X3ZBTMOD8Bluetooth Module

BT53 Datasheet Amp’ed RF Technology, Inc. Phone: +1 408 213-9530 | Fax: 408-213-9533 | E-mail: [email protected] Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131 电话：+86 022-83945100 | 传真：+86 022-83945100转111 | E-mail: [email protected] 地址：天津市华苑产业区海泰西路18号西3B-202（300384） BT53 Product Specification 11.6mm x 13.5mm Description Our micro-sized Bluetooth module, with integrated antenna, is the smallest form factor available providing a complete RF platform. The BT53 is supports both Bluetooth Classic and Low Energy, version v4.0. The BT53 is a surface mount PCB module that provides fully embedded, ready to use Bluetooth wireless technology. Our standard abSerial and Amp’edUP Stack are pre-flashed into the integrated flash memory, supporting the SPPprofile. Other standard Bluetooth profiles are also available. Customized firmware for peripheral device interaction, power optimization, security, and other proprietary features may be supported and can be ordered pre-loaded and configured. BT53 Features Bluetooth features  FCC &Bluetooth licensed radio  Bluetooth v4.0  Class 1 radio  Range up to 80m LOS  1.5Mbps data throughput  128-bit encryption security Hardware configuration  Cortex-M4microprocessor up to 84MHz  256K bytes Flash memory  64K bytes RAM memory  UART, up to 2M baud  SPI and I2C interfaces  7 general purpose I/O  4x12-bit A/D inputs  1 LPO input Embedded software  Amp’edUPdual mode Bluetooth stack: BT Classic and BT Low Energy  abSerial, AT command set  SDK, Software Development Kit (Optional)  BlueGuard, data encryption software (Optional)  Mobile application software (Optional) Additional documentation  abSerial User Guide  abSerial Reference Guide  abSerial Configuration Guide Phone: +1 408 213-9530 | Fax: 408-213-9533 | E-mail: [email protected] Address : 1879 Lundy Ave, ste. 138, San Jose, CA 95131 电话：+86 022-83945100 | 传真：+86 022-83945100转111 | E-mail: [email protected] 地址：天津市华苑产业区海泰西路18号西3B-202（300384） 3 Table of Contents BT53 Product Specification ................................................................................................................................................ 2 Description ......................................................................................................................................................................... 2 1 Software Architecture ................................................................................................................................................. 4 1.1 Lower Layer Stack ..................................................................................................................................................... 4 1.2 Upper Layer Stack: Amp’ed UP ................................................................................................................................. 4 1.3 HCI Interface .............................................................................................................................................................. 4 1.4 AT Command Set: abSerial ....................................................................................................................................... 4 2 Hardware Specifications ............................................................................................................................................ 5 2.1 Recommended Operating Conditions ........................................................................................................................ 5 2.2 Absolute Maximum Ratings ....................................................................................................................................... 5 2.3 Current Consumption ................................................................................................................................................. 5 2.4 Selected RF Characteristics....................................................................................................................................... 6 2.5 I/O Operating Characteristics ..................................................................................................................................... 6 2.6 Pin Assignment .......................................................................................................................................................... 7 2.7 Pin Placement Diagram (Top View) ........................................................................................................................... 8 2.8 Layout Drawing .......................................................................................................................................................... 8 3 Module Block Diagram ............................................................................................................................................... 9 4 Hardware Design ....................................................................................................................................................... 9 4.1 Module Reflow Installation ......................................................................................................................................... 9 4.2 GPIO Interface ......................................................................................................................................................... 10 4.3 UART Interface ........................................................................................................................................................ 10 4.4 PCB Layout Guidelines ............................................................................................................................................ 11 4.5 Reset Circuit ............................................................................................................................................................. 11 4.6 External LPO Input Circuit.........…

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FCC-Confidentiality Request Letter Date: Dec30, 2014 To: Federal Communications Commission, Authorization & Evaluation Division, 7435 Oakland Mills Road, Columbia, MD21046 Re:Cambridge Executive Limited FCC ID: X3ZBTMOD8 FCC Part 15C Certification Confidentiality Request Gentlemen: This letter is to comply with 47 CFR 0.457and 0.459 pertaining to confidentiality material. Amp’ed RF Technology, Inc.requests that the following documents regarding this submission will be kept confidential: Exhibit Type File Name Block Diagram Block Diagram.pdf Schematics Circuit Diagram.pdf Operational Description Operational Description.pdf Part list BOM.pdf Those documents contain detailed system and equipment description and related information about the product which Amp’ed RF Technology, Inc.considers to be confidential proprietary, a custom design and,otherwise, not releasable to the general public. Since this design is a basis form which future technological products will evolve,Amp’ed RF Technology, Inc.considers this information would be of benefit to its competitors, and that the disclosure of the information in these documents would give competitors an unfair advantage in the market. Yours Sincerely, Name: Annie Cai Title: Operation Manager Company: Amp’ed RF Technology, Inc.

Part Number: BT53 FCC ID : X3ZBTMOD8 Request for Modular Approval Dec 30, 2014 In accordance with FCC Part 15, we, Amp’ed RF Technology, Inc., hereby request a modular level approval as outlined in FCC document DA 00 – 1407, for the device listed above. In support of the Single Modular Transmitter Approval, the following is stated: 1) The module does have buffered modulation / data inputs. 2) The module does regulate its own power supply. 3) The module does have a permanently attached antenna. 4) The module can be tested as a stand-alone device. 5) The module is labeled with the proper FCC ID, and labeling instructions are provided to OEM end users for external product labels. 6) The module does have instruction for proper use. 7) The module does meet the FCC RF regulations. 8) The module does have its own RF shielding. Signature: Name: Annie Cai Title: Operation Manager Company: Amp’ed RF Technology, Inc.

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Model: BT53 Input 2.5V 50mA Made in China Contains Transmitter Module FCC ID: X3ZBTMOD8 IC: 8828A-MOD8 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Produkte Products TÜV Rheinland (Shanghai) Co., Ltd  West Guangzhong Road, Zhabei District, Shanghai  Tel.: +86 21 6108 1188  Fax: +86 21 6108 1199 Mail: [email protected]  Web: www.tuv.com Prüfbericht-Nr.: Test Report No.: 15078515 001 Auftrags-Nr.: Order No.: 154082117 Seite 1 von 72 Page 1 of 72 Kunden-Referenz-Nr.: Client Reference No.: 490858 Auftragsdatum: Order date: 16.10.2014 Auftraggeber: Client: Amp’ed RF Technology, Inc. 1879 Lundy Ave, Suite 138, San Jose, CA, 95131, United States Prüfgegenstand: Test item: Bluetooth Module Bezeichnung / Typ-Nr.: Identification / Type No.: BT53 FCC ID: X3ZBTMOD8 IC: 8828A-MOD8 Auftrags-Inhalt: Order content: Complete test Prüfgrundlage: Test specification: FCC CFR47 Part 15, Subpart C ANSI C63.4-2009 KDB 558074 D01 DTS Meas Guidance v03r02 Public Notice DA 00-705: Filing and Measurement Guidelines for Frequency Hopping Spread Spectrum Systems (March 30, 2000) RSS-Gen Issue 3, December 2010 RSS-210 Issue 8, December 2010 Wareneingangsdatum: Date of receipt: 16.10.2014 Prüfmuster-Nr.: Test sample No.: A000152374 002 Prüfzeitraum: Testing period: 06.11.2014 - 13.11.2014 Ort der Prüfung: Place of testing: MRT Technology (Suzhou) Co., Ltd Prüflaboratorium: Testing laboratory: TÜV Rheinland (Shanghai) Co., Ltd. Prüfergebnis*: Test result*: Pass geprüft von / tested by: 19.12.2014 Adrian Shi / PE kontrolliert von / reviewed by: 19.12.2014 Shi Li / Reviewer Datum Date Name / Stellung Name / Position Unterschrift Signature Datum Date Name / Stellung Name / Position Unterschrift Signature Sonstiges / Other: Zustand des Prüfgegenstandes bei Anlieferung: Condition of the test item at delivery: Prüfmuster vollständig und unbeschädigt Test item complete and undamaged * Legende: 1 = sehr gut 2 = gut 3 = befriedigend 4 = ausreichend 5 = mangelhaft P(ass) = entspricht o.g. Prüfgrundlage(n) F(ail) = entspricht nicht o.g. Prüfgrundlage(n) N/A = nicht anwendbar N/T = nicht getestet Legend: 1 = very good 2 = good 3 = satisfactory 4 = sufficient 5 = poor P(ass) = passed a.m. test specification(s) F(ail) = failed a.m. test specification(s) N/A = not applicable N/T = not tested Dieser Prüfbericht bezieht sich nur auf das o.g. Prüfmuster und darf ohne Genehmigung der Prüfstelle nicht auszugsweise vervielfältigt werden. Dieser Bericht berechtigt nicht zur Verwendung eines Prüfzeichens. This test report only relates to the a. m. test sample. Without permission of the test center this test report is not permitted to be duplicated in extracts. This test report does not entitle to carry any test mark. Produkte Products Prüfbericht - Nr.: Test Report No. 15078515 001 Seite 2 von 72 Page 2 of 72 TEST SUMMARY 5.1.1 ANTENNA REQUIREMENT RESULT: Pass 5.1.2 PEAK OUTPUT POWER RESULT: Pass 5.1.3 20DB BANDWIDTH AND 99% BANDWIDTH RESULT: Pass 5.1.4 6DB BANDWIDTH AND 99% BANDWIDTH RESULT: Pass 5.1.5 CONDUCTED SPURIOUS EMISSIONS MEASURED RESULT: Pass 5.1.6 POWER SPECTRAL DENSITY RESULT: Pass 5.1.7 SPURIOUS EMISSION RESULT: Pass 5.1.8 FREQUENCY SEPARATION RESULT: Pass 5.1.9 NUMBER OF HOPPING FREQUENCY RESULT: Pass 5.1.10 TIME OF OCCUPANCY RESULT: Pass 5.1.11 CONDUCTED EMISSIONS RESULT: Pass Produkte Products Prüfbericht - Nr.: Test Report No. 15078515 001 Seite 3 von 72 Page 3 of 72 Contents 1. GENERAL REMARKS ......................................................................................................... 4 1.1 COMPLEMENTARY MATERIALS .......................................................................................... 4 2. TEST SITES ...................................................................................................................... 4 2.1 TEST FACILITIES ............................................................................................................... 4 2.2 LIST OF TEST AND MEASUREMENT INSTRUMENTS ............................................................... 5 2.3 TRACEABILITY .................................................................................................................. 5 2.4 CALIBRATION ................................................................................................................... 5 2.5 MEASUREMENT UNCERTAINTY........................................................................................... 6 3. GENERAL PRODUCT INFORMATION .................................................................................... 7 3.1 PRODUCT FUNCTION AND INTENDED USE ........................................................................... 7 3.2 RATINGS AND SYSTEM DETAILS ........................................................................................ 7 3.3 INDEPENDENT OPERATION MODES .................................................................................... 8 3.4 NOISE GENERATING AND NOISE SUPPRESSING PARTS ....................................................... 8 3.5 SUBMITTED DOCUMENTS .................................................................................................. 8 4. TEST SET-UP AND OPERATION MODES .............................................................................. 9 4.1 PRINCIPLE OF CONFIGURATION SELECTION ........................................................................ 9 4.2 TEST OPERATION AND TEST SOFTWARE ............................................................................ 9 4.3 SPECIAL ACCESSORIES AND AUXILIARY EQUIPMENT .......................................................... 9 4.4 COUNTERMEASURES TO ACHIEVE EMC COMPLIANCE ......................................................... 9 4.5 TEST SETUP DIAGRAM .................................................................................................... 10 5. TEST RESULTS ............................................................................................................... 12 5.1 TRANSMITTER REQUIREMENT & TEST SUITES .................................................................. 12 5.1.1 Antenna Requirement ..........................................................…

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ATTACHMENT Photo Documentation Report No.: 15078515 001 Rev. 0 Page 1 of 4 Conducted ATTACHMENT Photo Documentation Report No.: 15078515 001 Rev. 0 Page 2 of 4 Radiated ATTACHMENT Photo Documentation Report No.: 15078515 001 Rev. 0 Page 3 of 4 CE ATTACHMENT Photo Documentation Report No.: 15078515 001 Rev. 0 Page 4 of 4