DZLG65149APLAY LINK (WIRELESS ETHERNET BRIDGE)

1/1 PROPRIET AR Y NOTE: This drawing is the pr operty of Eleven Engineering Inc. (Eleven). It is fur nished in confidence for evaluation purposes only and shall not be disclosed or used for any other purpose except as specified by contact between the r ecipient and ELEVEN. Duplication of any portion of this data r equir es permission in writing fr om Eleven and shall include this legend. Sheet Number: 2004.10.27 Date: Drawing Number: Filename: G1.00 Revision: - Scale: ETHx Pr oject Name: ETH20 Pr oject Number: Inter nal Client: ETHx Block Diagram RGE01-040527-01 ETHx Block Diagram RF Section XInC Microcontr oller FPGA In terface Ethernet PHY Ethernet Transformer RJ45 Jack Power Jack 3.3V Regulator EEPROM 50 MHz XTAL MASTER/SLAVE Select NOTE : BLOCK DIAGRAM APPLICES TO BOTH THE MASTER AND SLAVE ENDS.

Wireless Ethernet Bridge FCC ID: DZLG65149A Operational Description The Wireless Ethernet Bridge requires two mated units of identical hardware to form a complete system, where one unit is defined as the master and one as the slave. The system is wireless Ethernet bridge to route Ethernet packets wirelessly between two points. An Ethernet packet is received by one of the Wireless Ethernet Bridge units. It is then converted into multiple packets to be transmitted to the mated unit. The mate then converts the multiple packets back into an Ethernet packet and transmits it on the Ethernet bus. Transmitter Operation There are two operating modes, connected and not connected. When the system is not connected, the master chooses a channel in the 900MHz ISM band and sends three small packets. If the slave does not respond then the master chooses another channel in the 900MHz ISM band and tries again. When the system is connected the transmitter resides on one channel in the 900MHz ISM band. It sends a small packet to its mate and waits for a response. When there is Ethernet data to be transmitted the transmitter notifies its mate and then sends the data. RF Section • The Transceiver IC is a fully integrated Low IF Radio Transceiver which uses Gaussian FSK Modulation XInC Microcontroller • The XInC Microcontroller is a parallel processor that controls the data flow from one unit to its partner unit. EEPROM • The EEPROM holds the Firmware image file that is extracted via serial interface at start up by the XInC Microcontroller. 50MHz Crystal • The 50MHz Crystal is a 3 rd overtone resonant crystal that is driven by the XInC Microcontroller. FPGA Interface • The FPGA Interface provides an interface between the XInC Microcontroller and the Ethernet PHY. • The FPGA Interface also provides clock signals for the Ethernet PHY and RF Section. Ethernet PHY • The Ethernet PHY is an Ethernet physical layer device that handles link control and data conversion from/to a Manchester Encoded twisted pair signal to a 4 – bit parallel data stream. Ethernet Transformer • The Ethernet transformer is a 1:1 isolation transformer for the Ethernet twisted pair signals. RJ-45 Jack • The RJ-45 Jack is the physical 8 pin connector to which a CAT5 twisted pair cable is connected to the unit. Power Jack • The Power Jack is where the unregulated DC power signal is applied to the unit. • The Power Jack is center positive. 3.3v Regulator • The 3.3v Regulator creates a uniform 3.3v DC power signal from the unregulated DC power signal of the Power Jack.

11 22 33 44 55 66 D D C C B B A A 11 /19/2 003 Dat e: Ti tl e: Revis io n: Part Number: Sheet: of 13 Drawn By: Dat e: Che cke d By: Dat e: App roved By: Prin t Date: RF with PA.Sch File Name: 11 /19/2 003 Patrick Fisher Tokaido RF TOK-2-090114 G3.05 Eleven Engineering To PAFrom PA PA - BFP450PA - BFP450.Sch To PA From PA ANT SWANT SW Tok aid o RFTok aid o RF.Sch 11 22 33 44 55 66 D D C C B B A A RF-GND RF-GND 47 0PFC421 0. 22U FC403 0. 01U FC408 RF-GND RF-GND 0. 22U FC406 RF-GND 0. 22U FC400 RF-GND 0. 22U FC401 RF-GND 0. 22U FC402 RF-GND RF-GND 0. 01U FC409 0. 22U FC405 RF-GND RF-GND RF-GND 33 00 PF C424 0. 047 UFC425 36 0RR401 10 RR400 RF-GND 0. 01U FC410 RF-GND 0. 22U FC407 RF-GND RF-GND 5PFC420 5PFC419 RF-VCC RF-VCC SMP132 2-01 6 D4 00 Di pol e Ant enn a Di pol e Ant enn a 0. 22U FC404 8PFC414 8PFC417 4PFC418 7PFC415 5PFC416 39 NHL40 0 Strip LineL40 1 Strip LineL40 2 Strip LineL40 4 RF-GND RF-GND RF-GND RF-GND RF-GND RF-GND 10 0PFC412 22 0PFC413 RF-GND RF-GND 18 pFC422 1. 5pFC423 Strip Line L40 3 RF-GND Strip Line 123456 789101112 J-RF CONJ1 RF-GND RF-VCC 62 0RR402 XCEN 1 RXON 2 PAON 3 EN 4 DAT A 5 CLK 6 TQ I 7 VSS 8 REF 9 RVCCI 10 QP O 11 GN D 12 VC C2 13 RVCC3 14 VT U NE 15 GN D 16 GND 17 GND 18 GND 19 GND 20 RRFI 21 RVCC4 22 TRFO 23 VCC5 24 GN D 25 VB G 26 RVCC6 27 RSSI 28 RVCC7 29 DIN 30 VD D 31 DO UT 32 U-ML27 22U4 00 RF-GND To PA 4PFC411 8PFC434 Strip LineL40 8 Strip LineL40 9 RF-GND RF-GND 1. 3KR408 RF-GND 11 /19/2 003 Dat e: Ti tl e: Revis io n: Part Number: Sheet: of 23 Drawn By: Dat e: Che cke d By: Dat e: App roved By: Prin t Date: To kaido RF. Sch File Name: 11 /19/2 003 Patrick Fisher Tokaido RF TOK-2-090114 G3.05 Eleven Engineering From PA ANT SW ANT SW 11 22 33 44 55 66 D D C C B B A A BFP450Q4 00 4. 7nHL40 7 10 nHL40 5 0. 5PFC428 68 PFC431 68 PFC426 10 RR405 15 KR4076. 8KR403 10 RR404 DNPR406 4PFC433 68 PFC427 68 PFC430 0. 1UFC432 6. 8nHL40 6 RF-GND RF-GND RF-GND RF-GND RF-GND To PA From PA Tokaido RF TOK-2-090114 G3.05 RF-VCC RF-GND 0. 22U FC429 RF-GND DNPC436 RF-GND 33 RR409 15 0RR411 15 0RR410 RF-GND RF-GND 11 /19/2 003 Dat e: Ti tl e: Revis io n: Part Number: Sheet: of 33 Drawn By: Dat e: Che cke d By: Dat e: App roved By: Prin t Date: PA - BFP450.Sch File Name: 11 /19/2 003 Patrick Fisher Eleven Engineering 22 PFC435

ETH-2-210111-G104e -- ETHx Main PCB ####### ValueFoot PrintDescriptionQTYReference DesignatorsMFG #1MFG #1 P/NMFG #2MFG #2 P/N 0.1uF0603Capacitor Ceramic Multilayer +80/-20%30 C101, C102, C103, C105, C106, C107, C108, C113, C114, C115, C116, C117, C202, C203, C204, C205, C206, C207, C208, C209, C216, C222, C223, C224 C104, C217, C218, C219, C220, C221 0.22uF0603 Capacitor Ceramic Multilayer, +80%-20% 1 C100 0R0802Resistor1 C502 1.2K0603Resistor 5%1 R216 1.5K0603Resistor 5%1 R223 1000pF0603Capacitor Ceramic Multilayer 10%1 C112 100K0603Resistor 5%1 R106 100uFC-Pol 5mmCapacitor Electrolytic Low ESR 20%1 C121 10K0603Resistor 5%7 R206, R207, R208, R209, R210, R211, R222 121R0603Resistor 1% (must be 1%)2 R202, R203 12K0603Resistor 5%1 R224 15pF0603Capacitor Ceramic Multilayer 10%1 R212 18pF0603Capacitor Ceramic Multilayer 10%2 C110, C111 191R0603Resistor 5%1 R102 1M0603Resistor 5%1 R103 1uF0603Capacitor Ceramic Multilayer 10%2 C225, C226 1uH1008Inductor 10%1 L1 220uFC-Pol 5mmCapacitor Electrolytic Low ESR 20%1 C122 22nH0603Inductor 10%1 R221 25LC640EIAJ SOIC8EEPROM1 U101 2K 1%0603Resistor 1%1 R215 33R0603Resistor 5%3 R213, R225 47K0603Resistor 5%2 R100, R101 50MHzHC49USCrystal, 30 ppm1 Y100 62R0603Resistor 5%1 R214 680pF0603Capacitor Ceramic Multilayer 10%1 C109 75R0603Resistor 5%2 R200, R201 ETHx MainPCB, ETH-2-210112-G1041 PCB eX64VQFP64FPGA1 U203ActeleX64-FTQ64 ICS1893BF SSOP48 (NEW) PHY1 U201ICSICS1893BF LF8505Transformer1 U200DeltaLF8505 RF PA CONRF PA PCBA interface connectionDNP CN101 Solder Manual assemblyMating Number Shorting pad (short as per assembly instructions) J100, J101, J102, J103, J104, J105, J106, J107, J108, J109, J110, J111 Solder Manual assemblyMaster / Slave Shorting pad (short as per assembly instructions) J112 SP6213Voltage Regulator, 2.51 U202SipexSP6213EC5-2.5 TLV2217-33 TO-220Voltage Regulator, 3.3V1 Q100TITLV2217-33 XInC Die1 U100ElevenXC1100 (FU9B667AY) DNP C500, C501 THREthernet Jack1 CN200 THRPower Jack1 CN102 THRLED, Green, 3mm1 D100 Mask off these locationsDNP CN100, CN400, CN401, CN402

TOK-2-090111-G306c - RF PA Board9/26/2004 Designator Comment Footprint Description MFG C408 0.01UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C409 0.01UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C410 0.01UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C425 0.047UF 0603 Capacitor Ceramic Multilayer, +-10%, >10V C432 0.1UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C400 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C401 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C402 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C403 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C404 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C405 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C406 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C407 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C429 0.22UF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V L405 0603C-10NJ 0603 TriTron - Wirewoud Inductor, 5%, SRF > 3500MHz, DCR < 0.3 ohm L407 0603C-4N7J 0603 TriTron - Wirewoud Inductor, 5%, SRF > 3500MHz, DCR < 0.3 ohm L406 0603C-6N8J 0603 TriTron - Wirewoud Inductor, 5%, SRF > 3500MHz, DCR < 0.3 ohm R408 1.3K 0603 Resistor Metal Film, 5%, 1/16W C412 100PF 0603 Capacitor Ceramic Multilayer, +- 0.5 PF, >10V R400 10R 0603 Resistor Metal Film, 5%, 1/16W R404 10R 0603 Resistor Metal Film, 5%, 1/16W R405 10R 0603 Resistor Metal Film, 5%, 1/16W R410 150R 0603 Resistor Metal Film, 5%, 1/16W R411 150R 0603 Resistor Metal Film, 5%, 1/16W R407 15K 0603 Resistor Metal Film, 5%, 1/16W C422 15PF 0603 Capacitor Ceramic Multilayer, +-5%, >10V C415 1PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V C413 220PF 0603 Capacitor Ceramic Multilayer, +- 0.5 PF, >10V C423 2PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V C424 3300PF 0603 Capacitor Ceramic Multilayer, +-10%, >10V R409 33R 0603 Resistor Metal Film, 5%, 1/16W R401 360R 0603 Resistor Metal Film, 5%, 1/16W L400 39NH 1008 TriTron - Wirewound Inductor, 10%, DCR < 2.0 ohm C421 470PF 0603 Capacitor Ceramic Multilayer, +-10%, >10V C411 4PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V C418 4PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V C416 5PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V C419 5PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V C420 5PF 0603 Capacitor Ceramic Multilayer, +- 0.25 PF, >10V R403 6.8K 0603 Resistor Metal Film, 5%, 1/16W R402 620R 0603 Resistor Metal Film, 5%, 1/16W C426 68PF 0603 Capacitor Ceramic Multilayer, +-10%, >10V C427 68PF 0603 Capacitor Ceramic Multilayer, +-10%, >10V C430 68PF 0603 Capacitor Ceramic Multilayer, +-10%, >10V C431 68PF 0603 Capacitor Ceramic Multilayer, +-10%, >10V C433 68PF 0603 Capacitor Ceramic Multilayer, +- 0.5 PF, >10V C435 68PF 0603 Capacitor Ceramic Multilayer, +80%-20%, >10V C414 8PF 0603 Capacitor Ceramic Multilayer, +- 0.5 PF, >10V C417 8PF 0603 Capacitor Ceramic Multilayer, +- 0.5 PF, >10V C434 8PF 0603 Capacitor Ceramic Multilayer, +- 0.5 PF, >10V Q400 BFP450E6327 SOT343 Infineon - BJT Transistor INFINEON BFP45 C428 DNP 0603 C436 DNP 0603 R406 DNP 0603 U400 ML2722DH QFP32 Micro Linear - RF Transceiver MICROLINEAR ML272 D400 SMP1322-016 SOT143 Skyworks - Dual Pin Diode SKYWORKS SMP13 L401 Strip Line Printed Inductor Printed Inductor L402 Strip Line Printed Inductor Printed Inductor L403 Strip Line Printed Inductor Printed Inductor L404 Strip Line Printed Inductor Printed Inductor L408 Strip Line Printed Inductor Printed Inductor L409 Strip Line Printed Inductor Printed Inductor PCB RF PA PCB TOK-2-090111-G3.05 PCB Antenna PCB TOK-2-090211-G2.00

Prediction of Human Exposure to Radio Frequency Energy for the Logitech Play Link Date:November 10, 2004 Model:G-65149A FCC ID:DZLG65149A Grantee:Bharat Shah, Compliance Manager, US Region Logitech Inc. 6505 Kaiser Dr Fremont, CA USA, 94555-3615 Phone: (510) 713-4777 Fax: (510) 792-8901 Email: [email protected] Statement Prepared by: Jason Gosior, P. Eng. Eleven Engineering Inc. 10150 – 100 Street, Suite 900 Edmonton, Alberta Canada T5J 0P6 The minimum distance for human exposure to RF energy is estimated below, as described in Title 47 CRR part 1.1307, Title 47 CRR, part 1.1310 and OET Bulletin 65, edition 97-10. Calculation performed for the general population exposure limit. Maximum Frequency of Operation: 928 MHz Exposure Limit: S= 0.619 mW/cm 2 EIRP: 17.15 dBm = 52 mW R= 2.6 cm Note: The ERP power estimate is based on measured values in a single polarization. An additional 3 dB is added to the ERP to account for the antenna emitting both horizontal and vertical polarized waves. STATEMENT: During Normal operating conditions, the user does not hold this device. It is normally placed beside a computer or game console, and the user is viewing the TV or computer screen. There is little risk that the user will be exposed RF energy exceeding the limit during normal operation. November 10, 2004 Jason Gosior Date S= EIRP 4
R 2 R= EIRP 4
S

11 22 33 44 55 66 D D C C B B A A 11 /19/2 003 Dat e: Ti tl e: Revis io n: Part Number: Sheet: of 13 Drawn By: Dat e: Che cke d By: Dat e: App roved By: Prin t Date: RF with PA.Sch File Name: 11 /19/2 003 Patrick Fisher Tokaido RF TOK-2-090114 G3.05 Eleven Engineering To PAFrom PA PA - BFP450PA - BFP450.Sch To PA From PA ANT SWANT SW Tok aid o RFTok aid o RF.Sch 11 22 33 44 55 66 D D C C B B A A RF-GND RF-GND 47 0PFC421 0. 22U FC403 0. 01U FC408 RF-GND RF-GND 0. 22U FC406 RF-GND 0. 22U FC400 RF-GND 0. 22U FC401 RF-GND 0. 22U FC402 RF-GND RF-GND 0. 01U FC409 0. 22U FC405 RF-GND RF-GND RF-GND 33 00 PF C424 0. 047 UFC425 36 0RR401 10 RR400 RF-GND 0. 01U FC410 RF-GND 0. 22U FC407 RF-GND RF-GND 5PFC420 5PFC419 RF-VCC RF-VCC SMP132 2-01 6 D4 00 Di pol e Ant enn a Di pol e Ant enn a 0. 22U FC404 8PFC414 8PFC417 4PFC418 7PFC415 5PFC416 39 NHL40 0 Strip LineL40 1 Strip LineL40 2 Strip LineL40 4 RF-GND RF-GND RF-GND RF-GND RF-GND RF-GND 10 0PFC412 22 0PFC413 RF-GND RF-GND 18 pFC422 1. 5pFC423 Strip Line L40 3 RF-GND Strip Line 123456 789101112 J-RF CONJ1 RF-GND RF-VCC 62 0RR402 XCEN 1 RXON 2 PAON 3 EN 4 DAT A 5 CLK 6 TQ I 7 VSS 8 REF 9 RVCCI 10 QP O 11 GN D 12 VC C2 13 RVCC3 14 VT U NE 15 GN D 16 GND 17 GND 18 GND 19 GND 20 RRFI 21 RVCC4 22 TRFO 23 VCC5 24 GN D 25 VB G 26 RVCC6 27 RSSI 28 RVCC7 29 DIN 30 VD D 31 DO UT 32 U-ML27 22U4 00 RF-GND To PA 4PFC411 8PFC434 Strip LineL40 8 Strip LineL40 9 RF-GND RF-GND 1. 3KR408 RF-GND 11 /19/2 003 Dat e: Ti tl e: Revis io n: Part Number: Sheet: of 23 Drawn By: Dat e: Che cke d By: Dat e: App roved By: Prin t Date: To kaido RF. Sch File Name: 11 /19/2 003 Patrick Fisher Tokaido RF TOK-2-090114 G3.05 Eleven Engineering From PA ANT SW ANT SW 11 22 33 44 55 66 D D C C B B A A BFP450Q4 00 4. 7nHL40 7 10 nHL40 5 0. 5PFC428 68 PFC431 68 PFC426 10 RR405 15 KR4076. 8KR403 10 RR404 DNPR406 4PFC433 68 PFC427 68 PFC430 0. 1UFC432 6. 8nHL40 6 RF-GND RF-GND RF-GND RF-GND RF-GND To PA From PA Tokaido RF TOK-2-090114 G3.05 RF-VCC RF-GND 0. 22U FC429 RF-GND DNPC436 RF-GND 33 RR409 15 0RR411 15 0RR410 RF-GND RF-GND 11 /19/2 003 Dat e: Ti tl e: Revis io n: Part Number: Sheet: of 33 Drawn By: Dat e: Che cke d By: Dat e: App roved By: Prin t Date: PA - BFP450.Sch File Name: 11 /19/2 003 Patrick Fisher Eleven Engineering 22 PFC435

Page 1 of 72 This report shall not be reproduced, except in full, without prior written approval of MPB Technologies Inc. Test Report Prepared By: Electronics Test Centre 27 East Lake Hill Airdrie, Alberta Canada T4A 2K3 [email protected] http://www.etc-mpb.com/ Telephone: (403) 912-0037 Facsimile: (403) 912-0083 MPBT Report No.: e12e3202-1 Release 1 Date: 8 November 2004 Emissions Testing of ETHx in accordance with FCC Part 15.249, Operation within the bands 902-928 MHz, 2400-2483.5 MHz, 5725-5875 MHZ, and 24.0-24.25 GHz. Test Personnel: Trung Nguyen, Jianming Zhang, David Raynes Prepared for: Eleven Engineering Inc. 10150 – 100 Street Suite 900 Edmonton, Alberta Canada T5J 0P6 Telephone: 1-780-425-6511 Facsimile: 1-780-425-7006 _________________________ Client Acceptance Authorized Signatory [email protected] Senior EMC Technologist Electronics Test Centre (Airdrie) Authorized Signatory Test Sample: ETHx FCC Part 15.249 (2000) Report Number: e12e3202-1 Release 1 Page 2 of 72 This report shall not be reproduced, except in full, without prior written approval of MPB Technologies Inc. TABLE OF CONTENTS 1.0 INTRODUCTION 1.1 S COPE 1.2 A PPLICANT 1.3 A PPLICABILITY 1.4 T EST SAMPLE DESCRIPTION 1.5 G ENERAL TEST CONDITIONS AND ASSUMPTIONS 1.6 S COPE OF TESTING 1.6.1 VARIATIONS IN TEST METHODS 1.6.2 EMISSIONS MEASUREMENTS 1.6.3 T EST SAMPLE MODIFICATIONS 2.0 A BBREVIATIONS 3.0 M EASUREMENT UNCERTAINTY 4.0 T EST CONCLUSION 4.1 CONDUCTED EMISSIONS AT AC LINES 4.2 RADIATED EMISSIONS INCLUDING RESTRICTED BANDS OF OPERATION 4.2 A RECEIVE MODE 4.2 B TRANSMIT MODE 5.0 T EST FACILITY 5.1 LOCATION 5.2 GROUNDING PLAN 5.3 P OWER 5.4 EMISSIONS PROFILE 5.5 TEST CONFIGURATION 5.5.1 T ABLETOP EQUIPMENT 5.5.2 R ACK MOUNT 6.0 T EST EQUIPMENT 6.1 RADIATED EMISSIONS 6.2 CONDUCTED EMISSIONS 6.3 CALIBRATION APPENDIX A: Test Sample Description: ETHx Test Sample: ETHx FCC Part 15.249 (2000) Report Number: e12e3202-1 Release 1 Page 3 of 72 This report shall not be reproduced, except in full, without prior written approval of MPB Technologies Inc. 1.0 INTRODUCTION 1.1 SCOPE The purpose of this report is to present the findings and results of compliance testing performed in accordance with CFR Title 47 FCC Part 15.249. 1.2 APPLICANT This test report has been prepared for Eleven Engineering Inc., located in Edmonton, Alberta, Canada. 1.3 APPLICABILITY All test procedures, limits, and results defined in this document apply to the Eleven Engineering Inc. ETHx unit, referred to herein as the Equipment Under Test (EUT). The results contained in this report relate only to the item tested. This report does not imply product endorsement by NVLAP or the Canadian or US governments. 1.4 TEST SAMPLE DESCRIPTION The test sample provided for testing was an ETHx wireless Ethernet bridge: Product Type: Commercial Model Number: Prototype Serial Number: Prototype Cables: - power cable - Ethernet cable - RS 232 cable Power Requirements: - 120 VAC - 0.3 amps - 60 Hz Peripheral Equipment: - computer laptop More detailed information is provided by Eleven Engineering Inc. in Appendix A. 1.5 GENERAL TEST CONDITIONS AND ASSUMPTIONS The EUT was set up and exercised using the configurations, modes of operation and arrangements defined in this report only. All inputs and outputs to and from other equipment associated with the EUT were adequately simulated. Where relevant, the EUT was only tested using the monitoring methods and test criteria defined in this report. Environmental conditions are recorded for each test. Test Sample: ETHx FCC Part 15.249 (2000) Report Number: e12e3202-1 Release 1 Page 4 of 72 This report shall not be reproduced, except in full, without prior written approval of MPB Technologies Inc. 1.6 SCOPE OF TESTING Testing was performed in accordance with FCC Part 15.249 Subpart C (2000), and ANSI C63.4 (2000). 1.6.1 V ARIATIONS IN TEST METHODS There were no variations from the test procedures outlined above. 1.6.2 M ARGINAL EMISSIONS MEASUREMENTS As noted in Section 4, some emissions were measured to be within -6 dB of the specified limit: 1.6.3 T EST SAMPLE CONFIGURATION & MODIFICATIONS No EUT modifications were performed in order to meet the specifications. 2.0 ABBREVIATIONS AP -Average Peak CE -Conducted Emissions E -Field - Electric Field H -Field - Magnetic Field N/T -Not Tested N/A -Not Applicable PK -Peak QP -Quasi Peak RE -Radiated Emissions 3.0 MEASUREMENT UNCERTAINTY For Radiated E-Field Emissions and Conducted Emissions, the uncertainties in the measurements were calculated using the methods outlined in the NAMAS document, NIS81: May 1984. Frequency = ± 1 kHz Amplitude (RE) = ± 4.01 dB Amplitude (CE) = ± 3.25 dB Test Sample: ETHx FCC Part 15.249 (2000) Report Number: e12e3202-1 Release 1 Page 5 of 72 This report shall not be reproduced, except in full, without prior written approval of MPB Technologies Inc. 4.0 TEST CONCLUSION STATEMENT OF COMPLIANCE The client equipment referred to in this report was found to comply with the requirements as stated below. The EUT was subjected to the following tests. Compliance status is reported as PASS or FAIL. Test conditions that are not applicable to the EUT are marked n/a. If testing was not performed at this time, the appropriate field is marked n/t. The following table summarizes the test results in terms of the specification and class or level applied, the unique test sample identification, the EUT modification state, and configuration as applicable. TEST CASE TEST TYPE SPECIFICATION TEST SAMPLE MOD. STATE CONFIGURATION RESULT §4.1 Conducted Emissions at AC lines FCC Part 15.107 and 15.207 ETHx nil See § 1.6.3 PASS §4.2a Radiated Emissions (Rx Mode) FCC Part 15.109 ETHx nil See § 1.6.3 PASS §4.2b Radiated Emissions (Tx Mode) FCC Parts 15.205, 15.209 and 15.249 ETHx nil See § 1.6.3 PASS Test Sample: ETHx FCC Part 15.249 (2000) Report Number: e12e3202-1 Release 1 Page 6 of 72 This report shall not be reproduced, except in full, without prior written approval of MP…

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Last Revised 11/18/2004 Confidentiality and Proprietary Note: This document is the property of Eleven Engineering Incorporated ("Eleven"). It is furnished in confidence for evaluation purposes only and shall not be disclosed or used for any other purposes except as specified by contract between the recipient and Eleven. Duplication of any portion of this data requires permission in writing from Eleven and shall include this legend. Page 1 of 2 Logitech Play Link Additional Emission Information, Occupied BW at the Band Edge Date:November 19, 2004 Model:G-65149A FCC ID:DZLG65149A IC:1807D – G65149A Grantee:Bharat Shah, Compliance Manager, US Region Logitech Inc. 6505 Kaiser Dr Fremont, CA USA, 94555-3615 Phone: (510) 713-4777 Fax: (510) 792-8901 Email: [email protected] Statement Prepared by: Jason Gosior, P. Eng. Eleven Engineering Inc. 10150 – 100 Street, Suite 900 Edmonton, Alberta Canada T5J 0P6 The Logitech Play Link uses a total of 8 channels. The upper and lower channels are centered around 905.21 MHz and 923.96 MHz. The channels were chosen to comply with the band edge requirement of –50 dBc at the band edge. The measurements below were taken using a radiated measurement, using a HP8596E and an in-band antenna. The plots were generated using Labveiw. 902 MHz Band Edge Band Edge:-58.9 dBc Operating Channel: 905.21 MHz Analyzer Settings: SPAN: 10 Mhz RBW:100 KHz VBW:3 MHz Last Revised 11/18/2004 Confidentiality and Proprietary Note: This document is the property of Eleven Engineering Incorporated ("Eleven"). It is furnished in confidence for evaluation purposes only and shall not be disclosed or used for any other purposes except as specified by contract between the recipient and Eleven. Duplication of any portion of this data requires permission in writing from Eleven and shall include this legend. Page 2 of 2 928 MHz Band Edge Band Edge:-63.7 dBc Operating Channel: 923.96 Analyzer Settings: SPAN: 10 Mhz RBW:100 KHz VBW:3 MHz November 19, 2004 Jason Gosior Date