Y38TE7010modlet IQ

© Copy Right 2012, LITE-ON Technology and Thinkeco Inc. Page 1 Product Requirement Document (PRD) For ZigBee Module (DVT) LITEON code name: WZ401F Version 0.12 Date: December 18th, 2012 Lite-On Technology Thinkeco Inc 720 S. Hillview Drive 148 Madison Ave Milpitas, CA 95035 New York, NY 10016 © Copy Right 2012, LITE-ON Technology and Thinkeco Inc. Page 2 Revision History Version Date Author Changes from Previous Version 0.01 8/08/2012 Stanley Wang Initial Draft 0.02 8/20/2012 ThinkEco Draft review 0.03 8/21/2012 ThinkEco Added details, removed 4Mbit SPI serial flash 0.04 8/29/2012 ThinkEco Updates to align with design choices 0.05 8/30/2012 ThinkEco added logistics info, product names and SKU codes 0.06 9/10/2012 ThinkEco Updated chapters 4,5,6 0.07 9/12/2012 Eddie.ZG.Chen Change LITEON code name; Change RX sensitivity from -96dBm to -94dBm; Attach a correct picture in chapter 2.4 mechanical; 0.08 0.09 9/12/2012 9/18/2012 Thinkeco LITEON IC certification as mandatory, updated label template Modify chapter 2.1 0.10 9/18/2012 Thinkeco Assigned different PN to the device with or without on- board antenna 0.11 9/18/2012 LITEON Renumbered 3.10 & 3.11 to 3.1 & 3.1, and 6.1~6.4 to 8.1~8.4; revised sec. 2.2.1 Appendix 5.2 to Appendix 8.2; revised sec. 2.2.2 Appendix 5.1 to Appendix 8.1 0.12 12/18/2012 LITEON Add description for chapter 1; Add remark in section 2.2.1; © Copy Right 2012, LITE-ON Technology and Thinkeco Inc. Page 3 Contents 1. Purpose and Scope ................................................................................................................................ 4 2. Product Requirements .......................................................................................................................... 4 2.1 Block Diagram ............................................................................................................................... 4 2.2 Requirements ................................................................................................................................ 4 2.3 External Connections .................................................................................................................... 5 2.4 Mechanical .................................................................................................................................... 6 3. Product PN ........................................................................................................ 錯誤! 尚未定義書籤。 3.1 Module with on-board chip antenna ........................................................ 錯誤! 尚未定義書籤。 3.2 Module with off-board antenna ............................................................... 錯誤! 尚未定義書籤。 4. Software ................................................................................................................................................ 6 5. Manufacturing Testing Process ............................................................................................................. 8 6. Preproduction run ................................................................................................................................. 8 7. Packaging .............................................................................................................................................. 8 8. Appendix ............................................................................................................................................... 9 8.1 Crystal Spec ......................................................................................................................................... 9 8.2 RF Electrical Characteristics ................................................................................................................ 9 8.3 RF Electrical Interface See ................................................................................................................... 9 8.4 Documentation ................................................................................................................................... 9 © Copy Right 2012, LITE-ON Technology and Thinkeco Inc. Page 4 1. Purpose and Scope The purpose of this document is to establish the product requirements for the standard range ZigBee module. WZ401F-DVT has two SKUs, please see below description.  Basic SKU:  Equips off-board antenna;  Be deployed on GTWY;  Be certified by FCC;  RD SKU:  Equip Johansson 2450AT18A100 antenna,  For RD purpose; 2. Product Requirements 2.1 Block Diagram Fig. 1 WZ401F-DVT The GPIO interface of the module is specified in Sec.2.3 below. On-board chip antenna or off-board antenna can be selected when manufacture. If off-board antenna is used, chip antenna will not be mounted, and vice versa. 2.2 Requirements 2.2.1 RF Requirements (3.3V at 25°C)  Transmit power will be configured through firmware to 3dBm (typical) © Copy Right 2012, LITE-ON Technology and Thinkeco Inc. Page 5  Receiver sensitivity -94 dBm (typical at 1% PER for 20 byte packets) (for RD SKU) o LITEON suggest RX sensitivity to be -94dBm, the reason as below: o -96dBm is the criterion for MC13224; o WZ401F (normal range) add a connector; o Trace is changed because we have to consider the shielding case;  Outdoor line of sight range 300m (1% PER for 20 byte packets) (for RD SKU)  Ceramic antenna shall be matched for return loss better 10dB over 2.4...2.5(for RD SKU)  LITEON shall characterize the module radiation pattern in the 3 orthogonal planes XY, XZ and YZ. (for RD SKU)  See additional MC1322x RF specifications in Appendix 8.2 2.2.2 Reference crystal requirements * See MC1322x specification in Appendix 8.1 2.2.3 Regulatory Compliance * FCC Part 15.247 module certification * CE (Optional) * IC 2.2.4 Environmental * Operating Temperature: -40°C to +85°C * Humidity: 15% to 80% non-condensing * RoHS * WEEE 2.3 External Connections  UART1 (RTS, CTS, RX, TX)  UART2 (RX, TX)  I2C (SDA, SCL)  SPI (SCK, MISO, MOSI, SS)  TMR (TMR0, TMR1, TMR2,…

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RF_160, Issue 03 ThinkEco Inc. Declaration of Authorization We Name: ThinkEco Inc. Address: 148 Madison Avenue, 8th Floor, New York, NY, United States, 10016 City: New York  .  Country: United States  Declare that: Name Representative of agent: Gene Chang (1) Agent Company name: QuieTek Corp. Address: Fl.2, No.345, Xin-hu 2 nd Rd., Nei-hu District City: Taipei Country Taiwan is authorized to apply for Certification of the following product(s): Product description: modlet IQ Type designation: TE7010 Trademark: Thinkeco Inc. on our behalf. Date:  2013/01/16  .  . City:  New York  Name:  Peter Mayer  . (2) Function:  VP Research & Development  Signature: Notes: (1): Required for FCC application (2): For FCC it must be the Grantee Code “owner” or the authorized agent.

Report No.: 131305R-RFUSP42V01 Page : 1 of 5 Attachment 2 : EUT Detailed Photographs (1) EUT Photo (Antenna Type: Chip) (2) EUT Photo (Antenna Type: Chip) Report No.: 131305R-RFUSP42V01 Page : 3 of 5 (5) EUT Photo (Antenna Type: PIFA) (6) EUT Photo (Antenna Type: PIFA)

ThinkEco Inc. FCC ID.: Y38TE7010 148 Madison Avenue, 8th Floor, New York, NY, United States,10016.Tel : 212-684-2959 FCC ID Label

ThinkEco Inc. FCC ID.: Y38TE7010 148 Madison Avenue, 8th Floor, New York, NY, United States,10016.Tel : 212-684-2959 The FCC ID Label will be placed on the equipment as shown in the photograph below.

Report No.: 131305R-RFUSP42V01 Page : 2 of 5 (3) EUT Photo (Antenna Type: Chip) (4) EUT Photo (Antenna Type: Chip) Report No.: 131305R-RFUSP42V01 Page : 4 of 5 (7) EUT Photo (Antenna Type: PIFA) (8) EUT Photo (Antenna Type: PIFA) Report No.: 131305R-RFUSP42V01 Page : 5 of 5 (9) EUT Photo (10) EUT Photo

Report No. 131305R-RFUSP42V01 Page: 1 of 4 RF Exposure Evaluation declaration Product Name modlet IQ Model No. TE7010 FCC ID Y38TE7010 Applicant ThinkEco Inc. Address 148 Madison Avenue, 8th Floor, New York, NY, United States,10016 Date of Receipt Jan, 15. 2013 Date of DeclarationJan, 16, 2013 Report No. 131305R-RFUSP42V01 The declaration results relate only to the samples calculated. The declaration shall not be reproduced except in full without the written approval of QuieTek Corporation. This report must not be used to claim product endorsement by NVLAP any agency of the U.S. Government Report No. 131305R-RFUSP42V01 Page: 2 of 4 1. RF Exposure Evaluation 1.1. Limits According to FCC 1.1310: The criteria listed in the following table shall be used to evaluate the environment impact of human exposure to radio frequency (RF) radiation as specified in 1.1307(b) LIMITS FOR MAXIMUM PERMISSIBLE EXPOSURE (MPE) Frequency Range (MHz) Electric Field Strength (V/m) Magnetic Field Strength (A/m) Power Density (mW/cm 2 ) Average Time (Minutes) (A) Limits for Occupational/ Control Exposures 300-1500 -- -- F/300 6 1500-100,000 -- -- 5 6 (B) Limits for General Population/ Uncontrolled Exposures 300-1500 -- -- F/1500 6 1500-100,000 -- -- 1 30 F= Frequency in MHz Friis Formula Friis transmission formula: Pd = (Pout*G)/(4*pi*r 2 ) Where Pd = power density in mW/cm 2 Pout = output power to antenna in mW G = gain of antenna in linear scale Pi = 3.1416 R = distance between observation point and center of the radiator in cm Pd id the limit of MPE, 1 mW/cm 2 . If we know the maximum gain of the antenna and the total power input to the antenna, through the calculation, we will know the distance r where the MPE limit is reached. 1.2. Test Procedure Software provided by client enabled the EUT to transmit and receive data at lowest, middle and highest channel individually. The temperature and related humidity: 18°Cand 78％ RH. Report No. 131305R-RFUSP42V01 Page: 3 of 4 1.3. Test Result of RF Exposure Evaluation Product : modlet IQ Test Item : RF Exposure Evaluation Test Site : No.3 OATS Operation Frequency 2405~2475MHz Maximum Conducted output power 1.12dBm Antenna gain 0.5dBi Output Power Into Antenna & RF Exposure Evaluation Distance: Output Power to Antenna (mW) Power Density at R = 20 cm (mW/cm2) 1.2942 0.000289 Power density in column 4 is much lower than the limit (1 mW/cm 2 ).

Report No. 131305R-RFUSP42V01 Page: 1 of 4 RF Exposure Evaluation declaration Product Name modlet IQ Model No. TE7010 FCC ID Y38TE7010 Applicant ThinkEco Inc. Address 148 Madison Avenue, 8th Floor, New York, NY, United States,10016 Date of Receipt Jan, 15. 2013 Date of DeclarationJan, 16, 2013 Report No. 131305R-RFUSP42V01 The declaration results relate only to the samples calculated. The declaration shall not be reproduced except in full without the written approval of QuieTek Corporation. This report must not be used to claim product endorsement by NVLAP any agency of the U.S. Government Report No. 131305R-RFUSP42V01 Page: 2 of 4 1. RF Exposure Evaluation 1.1. Limits According to FCC 1.1310: The criteria listed in the following table shall be used to evaluate the environment impact of human exposure to radio frequency (RF) radiation as specified in 1.1307(b) LIMITS FOR MAXIMUM PERMISSIBLE EXPOSURE (MPE) Frequency Range (MHz) Electric Field Strength (V/m) Magnetic Field Strength (A/m) Power Density (mW/cm 2 ) Average Time (Minutes) (A) Limits for Occupational/ Control Exposures 300-1500 -- -- F/300 6 1500-100,000 -- -- 5 6 (B) Limits for General Population/ Uncontrolled Exposures 300-1500 -- -- F/1500 6 1500-100,000 -- -- 1 30 F= Frequency in MHz Friis Formula Friis transmission formula: Pd = (Pout*G)/(4*pi*r 2 ) Where Pd = power density in mW/cm 2 Pout = output power to antenna in mW G = gain of antenna in linear scale Pi = 3.1416 R = distance between observation point and center of the radiator in cm Pd id the limit of MPE, 1 mW/cm 2 . If we know the maximum gain of the antenna and the total power input to the antenna, through the calculation, we will know the distance r where the MPE limit is reached. 1.2. Test Procedure Software provided by client enabled the EUT to transmit and receive data at lowest, middle and highest channel individually. The temperature and related humidity: 18°Cand 78％ RH. Report No. 131305R-RFUSP42V01 Page: 3 of 4 1.3. Test Result of RF Exposure Evaluation Product : modlet IQ Test Item : RF Exposure Evaluation Test Site : No.3 OATS Operation Frequency 2405~2475MHz Maximum Conducted output power 3.44dBm Antenna gain 2.69dBi Output Power Into Antenna & RF Exposure Evaluation Distance: Output Power to Antenna (mW) Power Density at R = 20 cm (mW/cm2) 2.2080 0.000816 Power density in column 4 is much lower than the limit (1 mW/cm 2 ).

Report No. 131305R-RFUSP42V01 Page: 1 of 76 Test Report Product Name modlet IQ Model No TE7010 FCC ID. Y38TE7010 Applicant ThinkEco Inc. Address 148 Madison Avenue, 8th Floor, New York, NY, United States,10016 Date of Receipt Jan, 15. 2013 Issue Date Jan. 16, 2013 Report No. 131305R-RFUSP42V01 Report Version V1.0 The test results relate only to the samples tested. The test report shall not be reproduced except in full without the written approval of QuieTek Corporation. This report must not be used to claim product endorsement by NVLAP any agency of the U.S. Government Report No. 131305R-RFUSP42V01 Page: 2 of 76 Test Report Certification Issue Date: Jan. 16, 2013 Report No.: 131305R-RFUSP42V01 Product Name modlet IQ Applicant ThinkEco Inc. Address 148 Madison Avenue, 8th Floor, New York, NY, United States,10016 Manufacturer DONG GUAN G-COM COMPUTER CO., LTD Model No. TE7010 EUT Rated Voltage DC 3.3V EUT Test Voltage AC 120V/ 60Hz Trade Name Thinkeco Inc. Applicable Standard FCC CFR Title 47 Part 15 Subpart C: 2012 ANSI C63.4: 2003, ANSI C63.10: 2009 Test Result Complied The test results relate only to the samples tested. The test report shall not be reproduced except in full without the written approval of QuieTek Corporation. This report must not be used to claim product endorsement by NVLAP any agency of the U.S. Government Documented By : ( Senior Engineering Adm. Specialist / Anita Chou ) Tested By : (Engineer / Alan Chen ) Approved By : ( Manager / Vincent Lin) Accredited by NIST (NVLAP) NVLAP Lab Code: 200533-0 Report No. 131305R-RFUSP42V01 Page: 3 of 76 TABLE OF CONTENTS Description Page 1. GENERAL INFORMATION .....................................................................................................5 1.1. EUT Description............................................................................................................................5 1.2. Operational Description ................................................................................................................6 1.3. Tested System Details....................................................................................................................7 1.4. Configuration of Tested System ....................................................................................................7 1.5. EUT Exercise Software .................................................................................................................7 1.6. Test Facility ...................................................................................................................................8 2. Conducted Emission....................................................................................................................9 2.1. Test Equipment..............................................................................................................................9 2.2. Test Setup ......................................................................................................................................9 2.3. Limits ..........................................................................................................................................10 2.4. Test Procedure .............................................................................................................................10 2.5. Uncertainty ..................................................................................................................................10 2.6. Test Result of Conducted Emission.............................................................................................11 3. Peak Power Output ...................................................................................................................15 3.1. Test Equipment............................................................................................................................15 3.2. Test Setup ....................................................................................................................................15 3.3. Limits ..........................................................................................................................................15 3.4. Test Procedure .............................................................................................................................15 3.5. Uncertainty ..................................................................................................................................15 3.6. Test Result of Peak Power Output...............................................................................................16 4. Radiated Emission .....................................................................................................................18 4.1. Test Equipment............................................................................................................................18 4.2. Test Setup ....................................................................................................................................19 4.3. Limits ..........................................................................................................................................20 4.4. Test Procedure .............................................................................................................................20 4.5. Uncertainty ..................................................................................................................................20 4.6. Test Result of Radiated Emission................................................................................................21 5. RF antenna conducted test........................................................................................................29 5.1. Test Equipment............................................................................................................................29 5.2. Test Setup ....................…

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Report No.: 131305R-RFUSP42V01 Page : 1 of 7 Attachment 1: EUT Test Setup Photographs Front View of Conducted Test (Antenna Type: Chip) Back View of Conducted Test (Antenna Type: Chip) Report No.: 131305R-RFUSP42V01 Page : 2 of 7 Front View of Radiated Test (Antenna Type: Chip) Back View of Radiated Test (Antenna Type: Chip) Report No.: 131305R-RFUSP42V01 Page : 3 of 7 Front View of Radiated Test (Horn) (Antenna Type: Chip) Back View of Radiated Test (Horn) (Antenna Type: Chip) Report No.: 131305R-RFUSP42V01 Page : 4 of 7 Configuration of tested System (Antenna Type: Chip) Front View of Conducted Test (Antenna Type: PIFA) Report No.: 131305R-RFUSP42V01 Page : 5 of 7 Back View of Conducted Test (Antenna Type: PIFA) Front View of Radiated Test (Antenna Type: PIFA) Report No.: 131305R-RFUSP42V01 Page : 6 of 7 Back View of Radiated Test (Antenna Type: PIFA) Front View of Radiated Test (Horn) (Antenna Type: PIFA) Report No.: 131305R-RFUSP42V01 Page : 7 of 7 Back View of Radiated Test (Horn) (Antenna Type: PIFA) Configuration of tested System (Antenna Type: PIFA)