796 453 00023 / code APE 7490B / n° TVA : FR 59 534 796 453 RF Exposure Considerations for FCC ID: YCP-MB203202 The calculation of the MPE is as following: Prediction of MPE limit at a prediction distance: S= ² . . 4 . R G P  = ² . . 4 . . . R P R I E  S: Power density (mW/cm²) P: Peak output power at antenna terminal (mW) G: Numerical Antenna gain R: Distance of radiation to antenna (cm) MPE calculation (1): Power value is taken from EIRP (Max Conducted power + antenna gain) (2): No simultaneous RF transmission Conclusion: Therefore, the device complies with FCC’s RF radiation exposure limits for general population for a mobile device. Certified By Laurent CHAPUS (Agent for this device) SMEE 385, Rue René Rambaud ZA Le Parvis 2 38500 Voiron - France [email protected] FCC Registration Number: 0020356952 (FRN) Applicant for this device: STMicroelectronics (Rousset) SAS 190 Avenue Celestin Coq 13106 ROUSSET – France FRN: 0019756717 Frequency (MHz) Maximum EIRP including tune- up tolerance (mW) (1) R (cm) Power Density S (mW/cm²) MPE limit (mW/cm²) % of limit Limit (%) Verdict 2402-2480 9.9 20 0.002 1 0.197 100% Below MPE limit for uncontrolle d exposure Simultaneous transmissions SUM = N/A (2) 100%

Introduction This application note is dedicated to the STM32WB Series microcontrollers. One of the main reasons to use a PCB (printed circuit board) antenna is the reduced overall cost of the radio module. Well designed and implemented PCB-printed antennas have a similar performance to the SMD (surface-mounted device) ceramic equivalence. In general, the footprint for a ceramic SMD antenna is smaller than that for a PCB-printed variant. For a PCB-printed antenna solution, the increased size of the PCB in relation to space required for the antenna means that the radio module is larger and the cost of the PCB increased. However the PCB solution is generally cheaper than a SMD ceramic antenna. The demonstration and development boards for the STM32WB Series implement PCB printed antenna based on this application note. Low cost PCB antenna for 2.4 GHz radio: meander design for STM32WB Series AN5129 Application note AN5129 - Rev 4 - April 2019 For further information contact your local STMicroelectronics sales office. www.st.com 1General information This document applies to STM32WB Series Arm ® -based devices. Note:Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. AN5129 General information AN5129 - Rev 4 page 2/22 2Coordinate system For the purpose of this document, the spherical coordinate system illustrated in the figure below is used. Figure 1. Spherical coordinate system The PCB module is orientated vertically (plane X-Z) and located in proximity to the origin of the coordinate system. The azimuth angle radiates from the X-axis towards the Y-axis and the elevation angle radiates from the Z-axis towards the horizontal X-Y plane. Sometimes, as with geographical and navigational systems, the X-axis is called the "Nord-axis", the Yaxis is called the "East-axis" and the Z-axis is called the "Zenith-axis". AN5129 Coordinate system AN5129 - Rev 4 page 3/22 3Layout specification The PCB antennas, including the electrical parameters of PCB materials used, are layout sensitive. It is recommended to use a layout as close as possible to the one shown in the figure below. Figure 2. PCB antenna dimensions (in mm) The electrical parameters and performance of the PCB antenna are also determined by the substrate used, in particular the thickness of the core and dielectric constants. AN5129 Layout specification AN5129 - Rev 4 page 4/22 The figure below illustrates a typical cross-section of the substrate in a PCB-antennae area. Figure 3. PCB cross section at antennae area A substrate with the parameters as defined in the table below is recommended. Table 1. Recommended substrate specification Layer Dimensions Dielectric constant Ɛ R LabelValue (mil)Value (μm) Solder mask, topS10.717.784.4 Copper traceT1.640.64- CoreC28711.24.4 Solder mask, bottomS20.717.784.4 AN5129 Layout specification AN5129 - Rev 4 page 5/22 4Impedance matching Meander-like PCB antenna can be tuned to the required 50 Ω impedance by matching the impedance circuitry with the π topology. In Figure 2, the impedance matching area is marked with a dashed line. Under nominal conditions, this antenna exhibits and impedance very close to the required nominal impedance (50 Ω). To check the performance of this design, a sample antenna was manufactured (according to the specifications covered by this document). The figure below shows this antenna. Figure 4. Part of 802.15.4 and BLE PCB with meander-like antenna (scale around 4:1) Assuming that the manufactured sample exhibits the expected performance (no impedance matching necessary), the impedance matching circuitry is bypassed by two 100 pF capacitors connected in series, as shown in the figure below. Figure 5. Bypassing impedance matching circuitry - Direct RF connection All electrical parameters of the meander-like antenna have been measured at connection to the band-pass filter (BPF) with the frequency span covering frequencies from 2.4 GHz to 2.5 GHz. AN5129 Impedance matching AN5129 - Rev 4 page 6/22 Complex impedance of the antenna is shown in the Smith diagram in the figure below. Figure 6. Complex impedance of the meander-like antenna (Smith chart) The figure below shows the magnitude of the S11 parameter (in log scale). Figure 7. S11 parameter in logarithmic scale (Cartesian plot) AN5129 Impedance matching AN5129 - Rev 4 page 7/22 The figure below shows the standing wave ratio (SWR). Figure 8. Antenna standing wave ratio (SWR) The following changes affect the radiation impedance of the PCB antenna: • slight board size variation • metal shielding • use of plastic cover • presence of other components in proximity of the antenna The best performance impedance matching circuitry compensates these effects so that, for operating frequencies, the optimum 50 Ω impedance is achieved. AN5129 Impedance matching AN5129 - Rev 4 page 8/22 5Radiation pattern, 3-D visualization A three-dimensional (3-D) visualization of the radiation pattern (magnitude of the electrical far field |E|) is done for the center ISM band frequency 2.44175 GHz. Figure 9. 3-D radiation pattern overview Figure 10. Radiation pattern on X-Z plane AN5129 Radiation pattern, 3-D visualization AN5129 - Rev 4 page 9/22 6Radiation pattern, 2-D visualization In this section, all radiation patterns are related to the magnitude of electrical far field |E|, that is normalized and shown in the logarithmic scale (in dB). This means that the maximum global radiation pattern (maximum magnitude of the electrical far-field E) is represented by 0 dB level. To show the antenna radiation patterns in detail, three two dimensional (2-D) major cuts are presented. Consider the orientation of the module in the spherical coordinate system as shown in Figure 1. A three dimensional (3-D) far field radiation pattern is visualized as three two dimensional (2-D) cuts through a 3- D pattern. The following major planes are used for these cuts (see Figure 11): • one horizontal X-Y plane • two vertical planes: X-Z plan…

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Rapport d’essais / Test Report N° : 110276-FCC-ISED-1 Page 1 / 33 COORDONNEES SMEE TEL : 04 76 65 76 50 385, Rue René Rambaud, ZA Le Parvis 2 FAX : 04 76 66 18 30 38500 VOIRON - France SAS au capital de 50 000 € / RC Grenoble B534 796 453 / SIRET 534 796 453 00015 / code APE 7490B / n° TVA : FR 59 534 796 453 FCC Test Firm Designation Number: FR0014 ISED Wireless Device Testing Laboratory CAB Number: FR0004 Matériel testé : Equipment under test: ST / X-NUCLEO-WB05KN1 (Trademark / Marketing name or product reference) Demandeur de certification : Applicant for certification: STMicroelectronics (Rousset) SAS 190 Avenue Celestin Coq 13106 – ROUSSET – France Client : Customer: STMicroelectronics 9-11, rue Pierre-Félix Delarue 72100 Le Mans, France Numéro d’affaire : Work number : 110276 Référence de la proposition : Proposal number: DV-810397 Date de l’essai : Date of test: Du 7 au 12 juin 2024 June 7 th to 12 th ,2024 Objectif des essais : Test purpose: EMC qualification accordingly to following standards: - CFR 47, FCC Part 15, Subpart C (Chapter 15.247 - Operation within the bands 902–928 MHz, 2400–2483.5 MHz, and 5725–5850 MHz)s - Industry Canada RSS-247, Issue 3 (Digital Transmission Systems Operating in the Bands 902–928 MHz) Measurement standards: ANSI C63.10 (2013) Lieu du test: Test location: SMEE, 385 Rue René Rambaud 38500 VOIRON - France Test réalisé par : Test realized by: Chemseddine KERMICHE Conclusion : Conclusion: L’équipement satisfait aux prescriptions et essais des normes citées en référence. The appliance complies with requirements and tests of above mentioned standards. Ed. Date Modifications / Pages Written by: Visa Approved by: Visa 1 September 5 th , 2024 Initial Edition Chemseddine KERMICHE Test operator Laurent CHAPUS Technical Manager La copie de ce document n'est permise que sous sa forme intégrale. Ce document est le résultat d’essais effectués sur un échantillon. Il ne préjuge pas de la conformité de l’ensemble des produits fabriqués à l’objet essayé. Pour la déclaration de conformité de l'équipement, il n'est pas tenu compte de l'incertitude de mesure. Cette nouvelle édition de ce rapport annule et remplace l’édition précédente. Les modifications apportées à une nouvelle édition de ce rapport sont signalées par un trait vertical à gauche de la page. L’utilisation de la marque d’accréditation COFRAC est interdite. This document shall not be reproduced, except in full. This document contains results related only to the item tested. It does not imply the conformity of the whole production to the item tested. For the declaration of conformity of the equipment, the measurement uncertainty is not taken into account. This new edition of this report cancels and replaces the previous edition. Changes made to a new edition of this report are indicated by a vertical line to the left of the page. The use of the COFRAC accreditation mark is prohibited. Accréditation N° 1-6356 Portée disponible sur : Scope available on : www.cofrac.fr Page 2 / 33 Rapport d’essai / Test Report N° : 110276-FCC-ISED-1 Page 2 / 33 Contents 1. NORMATIVES REFERENCES ......................................................................................................... 3 2. TEST SYNTHESIS ............................................................................................................................ 4 3. EQUIPMENT UNDER TEST (EUT) ................................................................................................... 5 4. TEST CONDITIONS .......................................................................................................................... 6 5. MODIFICATIONS OF THE EUT ........................................................................................................ 6 6. SPECIAL ACCESSORY .................................................................................................................... 6 7. MEASUREMENT UNCERTAINTY .................................................................................................... 6 8. FIELD STRENGTH CALCULATION .................................................................................................. 6 9. TEST SETUP DIAGRAM ................................................................................................................... 7 10. CONDUCTED EMISSION MEASUREMENT (150 KHZ-30MHZ) ................................................... 9 11. DTS BANDWIDTH ....................................................................................................................... 12 12. MAXIMUM PEAK OUTPUT POWER ........................................................................................... 15 13. MAXIMUM POWER SPECTRAL DENSITY LEVEL IN THE FUNDAMENTAL EMISSION ........... 18 14. UNWANTED EMISSIONS IN NON-RESTRICTED FREQUENCY BANDS (RADIATED EMISSIONS) .......................................................................................................................................... 21 15. UNWANTED EMISSIONS IN RESTRICTED FREQUENCY BANDS ........................................... 23 16. OCCUPIED BANDWIDTH (99%) ................................................................................................. 29 17. TEST EQUIPMENT LIST ............................................................................................................. 32 Page 3 / 33 Rapport d’essai / Test Report N° : 110276-FCC-ISED-1 Page 3 / 33 1. Normatives References FCC qualification according to: Standards Applied Title ANSI C63.10 (2013) X American National Standard for Testing Unlicensed Wireless Devices CFR47, Part 15 (June 2024) X Telecommunication – Federal Communication Commission – Radio frequency devices, Sections 15.207 / 15.209 / 15.247 ISED qualification according to: Standards Applied Title RSS-Gen (Issue 5/2018, amendments 2019 and 2021) X General Requirements and Information for the Certification of Radio Apparatus RSS-247 (Issue 3/2023) X Digital Transmission Systems (DTSs), Fre…

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Page 1/3 TEST SETUP PHOTOS Applicant: STMicroelectronics (ROUSSET) SAS Device PMN: X-NUCLEO-WB05KN1 Model: X-NUCLEO-WB05KN1 CONDUCTED EMISSIONS Page 2/3 RADIATED EMISSIONS (FREQ < 1GHz) Page 3/3 RADIATED EMISSIONS (FREQ > 1GHz)