YCP-MB229300BLE RF evaluation board

UMxxxx - Draft – June 2025 . www.st.com UMxxxx User manual STM32WBA Nucleo-64 board (MB1801 and MB2293) Introduction The NUCLEO-WBA25CE1 STM32 Nucleo-64 board, based on the MB1801 mezzanine board and the MB2293 MCU RF board, is a wireless and ultra‑low‑power board embedding a powerful and ultra‑low‑power radio compliant with the Bluetooth ® LE, IEEE 802.15.4-2015 PHY and MAC, supporting Thread, Matter, and Zigbee ® . A user USB Type-C ® is also provided for easy connection with other devices. The ARDUINO ® Uno V3 connectivity support and the ST morpho headers allow the easy expansion of the functionality of the STM32 Nucleo open development platform with a wide choice of specialized shields. Figure 1. NUCLEO-WBA25CE1 global view Picture is not contractual. UMxxxx - Draft page 2/48 UMxxxx Features 1 Features • Ultra‑low‑power wireless STM32WBA25CEU7 microcontroller based on the Arm ® Cortex ® ‑M33 core, featuring 512 Kbytes of flash memory and 96 Kbytes of SRAM in a UFQFPN48 package • MCU RF board (MB2293): – 2.4 GHz RF transceiver supporting Bluetooth ® LE specification v6.0 – Build-in PCB antenna • Three user LEDs • Three user push-buttons and one reset push-button • Board connectors: ◦ User USB Type-C ® ◦ USB Type-C ® for debugging purpose ◦ ARDUINO ® Uno V3 expansion connector ◦ ST morpho headers for full access to all STM32 I/Os • Flexible power-supply options: ST-LINK USB V BUS or external sources • On-board STLINK-V3EC debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port • Comprehensive free software libraries and examples available with the STM32CubeWBA MCU Package • Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench ® , MDK-ARM, and STM32CubeIDE Note: Arm and TrustZone are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere. UMxxxx - Draft page 3/48 UMxxxx Ordering information 2 Ordering information To order the NUCLEO-WBA25CE1 board, refer to Table 1. Additional information is available from the datasheet and reference manual of the target microcontroller. Table 1. List of available products Order code Board reference Target STM32 NUCLEO-WBA25CE1 • MB1801 (1) • MB2293 (2) STM32WBA25CEU7 1. Mezzanine board 2. MCU RF board 2.1 Codification The meaning of the codification is explained in Table 2. Table 2. Codification explanation NUCLEO-XXXYYZTU Description Example: NUCLEO-WBA25CE1 XXX MCU series in STM32 32-bit Arm Cortex MCUs STM32WBA series YY MCU product line in the series STM32WBA25 product line Z STM32 package pin count: • C for 48 pins 48 pins T STM32 flash memory size: • E for 512 Kbytes 512 Kbytes U 1 for Cut1.0 First version of NUCLEO-WBA25 UMxxxx - Draft page 4/48 UMxxxx Development environment 3 Development environment 3.1 System requirements • Multi‑OS support: Windows ® 10, Linux ® 64-bit, or macOS ® • USB Type-A or USB Type-C ® to USB Type-C ® cable Note: macOS ® is a trademark of Apple Inc., registered in the U.S. and other countries and regions. Linux ® is a registered trademark of Linus Torvalds. Windows is a trademark of the Microsoft group of companies. 3.2 Development toolchains • IAR Systems ® - IAR Embedded Workbench ®(1) • Keil ® - MDK-ARM (1) • STMicroelectronics - STM32CubeIDE 1. On Windows ® only. 3.3 Demonstration software The demonstration software, included in the STM32Cube MCU Package corresponding to the on-board microcontroller, is preloaded in the STM32 flash memory for easy demonstration of the device peripherals in standalone mode. The latest versions of the demonstration source code and associated documentation can be downloaded from www.st.com. 3.4 CAD resources All board design resources, including schematics, CAD databases, manufacturing files, and the bill of materials, are available from the NUCLEO-WBA25CE1 product page at www.st.com. UMxxxx - Draft page 5/48 UMxxxx Conventions 4 Conventions Table 3 provides the conventions used for the ON and OFF settings in the present document. Table 3. ON/OFF convention Convention Definition Jumper JPx ON Jumper fitted Jumper JPx OFF Jumper not fitted Jumper JPx [1-2] Jumper fitted between pin 1 and pin 2 Solder bridge SBx ON SBx connections closed by 0 Ω resistor Solder bridge SBx OFF SBx connections left open Resistor Rx ON Resistor soldered Resistor Rx OFF Resistor not soldered Capacitor Cx ON Capacitor soldered Capacitor Cx OFF Capacitor not soldered UMxxxx - Draft page 6/48 UMxxxx Safety recommendations 5 Safety recommendations 5.1 Targeted audience This product targets users with at least basic electronics or embedded software development knowledge such as engineers, technicians, or students. This board is not a toy and is not suited for use by children. 5.2 Handling the board This product contains a bare printed circuit board and like all products of this type, the user must be careful about the following points: • The connection pins on the board might be sharp. Be careful when handling the board to avoid hurting yourself • This board contains static‑sensitive devices. To avoid damaging it, handle the board in an ESD‑proof environment. • While powered, do not touch the electric connections on the board with your fingers or anything conductive. The board operates at a voltage level that is not dangerous, but components might be damaged when shorted. • Do not put any liquid on the board and avoid operating the board close to water or at a high humidity level. • Do not operate the board if dirty or dusty. UMxxxx - Draft page 7/48 UMxxxx Quick start 6 Quick start This section describes how to start development quickly using NUCLEO-WBA25CE1. To use the product, you must accept the evaluation product license agreement from the www.st.com/epla webpage. Before the first use, make sure that no damage occurred to the board during shipment: • All socketed components must be firmly secured in their sockets. • Nothing must be loose in the board blister. The Nucleo board is …

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ST Confidential CERTIFICATION DESIGNATING A U.S. AGENT FOR SERVICE OF PROCESS Date: December 01, 2025 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID: YCP-MB229300 To Whom It May Concern: As required by section 2.911(d)(7), we, STMICROELECTRONICS (ROUSSET) SAS, FRN 0019756717 certifies that we acknowledge the designation of a contact located in the United States for purposes of acting as the applicant’s agent for service of process. We, STMICROELECTRONICS SAS, accepts to maintain an agent for no less than one year after the grantee has terminated all marketing and importation or the conclusion of any Commission-related proceeding involving the equipment. As required by section 2.911(d)(7), we, STMicroelectronics Inc, address 200 Summit Drive | Suite 405 | Burlington, MA 01803 | USA, FRN: 0033628546] certifies that we acknowledge our obligation acting as the applicant’s agent for service of process for the above referenced FCC ID. Thank you for your attention to this matter. Sincerely yours, Signature by applicant Signature by designated agent (if different from applicant) Printed Name: Pascal Scafidi Printed Name: Francesco Doddo Company: STMicroelectronics (Rousset) SAS Address: 190 Avenue Celestin Coq 13106 Rousset France Company: STMicroelectronics Inc Address: 200 Summit Drive Suite 405 Burlington MA 01803 USA FRN: 0019756717 FRN: 0033628546 Job Title:MDRF Group VP Quality & Reliability Job Title: AME AMS Sensors to Cloud Applications | Director Email: [email protected] Email: [email protected] Telephone: +33 4 76 58 50 00 Telephone: +1 781 472 9634 Docusign Envelope ID: ED1E55EF-B927-487F-8005-2327319F79A3

ST Confidential CERTIFICATIONS CONCERNING “COVERED” EQUIPMENT Date: December 01, 2025 Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 FCC ID: YCP-MB229300 To Whom It May Concern: As required by section 2.911(d)(5)(i), STMICROELECTRONICS (ROUSSET) SAS, FRN 0019756717 (“the applicant”) certifies that the equipment for which authorization is sought is not “covered” equipment prohibited from receiving an equipment authorization pursuant to section 2.903 of the FCC rules. As required by section 2.911(d)(5)(ii), STMICROELECTRONICS (ROUSSET) SAS, FRN 0019756717 (“the applicant”) certifies that, as of the date of the filing of the application, the applicant is not identified on the Covered List as an entity producing “covered” equipment. Per KDB 986446 D01 v03 section B, 2a, STMICROELECTRONICS (ROUSSET) SAS, FRN 0019756717 (“the applicant”) certifies that the equipment for this application does not contain Kaspersky cybersecurity or anti-virus software. Thank you for your attention to this matter. Sincerely yours, Signature Printed Name: Pascal Scafidi Company: STMICROELECTRONICS (ROUSSET) SAS Job Title: MDRF Group VP Quality & Reliability Email: [email protected] Telephone: +33 4 76 58 50 00 Docusign Envelope ID: ED1E55EF-B927-487F-8005-2327319F79A3

ST Confidential Administrative Contact/Manufacturer Company Name STMICROELECTRONICS (ROUSSET) SAS FRN 0019756717 Address: 190 Avenue Celestin Coq Postcode/Zip Code 13106 City Rousset Country France E-mail Address: [email protected] Date: December 1, 2025 Letter of Authorization To Whom It May Concern. The undersigned STMICROELECTRONICS (ROUSSET) SAS (the “Company”), hereby authorizes: SGS France - SMEE (Mr. Laurent Chapus, 385 Rue René Rambaud, ZA Le Parvis 2, F-38500 Voiron, France) to represent the Company in the carrying-out all matters and processes needed to the FCC Certifications approval equipment authorization for the following products: Trademark ST Manufacturer STMICROELECTRONICS (ROUSSET) SAS Model NUCLEO-WBA25CE1 FCC ID YCP-MB229300 The authorization granted hereunder shall remain effective until (i) it is either expressly revoked on behalf of the Company or (ii) the beneficiary of this authorization significantly changes his business collaboration or other capacity in relation to the Company as existing on the date of this document, including the cessation of business. The express provisions of this letter set forth the entire authorization granted to the beneficiaries appointed above, and this document revokes and supersedes any prior authorizations by the undersigned within the scope of the authorization granted hereunder. We certify that we are not subject to denial of federal benefits, that includes FCC benefits, pursuant to Section 5301 of the Anti-Drug Abuse ACT of 1988, U.S.C. 862. Further, no party, as defined in 47 CFR 1.2002(b), to the application, is subject to denial of federal benefits, that includes FCC benefits. On behalf of STMICROELECTRONICS (ROUSSET) SAS Signature: Full Name: Pascal Scafidi Title: MDRF Group VP Quality & Reliability Email: [email protected] Phone: +33 4 76 58 50 00 Docusign Envelope ID: ED1E55EF-B927-487F-8005-2327319F79A3

ST Confidential REQUEST FOR CONFIDENTIALITY Federal Communications Commission Authorization and Evaluation Division 7435 Oakland Mills Road Columbia, Maryland 21046 Date: December 1, 2025 FCC ID: YCP-MB229300 To Whom it may concern: We hereby request the exhibits listed below to be held confidential: • Schematics • Block Diagram • Operational Description These exhibits contain trade secrets and proprietary information not customarily released to the public. The public disclosure of the material in these exhibits might provide unjustified benefits to our competitors and be harmful to our operations. Product name: NUCLEO-WBA25CE1 Model name: NUCLEO-WBA25CE1 Brand name: ST Sincerely yours, On behalf of: STMICROELECTRONICS (ROUSSET) SAS 190 Avenue Celestin Coq 13106 ROUSSET – France Signature Full Name: Pascal Scafidi Title: MDRF Group VP Quality & Reliability Email: [email protected] Phone: +33 4 76 58 50 00 Docusign Envelope ID: ED1E55EF-B927-487F-8005-2327319F79A3

Page 1/1 EXTERNAL PHOTOS OF TESTED EUT Applicant: STMicroelectronics (ROUSSET) SAS Device PMN: NUCLEO-WBA25CE1 Model: NUCLEO-WBA25CE1 Note : SMA connector only mounted for testing purpose

Page 1/1 PRODUCT LABELING Applicant: STMicroelectronics (Rousset) SAS Device PMN: NUCLEO-WBA25CE1 Model: NUCLEO-WBA25CE1 Marking on packaging

Page 1/1 INTERNAL PHOTOS OF TESTED EUT Applicant: STMicroelectronics (ROUSSET) SAS Device model: NUCLEO-WBA25CE1 Model: NUCLEO-WBA25CE1 Note : SMA connector only mounted for testing purpose BLE antenna (PCB)

RF Exposure Considerations for FCC ID: YCP-MB229300 The calculation of the MPE is as following: Prediction of MPE limit at a prediction distance: S= ² . . 4 . R G P  = ² . . 4 . . . R P R I E  S: Power density (mW/cm²) P: Peak output power at antenna terminal (mW) G: Numerical Antenna gain R: Distance of radiation to antenna (cm) MPE calculation (1): Power value is taken from EIRP (Max rated conducted power + antenna gain) (2): No simultaneous RF transmission Conclusion: Therefore, the device complies with FCC’s RF radiation exposure limits for general population for a mobile device. Certified By Laurent CHAPUS (Agent for this device) SGS France - SMEE 385, Rue René Rambaud ZA Le Parvis 2 38500 Voiron - France [email protected] Applicant for this device: STMicroelectronics (Rousset) SAS 190 Avenue Celestin Coq 13106 ROUSSET – France FRN: 0019756717 Frequency (MHz) Maximum EIRP including tune- up tolerance (mW) (1) R (cm) Power Density S (mW/cm²) MPE limit (mW/cm²) % of limit Limit (%) Verdict 2402-2480 4.95 20 0.00098 1 0.10 100% Below MPE limit for uncontrolled exposure Simultaneous transmissions SUM = N/A (2) 100%

Rapport d’essais / Test Report N° : AX25-01258.005 Page 1 / 33 SGS France - SMEE Connectivity & Products – 385 rue René Rambaud – ZA Le Parvis 2, 38500 VOIRON - France Membre du groupe SGS www.sgs.com Siège social : 29, avenue Aristide Briand 94110 Arcueil cedex - SAS au capital de 3 976 579 € - APE 7010Z - SIRET 552 031 650 - N° TVA Intracommunautaire : FR 91 552 031 650 FCC Test Firm Designation Number: FR0014 ISED Wireless Device Testing Laboratory CAB Number: FR0004 Matériel testé : Equipment under test: ST / NUCLEO-WBA25CE1 (Trademark / Marketing name or product reference) Demandeur de certification : Applicant for certification: STMicroelectronics (Rousset) SAS 190 Avenue Celestin Coq 13106 – ROUSSET – France Client : Customer: STMicroelectronics (Rousset) SAS 190 Avenue Celestin Coq 13106 – ROUSSET – France Numéro d’affaire : Work number : AX25-01258 Référence de la proposition : Proposal number: DC25-04822 Date de l’essai : Date of test: Du 22 au 27 Novembre 2025 November 22 nd to 27 th ,2025 Objectif des essais : Test purpose: EMC qualification accordingly to following standards: - CFR 47, FCC Part 15, Subpart C (Chapter 15.247 - Operation within the bands 902–928 MHz, 2400–2483.5 MHz, and 5725–5850 MHz) - Industry Canada RSS-247, Issue 4 (2025) (Digital Transmission Systems Operating in the Bands 2400–2483.5 MHz) Measurement standards: ANSI C63.10 (2020+A1/2024) Lieu du test: Test location: SMEE, 385 Rue René Rambaud 38500 VOIRON - France Test réalisé par : Test realized by: Chemseddine KERMICHE Conclusion : Conclusion: L’équipement satisfait aux prescriptions et essais des normes citées en référence. The appliance complies with requirements and tests of above mentioned standards. Ed. Date Modifications / Pages Written by: Visa Approved by: Visa 1 April 10 th , 2026 Initial Edition Chemseddine KERMICHE Test Engineer Laurent CHAPUS Technical Manager La copie de ce document n'est permise que sous sa forme intégrale. Ce document est le résultat d’essais effectués sur un échantillon. Il ne préjuge pas de la conformité de l’ensemble des produits fabriqués à l’objet essayé. Pour la déclaration de conformité de l'équipement, il n'est pas tenu compte de l'incertitude de mesure. L’utilisation de la marque d’accréditation COFRAC est interdite. This document shall not be reproduced, except in full. This document contains results related only to the item tested. It does not imply the conformity of the whole production to the item tested. For the declaration of conformity of the equipment, the measurement uncertainty is not taken into account. The use of the COFRAC accreditation mark is prohibited. Accréditation N° 1-7541 Portée disponible sur : Scope available on : www.cofrac.fr Page 2 / 33 Rapport d’essai / Test Report N° : AX25-01258.005 Page 2 / 33 Contents 1. NORMATIVES REFERENCES ......................................................................................................... 3 2. TEST SYNTHESIS ........................................................................................................................... 4 3. EQUIPMENT UNDER TEST (EUT) .................................................................................................. 5 4. TEST CONDITIONS ......................................................................................................................... 6 5. MODIFICATIONS OF THE EUT ....................................................................................................... 6 6. SPECIAL ACCESSORY ................................................................................................................... 6 7. MEASUREMENT UNCERTAINTY .................................................................................................... 6 8. FIELD STRENGTH CALCULATION ................................................................................................. 6 9. TEST SETUP DIAGRAM .................................................................................................................. 7 10. CONDUCTED EMISSION MEASUREMENT (150 KHZ-30MHZ) .................................................. 9 11. DTS BANDWIDTH ...................................................................................................................... 12 12. MAXIMUM PEAK OUTPUT POWER .......................................................................................... 15 13. MAXIMUM POWER SPECTRAL DENSITY LEVEL IN THE FUNDAMENTAL EMISSION .......... 18 14. UNWANTED EMISSIONS IN NON-RESTRICTED FREQUENCY BANDS (RADIATED EMISSIONS) .......................................................................................................................................... 21 15. UNWANTED EMISSIONS IN RESTRICTED FREQUENCY BANDS .......................................... 23 16. OCCUPIED BANDWIDTH (99%) ................................................................................................ 29 17. TEST EQUIPMENT LIST ............................................................................................................ 32 Page 3 / 33 Rapport d’essai / Test Report N° : AX25-01258.005 Page 3 / 33 1. Normatives References FCC qualification according to: Standards Applied Title ANSI C63.10 (2020+A1/2024) X American National Standard for Testing Unlicensed Wireless Devices CFR47, Part 15 (November 2025) X Telecommunication – Federal Communication Commission – Radio frequency devices, Sections 15.207 / 15.209 / 15.247 ISED qualification according to: Standards Applied Title ANSI C63.10 (2020+A1/2024) X American National Standard for Testing Unlicensed Wireless Devices RSS-Gen (Issue 5/2018, amendments 2019 and 2021) X General Requirements and Information for the Certification of Radio Apparatus RSS-247 (Issue 4/2025) X Digital Transmission Systems, Frequency Hopping Systems and Licence- Exempt Local Area Network Devices in 902-928 MHz, 2400-2483.5 MHz, 5150-5350 MHz, and 5470-5895 MHz bands Note: Following guidance are used - DTS Measurement G…

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Introduction This application note is dedicated to the STM32WB Series microcontrollers. One of the main reasons to use a PCB (printed circuit board) antenna is the reduced overall cost of the radio module. Well designed and implemented PCB-printed antennas have a similar performance to the SMD (surface-mounted device) ceramic equivalence. In general, the footprint for a ceramic SMD antenna is smaller than that for a PCB-printed variant. For a PCB-printed antenna solution, the increased size of the PCB in relation to space required for the antenna means that the radio module is larger and the cost of the PCB increased. However the PCB solution is generally cheaper than a SMD ceramic antenna. The demonstration and development boards for the STM32WB Series implement PCB printed antenna based on this application note. Low cost PCB antenna for 2.4 GHz radio: meander design for STM32WB Series AN5129 Application note AN5129 - Rev 4 - April 2019 For further information contact your local STMicroelectronics sales office. www.st.com 1General information This document applies to STM32WB Series Arm ® -based devices. Note:Arm is a registered trademark of Arm Limited (or its subsidiaries) in the US and/or elsewhere. AN5129 General information AN5129 - Rev 4 page 2/22 2Coordinate system For the purpose of this document, the spherical coordinate system illustrated in the figure below is used. Figure 1. Spherical coordinate system The PCB module is orientated vertically (plane X-Z) and located in proximity to the origin of the coordinate system. The azimuth angle radiates from the X-axis towards the Y-axis and the elevation angle radiates from the Z-axis towards the horizontal X-Y plane. Sometimes, as with geographical and navigational systems, the X-axis is called the "Nord-axis", the Yaxis is called the "East-axis" and the Z-axis is called the "Zenith-axis". AN5129 Coordinate system AN5129 - Rev 4 page 3/22 3Layout specification The PCB antennas, including the electrical parameters of PCB materials used, are layout sensitive. It is recommended to use a layout as close as possible to the one shown in the figure below. Figure 2. PCB antenna dimensions (in mm) The electrical parameters and performance of the PCB antenna are also determined by the substrate used, in particular the thickness of the core and dielectric constants. AN5129 Layout specification AN5129 - Rev 4 page 4/22 The figure below illustrates a typical cross-section of the substrate in a PCB-antennae area. Figure 3. PCB cross section at antennae area A substrate with the parameters as defined in the table below is recommended. Table 1. Recommended substrate specification Layer Dimensions Dielectric constant Ɛ R LabelValue (mil)Value (μm) Solder mask, topS10.717.784.4 Copper traceT1.640.64- CoreC28711.24.4 Solder mask, bottomS20.717.784.4 AN5129 Layout specification AN5129 - Rev 4 page 5/22 4Impedance matching Meander-like PCB antenna can be tuned to the required 50 Ω impedance by matching the impedance circuitry with the π topology. In Figure 2, the impedance matching area is marked with a dashed line. Under nominal conditions, this antenna exhibits and impedance very close to the required nominal impedance (50 Ω). To check the performance of this design, a sample antenna was manufactured (according to the specifications covered by this document). The figure below shows this antenna. Figure 4. Part of 802.15.4 and BLE PCB with meander-like antenna (scale around 4:1) Assuming that the manufactured sample exhibits the expected performance (no impedance matching necessary), the impedance matching circuitry is bypassed by two 100 pF capacitors connected in series, as shown in the figure below. Figure 5. Bypassing impedance matching circuitry - Direct RF connection All electrical parameters of the meander-like antenna have been measured at connection to the band-pass filter (BPF) with the frequency span covering frequencies from 2.4 GHz to 2.5 GHz. AN5129 Impedance matching AN5129 - Rev 4 page 6/22 Complex impedance of the antenna is shown in the Smith diagram in the figure below. Figure 6. Complex impedance of the meander-like antenna (Smith chart) The figure below shows the magnitude of the S11 parameter (in log scale). Figure 7. S11 parameter in logarithmic scale (Cartesian plot) AN5129 Impedance matching AN5129 - Rev 4 page 7/22 The figure below shows the standing wave ratio (SWR). Figure 8. Antenna standing wave ratio (SWR) The following changes affect the radiation impedance of the PCB antenna: • slight board size variation • metal shielding • use of plastic cover • presence of other components in proximity of the antenna The best performance impedance matching circuitry compensates these effects so that, for operating frequencies, the optimum 50 Ω impedance is achieved. AN5129 Impedance matching AN5129 - Rev 4 page 8/22 5Radiation pattern, 3-D visualization A three-dimensional (3-D) visualization of the radiation pattern (magnitude of the electrical far field |E|) is done for the center ISM band frequency 2.44175 GHz. Figure 9. 3-D radiation pattern overview Figure 10. Radiation pattern on X-Z plane AN5129 Radiation pattern, 3-D visualization AN5129 - Rev 4 page 9/22 6Radiation pattern, 2-D visualization In this section, all radiation patterns are related to the magnitude of electrical far field |E|, that is normalized and shown in the logarithmic scale (in dB). This means that the maximum global radiation pattern (maximum magnitude of the electrical far-field E) is represented by 0 dB level. To show the antenna radiation patterns in detail, three two dimensional (2-D) major cuts are presented. Consider the orientation of the module in the spherical coordinate system as shown in Figure 1. A three dimensional (3-D) far field radiation pattern is visualized as three two dimensional (2-D) cuts through a 3- D pattern. The following major planes are used for these cuts (see Figure 11): • one horizontal X-Y plane • two vertical planes: X-Z plan…

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Page 1/3 TEST SETUP PHOTOS Applicant: STMicroelectronics (ROUSSET) SAS Device PMN: NUCLEO-WBA25CE1 Model: NUCLEO-WBA25CE1 CONDUCTED EMISSIONS Page 2/3 RADIATED EMISSIONS (FREQ < 1GHz) Note: 9kHz-30MHz pre-scan measurement at 3m Page 3/3 RADIATED EMISSIONS (FREQ > 1GHz) Note: 18G-25GHz pre-scan measurement at 1.6m