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QISMU509CHSDPA Module

Huawei Technologies Co.,Ltd
HSDPA Module - FCC ID QISMU509C - Huawei Technologies Co.,Ltd
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Application Details

Equipment Class
JBP - Part 15 Class B Computing Device Peripheral
Date of Grant
Nov 22, 2010
Application Purpose
Original Equipment
Date of Application
Nov 22, 2010
Equipment Note
HSDPA Module
Company
Huawei Technologies Co.,Ltd
Country
China

Documents & Files

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Users Manual

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Cover Letter(s)

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External Photos

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ID Label/Location Info

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Internal Photos

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Test Report

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Test Setup Photos

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Document Text

Text extracted from the exhibit documents filed with the FCC. Open a document above to read the original.

Users Manual

Copyright © Huawei Technologies Co., Ltd. 2010. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders under licenses. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. Other trademarks, product, service and company names mentioned are the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and may not be activated or may be limited by local network operators or network service providers, thus the descriptions herein may not exactly match the product or its accessories you purchase. Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation. NO WARRANTY THE CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS. Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and will obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein. i Contents Getting to Know the MU509..................................................................... 1 PCB Design........................................................................................... 3 Assembly.............................................................................................. 5 Thank you for purchasing HUAWEI MU509-c HSDPA Module (hereinafter referred to as the MU509) Note: „ This manual briefly describes the preparation, the process for PCB Design, Assembly and safety precautions. „ You are recommended to read the manual before using the MU509. Getting to Know the MU509 The package of the LGA module is 116 pin LGA with a dimension of 30 mm × 30 mm × 2.5 mm and the pitch of 1.5 mm. It is applied to the user interface board, and can be used as a wireless terminal in a network environment. 1 2 3 PCB Design CB Pad Design To achieve high efficiency of the production and solder joints of high reliability, it is recommended that the PCB pad size be designed as follows: the size of the middle region is the same as the pad size of the product package; other pads are 0.05 mm larger than the unilateral pad of the product package. For details, see the following figure: Requirements on PCB Layout „ Other devices must be located more than 3 mm away from the LGA module. It is recommended to be 5 mm. The minimum distance between the LGA module and the PCB edge is 1.5 mm. „ When the PCB layout is double sided, it is recommended that the LGA module be placed on the second side for assembly. 4 5 Design of Solder Mask The PCB pad design can be solder mask defined (SMD), or non-solder mask defined (NSMD). NSMD is recommended. In addition, the solder mask of the NSMD pad design is larger than the pad so the reliability of the solder joint can be improved. The solder mask must be 100 um to150 um larger than the pad, that is, the single side of the solder mask must be 50 um to 75 um larger than the pad. The specific size depends on the processing capability of the PCB manufacturer. Assembly Stencil Design It is recommended that the stencil for the LGA module be 0.12 mm in thickness. For the stencil design, see the following figure: Reflow Profile For the soldering temperature of the LGA module, see the following figure: 6 Reflow parameters: Preheat zone (40–150°C) Time: 60–120sec Heating rate: 0.5–2°C/sec Soak zone (150-200°C) Time: 60–120sec Heating rate: <1.0°C/sec Reflow zone (> 217°C) Time: 30–90sec Peak reflow temperature: 230–260°C Cooling zone Cooling rate: 1°C/sec ≤ Slope ≤ 4°C/sec 7

Users Manual

Copyright © Huawei Technologies Co., Ltd. 2009. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. The product described in this manual may include copyrighted software of Huawei Technologies Co., Ltd and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders under licenses. Trademarks and Permissions , , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. Other trademarks, product, service and company names mentioned are the property of their respective owners. Notice Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and may not be activated or may be limited by local network operators or network service providers, thus the descriptions herein may not exactly match the product or its accessories you purchase. Huawei Technologies Co., Ltd reserves the right to change or modify any information or specifications contained in this manual without prior notice or obligation. NO WARRANTY THE CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO CASE SHALL HUAWEI TECHNOLOGIES CO., LTD BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOST PROFITS, BUSINESS, REVENUE, DATA, GOODWILL OR ANTICIPATED SAVINGS. Import and Export Regulations Customers shall comply with all applicable export or import laws and regulations and will obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein. Warnings and Precautions This section contains important information pertaining to the operating instructions of your device. It also contains information about how to use your device safely. Read this information carefully before using the device. Electronic Device Do not use your device if using the device is prohibited. Do not use the device when using the device causes danger or interference with electronic devices. Medical Device z Follow rules and regulations set forth by hospitals and health care facilities. Do not use your device when using the device is prohibited. z Some wireless devices may affect the performance of hearing aids or pacemakers. For any such problems, consult your service provider. z If you are using an electronic medical device, consult the doctor or the device manufacturer to confirm whether radio waves affect the operation of this device. Potentially Explosive Atmosphere Do not use your device in any area with a potentially explosive atmosphere, and comply with all signs and instructions. Areas that may have potentially explosive atmospheres include the areas where you would normally be advised to turn off your vehicle engine. Triggering of sparks in such areas could cause an explosion or a fire, resulting in bodily injuries or even deaths. Do not use your device at refueling points such as service stations. Comply with restrictions on the use of radio equipment in fuel depots, storage, and distribution areas, and chemical plants. In addition, adhere to restrictions in areas where blasting operations are in progress. Before using the device, watch out for areas that have potentially explosive atmospheres that are often, but not always, clearly marked. Such locations include areas below the deck on boats, chemical transfer or storage facilities, and areas where the air contains chemicals or particles such as grain, dust, or metal powders. Ask the manufacturers of vehicles using liquefied petroleum gas (such as propane or butane) whether this device can be safely used in their vicinity. Traffic Security z Observe local laws and regulations while using the device. To prevent accidents, do not use your wireless device while driving. z RF signals may affect electronic systems of motor vehicles. For more information, consult the vehicle manufacturer. z In a motor vehicle, do not place the device over the air bag or in the air bag deployment area. Otherwise, the device may hurt you owing to the strong force when the air bag inflates. z Do not use your device while flying in an aircraft and before boarding an aircraft. Using wireless devices in an aircraft may cause danger to the operation of the aircraft and disrupt the wireless telephone network. It may also be considered illegal. Operating Environment z Do not use the device in dusty, damp, and dirty places or places with magnetic fields. Otherwise, it may result in malfunction of the circuit. z On a stormy day with thunder, do not use your device when it is being charged, to prevent any danger caused by lightning. z While using the device, observe the local laws and regulations, and respect others' privacy and legal rights. Safety of Children Comply with all precautions with regard to children's safety. Letting the child play with your device or its accessories, which may include parts that can be detached from the device, may be dangerous, as it may present a choking hazard. Ensure that small children are kept away from the device and accessories. Accessories Use the accessories delivered only by the manufacturer. Using accessories of other manufacturers or vendors with this device model may invalidate any approval or warranty applicable to the device, result in the non-operation of the d…

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Cover Letter(s)

Huawei Technologies Co., Ltd. Address:Huawei Industrial Base,Bantian Longgang,Shenzhen, P.R China Post ZIP:518129 Page :1/1 To: CETECOM Fax : NULL From:Zhang Xinghai Fax:0086-755-89652518 Tel:0086-755-89651014 Email address: [email protected] Http: www.huawei.com Subject:Letter of Confidentiality Federal Communications Commission 7435 Oakland Mills Road Columbia, MD 21046 Gentlemen: This letter is to comply with the Code of Federal Regulations Title 47 Section 0.457 and 0.459 pertaining to confidential material. Huawei Technologies Co., Ltd. would like the following documents regarding this submission for FCC ID: QISMU509C to be kept confidential: 1. Schematic diagram . 2. Block Diagram. 3. Parts list (BOM) Information. 4. Operational description. 5. Tune-up procedure The above material contains trade secrets or technical data, which would customarily be guarded from competitors. We do not want these documents to be accessible to the general public. Sincerely, For and Behalf of: Huawei Technologies Co., Ltd. Zhang Xinghai EMC Laboratory Manager

Cover Letter(s)

Huawei Technologies Co., Ltd. Administration Building, Huawei Base, Bantian, Longgang District, Shenzhen 518129 P.R.C. +86 755 28780808 www.huawei.com Huawei internal reference RCT-US-01-01 USA FCC Short Term Confidentiality Request template Effective date: 2007-01-06 Version 1.1 Short Term Confidentiality Request 2010-11-23 Federal Communications Commission Office of Engineering and Technology Equipment Authorization Division 7345 Oakland Mills Road Columbia, Maryland 21046 Subject: SHORT-TERM Confidentiality Request for FCC ID: QISMU509C Product Name: HSDPA Module Product Model: MU509-c To whom maybe concern: Pursuant to sections 0.457 and 0.459 of CFR 47 and to avoid premature release of sensitive information prior to marketing or release of the product to the public, Huawei Technologies Co., Ltd requests the following documents contained in this certification application be temporarily withheld from public disclosure for an initial period of 90 days: 1. External Photos 2. Internal Photos 3. Test Setup Photos 4. Users Manual The applicant also acknowledges that they will also provide appropriate notice to CETECOM should either of the following occur: A) If the applicant requires additional 45 day extension periods they will notify CETECOM with a new request letter at least 7 days prior to the short-term confidentiality expiration date-[Note: up to maximum of 3 extensions only are allowed], or b) Immediately notify CETECOM in the event the information regarding the product of the product is made available to the public. CETECOM will then release the documents listed above for public disclosure pursuant to FCC Public Notice DA 04-1705. Sincerely,

External Photos

MU509-c SECRET Page1,Total 4 External Photos of MU509-c MU509-c SECRET Page2,Total 4 MU509-c SECRET Page3,Total 4 MU509-c SECRET Page4,Total 4

ID Label/Location Info

MU509-c SECRET Page1, Total1 ID Label Location MU509-c

Internal Photos

MU509-c SECRET Page1, Total2 Internal Photos of MU509-c MU509-c SECRET Page2, Total2

Test Report

FCC&IC EMC Test Report Product Name: HSDPA Module Model Number: MU509-c Report No: SYBH (Z-EMC)005112010-2 FCC ID: QISMU509C IC ID:6369A-MU509C Reliability Laboratory of Huawei Technologies Co., Ltd. Huawei Base, Bantian, Longgang District, Shenzhen 518129, P.R. China Tel: +86 755 28780808 Fax: +86 755 89652518 Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Written Permission Page1, Total38 FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Written Permission Page2, Total38 Notice 1 1. The laboratory has obtained the accreditation of China National Accreditation Service for Conformity Assessment (CNAS), and accreditation number: L0310. 2. The laboratory has been listed on the US Federal Communications Commission list of test facilities recognized to perform electromagnetic emissions measurements. The site recognition number is 97456. 3. The laboratory has been listed by industry Canada to perform electromagnetic emission measurement. The site recognition number is 6369A-1. 4. The test report is invalid if not marked with "exclusive stamp for the test report". 5. The test report is invalid if not marked with the stamps or the signatures of the persons responsible for performing, revising and approving the test report. 6. If there is any dissidence for the test report, please file objection to the test centre within 15 days from the date of receiving the test report. 7. Normally, the test report is only responsible for the samples that have undergone the test. 8. Context of the test report cannot be used partially or in full for publicity and/or promotional purposes without previous written approval of the laboratory. FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Notice 2 Modification Information: Table 1 Modification Information 1 2 3 4 5 6 Modification Information 7 Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Written Permission Page3, Total38 FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C REPORT ON HSDPA Module M/N: MU509-c REGULATION FCC CFR47 Part 15: Subpart B; CAN/CSA-CEI/IEC CISPR 22; FCC CFR47 Part 22:Subpart H; FCC CFR47 Part 24: Subpart E; RSS-Gen; RSS-132; RSS-133; START OF TEST Nov.1,2010 END OF TEST Nov.7,2010 Final Judgement: Pass Approved By 2010-11-17 Liuchunlin Date Name Signature Reviewed By 2010-11-17 Dailinjun Date Name Signature Operator 2010-11-17 Liaoxiaoping Date Name Signature Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Written Permission Page4, Total38 FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Written Permission Page5, Total38 REPORT BODY CONTENT 1 Status ............................................................................................................................................6 1.1 Product Information.......................................................................................................................6 1.2 Test Site ........................................................................................................................................6 1.3 Test environment condition...........................................................................................................6 2 Summary of Results......................................................................................................................7 3 Equipment Specification ...............................................................................................................8 3.1 General Description ......................................................................................................................8 3.2 Sub-Assembly Identity ..................................................................................................................8 4 System Configuration during EMC Test .......................................................................................8 4.1 Cables Used during Test ..............................................................................................................8 4.2 Associated Equipment Used during Test .....................................................................................8 4.3 Test Configurations and Test Mode..............................................................................................9 4.4 Test conditions and test Connections...........................................................................................9 5 Electromagnetic Interference (EMI) ............................................................................................11 5.1 Radiated Disturbance 30MHz to18000MHz...............................................................................11 5.2 Conducted Disturbance 0.15 MHz to 30MHz.............................................................................12 5.3 Radiated Spurious Emissions.....................................................................................................14 6 Receiver Spurious Emission (Radiated).....................................................................................17 7 Main Test Instruments ................................................................................................................18 8 System Measurement Uncertainty..............................................................................................18 9 Graph and Data of Emission Test...............................................................................................19 9.1 Radiated Disturbance .................................................................................................................19 9.2 Conducted Disturbance ...................................................…

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Test Setup Photos

FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page1, Total7 Photos of EUT FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page2, Total7 MU509-c Appearance FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page3, Total7 Photos of Test Setup FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page4, Total7 1 Radiated Emissions Radiated Disturbance (30MHZ-1GHZ) Radiated Disturbance (1GHZ-18GHZ) FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page5, Total7 2 Radiated Spurious Emissions Radiated Spurious Emission (below 3GHz) Radiated Spurious Emission (3GHz to18GHz) FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page6, Total7 Radiated Spurious Emission 18G~26.5GHz FCC Test Report of MU509-c FCC ID: QISMU509C IC ID: 6369A-MU509C Security Level: secret Report No: SYBH (Z-EMC)005112010-2 Confidential Information of Huawei. No Distribution without Permission Page7, Total7 3 Conducted Emissions Conducted Emissions for AC Power

Contact Information

Applicant

Zhang Xinghai
[email protected]+86-755-2897-0299Fax: +86-755-8965-0226

Test Firm

Huawei Technologies Co., LTDZhou Fengyum
[email protected]86-755-28782917Fax: 86-755-89650226

Technical Specifications

#Rule PartsFrequency RangePower Output
115B--
Modular Type
Limited Single Modular Approval
Confidentiality
Long Term

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